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    • 4. 发明申请
    • NITRIDE SEMICONDUCTOR LASER DEVICE AND METHOD FOR FABRICATION THEREOF
    • 氮化物半导体激光器件及其制造方法
    • US20080080578A1
    • 2008-04-03
    • US11877551
    • 2007-10-23
    • Takeshi KamikawaYoshika Kaneko
    • Takeshi KamikawaYoshika Kaneko
    • H01S5/22
    • H01S5/3202H01L33/20H01L33/32H01S5/0207H01S5/32341H01S2304/12
    • A nitride semiconductor light-emitting device includes a nitride semiconductor substrate of which at least part of a surface is formed from a nitride semiconductor and a nitride film semiconductor growth layer laid on the surface of the nitride semiconductor substrate. A carved region in the shape of a depressed portion may be formed on the surface of the nitride semiconductor substrate. The carved region may have an inverted tapered shape or a tapered shape in cross-section. Alternatively, or additionally, the nitride film semiconductor growth layer may include a gallium nitride film or an aluminum containing gallium nitride film where the nitride film semiconductor growth layer makes contact with the nitride semiconductor substrate. Alternatively, or additionally, the nitride film semiconductor growth layer may include a light-emitting portion formed at a location 20 μm or more away from the carved region.
    • 氮化物半导体发光器件包括氮化物半导体衬底,其氮化物半导体和氮化物半导体生长层的至少一部分表面由氮化物半导体形成,氮化物半导体生长层位于氮化物半导体衬底的表面上。 可以在氮化物半导体衬底的表面上形成凹陷部形状的雕刻区域。 雕刻区域的截面可以具有倒锥形或锥形形状。 或者或另外,氮化物膜半导体生长层可以包括氮化镓膜或含氮化镓膜,其中氮化物膜半导体生长层与氮化物半导体衬底接触。 或者或另外,氮化物膜半导体生长层可以包括形成在距离雕刻区域20m或更远的位置处的发光部分。
    • 10. 发明授权
    • Nitride semiconductor laser device and method for fabrication thereof
    • 氮化物半导体激光器件及其制造方法
    • US07529283B2
    • 2009-05-05
    • US11877551
    • 2007-10-23
    • Takeshi KamikawaYoshika Kaneko
    • Takeshi KamikawaYoshika Kaneko
    • H01S5/00H01L33/00
    • H01S5/3202H01L33/20H01L33/32H01S5/0207H01S5/32341H01S2304/12
    • A nitride semiconductor light-emitting device includes a nitride semiconductor substrate of which at least part of a surface is formed from a nitride semiconductor and a nitride film semiconductor growth layer laid on the surface of the nitride semiconductor substrate. A carved region in the shape of a depressed portion may be formed on the surface of the nitride semiconductor substrate. The carved region may have an inverted tapered shape or a tapered shape in cross-section. Alternatively, or additionally, the nitride film semiconductor growth layer may include a gallium nitride film or an aluminum containing gallium nitride film where the nitride film semiconductor growth layer makes contact with the nitride semiconductor substrate. Alternatively, or additionally, the nitride film semiconductor growth layer may include a light-emitting portion formed at a location 20 μm or more away from the carved region.
    • 氮化物半导体发光器件包括氮化物半导体衬底,其氮化物半导体和氮化物半导体生长层的至少一部分表面由氮化物半导体形成,氮化物半导体生长层位于氮化物半导体衬底的表面上。 可以在氮化物半导体衬底的表面上形成凹陷部形状的雕刻区域。 雕刻区域的截面可以具有倒锥形或锥形形状。 或者或另外,氮化物膜半导体生长层可以包括氮化镓膜或含氮化镓膜,其中氮化物膜半导体生长层与氮化物半导体衬底接触。 或者或另外,氮化物膜半导体生长层可以包括形成在距离雕刻区域20m或更远的位置处的发光部分。