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    • 3. 发明申请
    • LED package structure and manufacturing process thereof
    • LED封装结构及其制造工艺
    • US20110089461A1
    • 2011-04-21
    • US12662727
    • 2010-04-30
    • Yin-Cheng CHAOYu-Bing LANPei-Hsuan LANJui-Hung CHEN
    • Yin-Cheng CHAOYu-Bing LANPei-Hsuan LANJui-Hung CHEN
    • H01L33/62H01L33/64
    • H01L33/642H01L33/32H01L33/62H01L2224/48091H01L2224/48247H01L2924/00014
    • A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.
    • 一种制造LED封装结构的方法包括以下步骤:(A)提供T形散热块和整体材料片,其中T形散热块包括基部和从 所述基座部分,并且其中所述整体材料片包括分别从所述侧框架的两个相对的内侧延伸的侧框架和一对电极引线框架; (B)在所述基部的上表面上形成绝缘层; (C)将电极引线框架设置在绝缘层上; 和(D)在所述T形散热块周围形成绝缘外框,其中所述绝缘层被包封在所述绝缘外框架中,并且所述散热块的所述基部的一部分暴露于所述绝缘外框架 。 因此,LED封装结构可以提高耐电压和绝缘性。
    • 4. 发明授权
    • LED package structure and manufacturing process thereof
    • LED封装结构及其制造工艺
    • US08143633B2
    • 2012-03-27
    • US12662727
    • 2010-04-30
    • Yin-Cheng ChaoYu-Bing LanPei-Hsuan LanJui-Hung Chen
    • Yin-Cheng ChaoYu-Bing LanPei-Hsuan LanJui-Hung Chen
    • H01L33/00
    • H01L33/642H01L33/32H01L33/62H01L2224/48091H01L2224/48247H01L2924/00014
    • A process for manufacturing an LED package structure includes the following steps: (A) providing a T-shaped heat-sink block and an integral material sheet, wherein the T-shaped heat-sink block includes a base portion and a rise portion extending from the base portion, and wherein the integral material sheet includes a side frame and a pair of electrode lead frames extending, respectively, from two opposite internal sides of the side frame; (B) forming an insulating layer on an upper surface of the base portion; (C) disposing the electrode lead frames on the insulating layer; and (D) forming an insulating outer frame around the T-shaped heat-sink block, wherein the insulating layer is enveloped in the insulating outer frame, and part of the base portion of the heat-sink block exposes out of the insulating outer frame. As a result, the LED package structure can improve voltage resistance and insulation.
    • 一种制造LED封装结构的方法包括以下步骤:(A)提供T形散热块和整体材料片,其中T形散热块包括基部和从 所述基座部分,并且其中所述整体材料片包括分别从所述侧框架的两个相对的内侧延伸的侧框架和一对电极引线框架; (B)在所述基部的上表面上形成绝缘层; (C)将电极引线框架设置在绝缘层上; 和(D)在所述T形散热块周围形成绝缘外框,其中所述绝缘层被包封在所述绝缘外框架中,并且所述散热块的所述基部的一部分暴露于所述绝缘外框架 。 因此,LED封装结构可以提高耐电压和绝缘性。
    • 6. 发明申请
    • LED package structure
    • LED封装结构
    • US20100230695A1
    • 2010-09-16
    • US12656867
    • 2010-02-18
    • Yu-Bing LanPei-Hsuan Lan
    • Yu-Bing LanPei-Hsuan Lan
    • H01L33/52
    • H01L33/56H01L33/507H01L33/54
    • An LED package structure includes an LED chip, an internal transparent colloidal layer, a fluorescent colloidal layer, and an external transparent colloidal layer. The internal transparent colloidal layer is interposed between the LED chip (such as a blue-light LED chip) and the fluorescent colloidal layer (such as a yellow fluorescent colloidal layer), and that the external transparent colloidal layer, in cooperation with the internal transparent colloidal layer, sandwiches and envelops the fluorescent colloidal layer so as to lower the possibility that light emitted from the LED chip may be absorbed by the LED chip itself because the light is scattered backward by particles of the fluorescent powder. This will increase overall lumen output and decrease thermal energy of the LED chip, and will as well provide a more desirable moisture insulation for the fluorescent powder.
    • LED封装结构包括LED芯片,内部透明胶体层,荧光胶体层和外部透明胶体层。 内部透明胶体层插入在LED芯片(如蓝光LED芯片)和荧光胶体层(如黄色荧光胶体层)之间,外部透明胶体层与内部透明胶体层 胶体层,三明治和包围荧光胶体层,以便降低由LED芯片本身吸收的光可能被LED芯片本身吸收的可能性,因为光被荧光粉末的颗粒向后散射。 这将增加总体流明输出并降低LED芯片的热能,并且还将为荧光粉提供更理想的保湿性。
    • 7. 发明申请
    • AC LED device for avoiding harmonic current and flash
    • 交流LED设备,用于避免谐波电流和闪光
    • US20110018449A1
    • 2011-01-27
    • US12588328
    • 2009-10-13
    • Pei-Hsuan LanJui-Hung ChenJen-Hua YangYu-Bing Lan
    • Pei-Hsuan LanJui-Hung ChenJen-Hua YangYu-Bing Lan
    • H05B37/02
    • H05B33/0809
    • An AC LED device for avoiding harmonic current and flash includes an AC power input terminal, a first AC LED group and a second AC LED group. The AC power input terminal receives an AC power including a positive half-cycle and a negative half-cycle. The first AC LED group is turned on in the positive half-cycle and turned off in the negative half-cycle. The second AC LED group is turned on in the negative half-cycle and turned off in the positive half-cycle. Each of the first AC LED group and the second AC LED group has an overall on voltage with a value lower than a peak voltage value of the AC power by a predetermined value, and an overall peak inverse voltage with a value higher than the peak voltage value of the AC power, so as to increase power factor and avoid harmonic current, thereby effectively eliminating flash problems of the AC LED.
    • 用于避免谐波电流和闪光的AC LED装置包括AC电力输入端子,第一AC LED组和第二AC LED组。 交流电源输入端子接收包括正半周期和负半周期的交流电力。 第一个交流LED组在正半周期打开,在负半周期关闭。 第二个交流LED组在负半周期打开,在正半周期中关闭。 第一AC LED组和第二AC LED组中的每一个具有的值小于AC电力的峰值电压值的总导通电压达预定值,并且具有高于峰值电压的值的总峰值反向电压 交流电源的值,从而提高功率因数,避免谐波电流,从而有效消除交流LED的闪光问题。