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    • 10. 发明授权
    • Process for forming a semiconductive thin film containing a junction
    • 用于形成含有结的半导体薄膜的工艺
    • US5747427A
    • 1998-05-05
    • US638286
    • 1996-04-26
    • Norio HommaTadataka Morishita
    • Norio HommaTadataka Morishita
    • H01L39/22H01L39/24C23C14/34
    • H01L39/225H01L39/2496
    • Disclosed is a method of forming a thin junction film including a first thin oxide flilm presenting a superconductivity and second thin oxide film presenting an insulator properties or possibly semiconductive properties with an improved production efficiency as well as improved film quality and characteristics. Employed are first and second targets each having substantially the same chemical composition excepting oxygen content. The first target is sputtered at a target cathode voltage of minus 100 V by the use of voltage derived from an external D.C. voltage source, thereby forming a first thin oxide film. Subsequently, the target is changed over to the second target while changing the target cathode voltage into self-bias voltage of minus 50 V without any change of the other film formation conditions. Through this change-over, the sputtering of the first target is successively followed by the sputtering of the second target without any interruption of time, to consequently form the second thin oxide film onto the first thin oxide film.
    • 公开了一种形成薄接合膜的方法,该薄接合膜包括具有超导性的第一薄氧化物薄膜和具有提高的生产效率以及改进的薄膜质量和特性的具有绝缘体性质或可能的半导体性质的第二薄氧化物薄膜。 使用的是除了氧含量之外具有基本上相同的化学组成的第一和第二靶。 通过使用从外部直流电压源得到的电压,将第一靶溅射在负100V的目标阴极电压,从而形成第一薄氧化膜。 随后,在将目标阴极电压改变为负50V的自偏压的同时将目标切换到第二目标,而不会改变其它成膜条件。 通过这种转换,第一靶的溅射依次是第二靶的溅射而不时间的中断,从而在第一薄氧化膜上形成第二薄氧化膜。