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1. 发明授权

US07304658B2 Thermal printer and method for correcting the energizing time data for heating elements in the thermal printer 失效
标题翻译：热敏打印机和用于校正热敏打印机中加热元件的通电时间数据的方法
公开(公告)号：US07304658B2
公开(公告)日：2007-12-04
申请号：US11294606
申请日：2005-12-06
申请人： Tadahiro Naito , Yutaka Noda
发明人： Tadahiro Naito , Yutaka Noda
IPC分类号： B41J2/36
CPC分类号： B41J2/365
摘要： A thermal printer comprises: a ROM 11 for storing a heat history correction table; a RAM 12 for storing the density-related energizing time data for the first and second preceding lines printed immediately before the current line to be printed and the density-related energizing time data before a correction for the current line to be printed which includes a target dot T; and a control section for comparing the density-related energizing time data for the first and second preceding lines and the density-related energizing time data before a correction for both adjacent dots T1 and T2 of the target dot T with the density-related energizing time data before a correction for the target dot T to select reference data, and further for performing a corrective operation for the pre-correction energizing time data for the target dot T using thus selected reference data to calculate energizing time data for the target dot T to be printed, whereby it is possible to prevent the temperature of a thermal head from being reduced excessively.
摘要翻译：热敏打印机包括：用于存储热历史校正表的ROM11; 用于存储紧接在要打印的当前行之前打印的第一和第二行之前的密度相关通电时间数据的RAM 12和包括目标的当前打印行的校正之前的浓度相关通电时间数据点T 以及控制部分，用于比较与目标点T的相邻点T 1和T 2的校正之前的第一和第二行的密度相关的通电时间数据和密度相关的通电时间数据与密度相关在对目标点T进行校正之前激励时间数据以选择参考数据，并且还使用这样选择的参考数据对目标点T的预校正通电时间数据进行校正操作，以计算目标点的通电时间数据 T，从而可以防止热头的温度过度降低。

2. 发明申请

US20070273745A1 Image Generating Apparatus 失效
标题翻译：图像发生装置
公开(公告)号：US20070273745A1
公开(公告)日：2007-11-29
申请号：US11752679
申请日：2007-05-23
申请人： Yutaka Noda
发明人： Yutaka Noda
IPC分类号： B41J32/00
CPC分类号： B41J29/02 , B41J25/316 , B41J29/17 , B41J29/38
摘要： This image generating apparatus comprises an ink sheet cartridge storing an ink sheet. When sensing arrival of the rear end of the ink sheet, the image generating apparatus cleans the print head by rotating the print head between a printing position and a nonprinting position (separate position) thereby dropping foreign matter adhering to the print head onto the ink sheet.
摘要翻译：该图像生成装置包括存储墨纸的墨纸盒。当感测墨纸的后端的到达时，图像生成装置通过在打印位置和非打印位置（分离位置）之间旋转打印头来清洁打印头，从而将附着到打印头的异物掉落到墨纸上。

3. 发明申请

US20060204307A1 Image forming device and image forming method 失效
标题翻译：图像形成装置和图像形成方法
公开(公告)号：US20060204307A1
公开(公告)日：2006-09-14
申请号：US11362849
申请日：2006-02-28
申请人： Yutaka Noda
发明人： Yutaka Noda
IPC分类号： B41J35/28
CPC分类号： B41J35/36 , B41J35/16
摘要： A method of forming an image on a transfer sheet based on electronic data uses an image forming device and an ink ribbon cartridge. An ink ribbon of the ink ribbon cartridge has a plurality of ink films formed thereon with boundary lines being provided between the ink films. In the image forming method, the ink ribbon of the ink ribbon cartridge is conveyed when the power to the image forming device is turned on and the ink ribbon cartridge is installed in the image forming device and before the user inputs the image forming instruction. While the ink ribbon of the ink ribbon cartridge is conveyed, it is determined with a boundary line detecting unit whether at least one of the boundary lines formed on the ink ribbon has reached a predetermined position in the image forming device.
摘要翻译：基于电子数据在转印纸上形成图像的方法使用图像形成装置和色带盒。墨带盒的墨带具有形成在其上的多个油墨膜，边缘线设置在墨膜之间。在图像形成方法中，当图像形成装置的电源打开并且色带盒安装在图像形成装置中并且在用户输入图像形成指令之前，墨带盒的墨带被传送。当输送色带盒的色带时，用边界线检测单元确定形成在色带上的至少一条边界线是否已经到达图像形成装置中的预定位置。

4. 发明授权

US06893512B2 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06893512B2
公开(公告)日：2005-05-17
申请号：US10356546
申请日：2003-02-03
申请人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
发明人： Masayuki Kitajima , Tadaaki Shono , Masakazu Takesue , Yutaka Noda
IPC分类号： B23K35/02 , B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/36 , H05K3/3463
摘要： A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.
摘要翻译：具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。由上述焊料合金构成的电气或电子设备的焊接结合体。

5. 发明授权

US06432806B1 Method of forming bumps and template used for forming bumps 失效
标题翻译：形成凸块的方法和用于形成凸块的模板
公开(公告)号：US06432806B1
公开(公告)日：2002-08-13
申请号：US09417770
申请日：1999-10-14
申请人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
发明人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka
IPC分类号： H01L2144
CPC分类号： B23K26/10 , B23K26/382 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/42 , B23K2103/50 , C03C15/00 , C03C23/0025 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15311 , H05K3/002 , H05K3/0029 , H05K3/0055 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/0525 , H05K2203/082 , H05K2203/107 , Y10S438/963 , Y10T29/49144 , H01L2924/00 , H01L2224/05599
摘要： A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.
摘要翻译：公开了一种制造具有通过真空抽吸吸引和支撑导电球的通孔的模板的方法。通过蚀刻形成通孔，并且通过激光束使通孔的侧壁平滑通孔的侧壁。可以使用该方法形成模板和金属凸块。或者，模板可以形成为两层结构。

6. 发明授权

US06361626B1 Solder alloy and soldered bond 有权
标题翻译：焊接合金和焊接焊接
公开(公告)号：US06361626B1
公开(公告)日：2002-03-26
申请号：US09839371
申请日：2001-04-23
申请人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
发明人： Masayuki Kitajima , Hitoshi Homma , Masakazu Takesue , Tadaaki Shono , Yutaka Noda
IPC分类号： C22C1300
CPC分类号： C22C13/00 , B23K35/262 , C22C13/02
摘要： A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
摘要翻译：无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。本发明的焊接键由本发明的焊料合金中的任一种组成。

7. 发明授权

US06320158B1 Method and apparatus of fabricating perforated plate 失效
标题翻译：制造多孔板的方法和装置
公开(公告)号：US06320158B1
公开(公告)日：2001-11-20
申请号：US09231485
申请日：1999-01-14
申请人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka , Fumihiko Tokura
发明人： Masayuki Kitajima , Yutaka Noda , Yoshitaka Muraoka , Fumihiko Tokura
IPC分类号： B23K2638
CPC分类号： B23K26/382 , B23K26/10 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/42 , B23K2103/50 , C03C15/00 , C03C23/0025 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/16 , H01L2224/742 , H01L2224/75 , H01L2224/75745 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/014 , H01L2924/07802 , H05K3/0029 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , H01L2924/00 , H01L2224/05599
摘要： A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.
摘要翻译：在具有电极的芯片上形成凸块的方法。该方法包括使用具有对应于芯片的电极布置的通孔的模板。该模板通过真空抽吸保持在通孔处形成与模板的凸起的导电球。模板的通孔由激光器形成，通过将玻璃板支撑在具有空腔的支撑台上，并且在空腔的位置处用激光束照射该板。

8. 发明申请

US20110163152A1 METHOD OF FORMING SOLDER DAM 审中-公开
标题翻译：形成焊接机的方法
公开(公告)号：US20110163152A1
公开(公告)日：2011-07-07
申请号：US12974576
申请日：2010-12-21
申请人： Masayuki KITAJIMA , Yutaka NODA , Hidehiko KOBAYASHI , Toshihiro KUSAGAYA , Kazuhiro MIZUKAMI
发明人： Masayuki KITAJIMA , Yutaka NODA , Hidehiko KOBAYASHI , Toshihiro KUSAGAYA , Kazuhiro MIZUKAMI
IPC分类号： B23K1/20
CPC分类号： B23K1/0016 , B23K1/20 , B23K2101/38
摘要： A method of forming a solder dam on a lead of an electronic component includes forming the looped solder dam surrounding a target lead, to which the solder dam is to be formed, of a plurality of leads connected to the electronic component, by fitting a C-shaped fitted member to the target lead at a predetermined location.
摘要翻译：在电子部件的引线上形成焊料坝的方法包括：通过安装C电极，形成围绕要连接到电子部件的多个引线围绕要形成焊锡的目标引线的环形焊料坝形状的装配构件在预定位置处到目标引线。

9. 发明授权

US07691662B2 Optical module producing method and apparatus 有权
标题翻译：光模块的制造方法和装置
公开(公告)号：US07691662B2
公开(公告)日：2010-04-06
申请号：US11703699
申请日：2007-02-08
申请人： Toru Okada , Masanao Fujii , Yutaka Noda
发明人： Toru Okada , Masanao Fujii , Yutaka Noda
IPC分类号： H01L21/00
CPC分类号： H05K3/303 , H01L27/14643 , H01L27/14683 , H01L27/148 , H01L31/0203 , H05K3/3494 , H05K2201/09781 , H05K2201/10121 , H05K2201/10727 , H05K2203/0195 , H05K2203/082 , H05K2203/111 , Y02P70/613
摘要： An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.
摘要翻译：通过涂覆相对于具有设置有端子焊盘和着陆焊盘的衬底的衬底的衬底，通过涂覆在端子焊盘上的焊料材料，使用着陆层将具有端子的光学元件封装和平坦顶表面安装在衬底上来制造光学模块衬垫，使得顶表面变得大致平行于衬底表面，并且在光学元件封装的底表面和衬底表面之间形成间隙，同时预热端子焊盘作为安装，并且将端子焊盘电连接到相应的端子通过熔化焊料材料，然后硬化焊料材料。

10. 发明申请

US20080296266A1 PROCESSING APPARATUS 审中-公开
标题翻译：加工设备
公开(公告)号：US20080296266A1
公开(公告)日：2008-12-04
申请号：US12125602
申请日：2008-05-22
申请人： Toru Okada , Yutaka Noda , Seiichi Shimoura
发明人： Toru Okada , Yutaka Noda , Seiichi Shimoura
IPC分类号： B23K3/04 , B23K1/00
CPC分类号： B23K3/027
摘要： A processing head is supported for pivotal movement around a pivot point in a processing apparatus. An urging member applies an urging force to the processing head at the pivot point. The processing apparatus allows establishment of point contact between the urging member and the processing head. When the surface of an object inclines from a predetermined attitude, the processing head is allowed to follow the inclination of the surface. The processing head is allowed to establish a predetermined attitude relative to the surface of the object. The processing head thus reliably enables a predetermined action to the object as desired.
摘要翻译：处理头被支撑以围绕处理装置中的枢转点枢转运动。推动构件在枢转点处向加工头施加推动力。处理装置允许在推动构件和处理头之间建立点接触。当物体的表面从预定姿态倾斜时，允许处理头跟随表面的倾斜。允许处理头相对于物体的表面建立预定的姿态。因此，处理头能够根据需要可靠地实现对物体的预定动作。

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