专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10487549B2 Hinge 有权
公开(公告)号：US10487549B2
公开(公告)日：2019-11-26
申请号：US15444344
申请日：2017-02-28
申请人： Hai Fu
发明人： Hai Fu
IPC分类号： E05D3/12 , E05D11/08
CPC分类号： E05D3/122 , E05D11/087 , E05Y2201/26 , E05Y2900/132 , E05Y2900/148
摘要： A hinge used for being installed between a door leaf and a door frame or between a sash and a window frame (7). The hinge includes a gear and rack unit and an inclined draw bar (1). The gear and rack unit is installed on the door frame or window frame (7). A gear (5) is rotatably installed on the door frame or window frame (7). A rack is located on one side of the gear (5). The gear (5) is meshed with the rack. A gear installation portion (51) is arranged on one side of the gear (5). Both ends of the inclined draw bar (1) are installed on the door leaf and door frame or the sash and window frame (7) respectively. According to the present invention, the problem that the existing hinge is unreasonably stressed and prone to damage is effectively solved.

2. 外观设计

USD844215S1 Decorative lighting fixture 有权
公开(公告)号：USD844215S1
公开(公告)日：2019-03-26
申请号：US29631113
申请日：2017-12-27
申请人： ZHU HAI FU YUN LIGHTING INDUSTRIAL CO., LTD.
设计人： Su-Hua Chen
摘要： FIG. 1 is a perspective view of a decorative lighting fixture in accordance to one embodiment of the new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left view thereof;
FIG. 5 is a right view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

3. 发明授权

US10161601B1 Collapsible decorative lamp 有权
公开(公告)号：US10161601B1
公开(公告)日：2018-12-25
申请号：US15900027
申请日：2018-02-20
申请人： Zhu Hai Fu Yun Lighting Industrial Co., Ltd.
发明人： Su-Hua Chen
IPC分类号： F21V1/06 , F21V3/02 , F21V17/00 , F21V21/14 , F21V21/08 , F21S8/06 , F21S9/02 , F21V17/02 , F21Y115/10
摘要： A collapsible decorative lamp including a collapsible frame and a plurality of light strips is disclosed. The collapsible frame includes a plurality of rib stands, a top folding band, a bottom folding band and a plurality of light slots. Each of the plurality of rib stands is shaped as a curved strip. The top folding band includes a plurality of top pivot sheets. The plurality of top pivot sheets are pivotally connected to one another. The plurality of top pivot sheets are rotatable such that the top folding band can appear as a long strip structure or a ring structure. The bottom folding band includes a plurality of bottom pivot sheets. The plurality of bottom pivot sheets are pivotally connected to one another and the plurality of bottom pivot sheets are rotatable such that the bottom folding band appears as a long strip structure or a ring structure.

4. 发明申请

US20090157342A1 METHOD AND APPARATUS OF USING DRIVE TEST DATA FOR PROPAGATION MODEL CALIBRATION 审中-公开
标题翻译：使用驱动测试数据进行传播模型校准的方法和装置
公开(公告)号：US20090157342A1
公开(公告)日：2009-06-18
申请号：US12260847
申请日：2008-10-29
申请人： Yusheng Zhang , Sheng Zhou , Chenguang Wei , Li Zhang , Peng Gao , Wujie Hu , Yanyun Zhu , Wenhua Ma , Pei Zhao , Yaxi Hu , Hongbin Jin , Jing Yuan , Bin Zhang , Hanhui Wei , Hai Fu
发明人： Yusheng Zhang , Sheng Zhou , Chenguang Wei , Li Zhang , Peng Gao , Wujie Hu , Yanyun Zhu , Wenhua Ma , Pei Zhao , Yaxi Hu , Hongbin Jin , Jing Yuan , Bin Zhang , Hanhui Wei , Hai Fu
IPC分类号： G06F19/00
CPC分类号： G06F17/5009 , H04W16/18
摘要： A method using drive test data for propagation model calibration includes: step 1, obtaining original drive test data; step 2, selecting the data from the drive test data according to predefined conditions as effective drive test data; and step 3, extracting the effective drive test data to form a data file used for propagation model calibration. An apparatus using drive test data for propagation model calibration includes: a drive test data obtaining module, configured to obtain the drive test data in the regions to be calibrated; an effective drive test data generation module, configured to generate effective drive test data from the drive test data according to predefined conditions; and a data file generation module, configured to extract the effective drive test data to form a data file used for propagation model calibration. The present invention utilizes drive test data of existing networks to largely decrease the CW test work and reduce the network building cost. It is believed that the calibrated model can relatively accurately reflect the propagation characteristics in the field. Furthermore, base stations can be optimally allocated.
摘要翻译：使用驱动测试数据进行传播模型校准的方法包括：步骤1，获得原始驱动测试数据; 步骤2，根据预定条件从驱动测试数据中选择数据作为有效的驱动测试数据; 并且步骤3，提取有效的驱动测试数据以形成用于传播模型校准的数据文件。使用用于传播模型校准的驱动器测试数据的装置包括：驱动测试数据获取模块，被配置为获得要校准的区域中的驱动测试数据; 有效的驱动测试数据生成模块，被配置为根据预定条件从所述驱动测试数据产生有效的驱动测试数据; 以及数据文件生成模块，被配置为提取有效的驱动测试数据以形成用于传播模型校准的数据文件。本发明利用现有网络的驱动测试数据大大降低了CW测试工作，降低了网络建设成本。相信校准模型可以相对准确地反映现场的传播特性。此外，可以最佳地分配基站。

5. 发明申请

US20080036057A1 SEMICONDUCTOR DEVICE HAVING IMPROVED HEAT DISSIPATION CAPABILITIES 有权
标题翻译：具有改进的散热能力的半导体器件
公开(公告)号：US20080036057A1
公开(公告)日：2008-02-14
申请号：US11836579
申请日：2007-08-09
申请人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
发明人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/36 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L2224/32245 , H01L2924/0002 , H01L2924/13091 , H01L2924/1815 , H01L2924/00
摘要： A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.
摘要翻译：可安装到衬底的半导体器件包括半导体管芯和具有第一和第二端部以及第一附接表面和第二附接表面的导电引线框架。模具与第一附接表面上的引线框架的第一端部电接触。外部暴露的外壳包围半导体管芯和引线框架的第一端部，所述壳体包括面向引线框架的第二附接表面的金属板。

6. 外观设计

USD891678S1 Round double light strip lamp 有权
公开(公告)号：USD891678S1
公开(公告)日：2020-07-28
申请号：US29671398
申请日：2018-11-27
申请人： Zhu Hai Fu Yun Lighting Industrial Co., Ltd.
设计人： Su-Hua Chen
摘要： FIG. 1 is a perspective view of the round double light strip lamp showing the new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left view thereof;
FIG. 5 is a right view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The broken lines shown on the drawings depict portions of the lamp that form no part of the claimed design.

7. 发明授权

US10060586B1 Flameless candle with electromagnetic sway module 有权
公开(公告)号：US10060586B1
公开(公告)日：2018-08-28
申请号：US15807108
申请日：2017-11-08
申请人： ZHU HAI FU YUN LIGHTING INDUSTRIAL CO., LTD.
发明人： Su-Hua Chen , Chi-Shih Lai
IPC分类号： F21S10/04 , F21S6/00
CPC分类号： F21S10/046 , F21S6/001 , F21W2121/00 , F21Y2115/10
摘要： An electric flameless candle is disclosed; the electric flameless candle includes a case, a translucent shell positioning unit, a translucent shell, a light emitting unit, a connecting unit, an electromagnetic sway module, a circuit board and a power unit. The case includes an opening. The translucent shell positioning unit is located at the opening. The translucent shell is located on the translucent shell positioning unit and includes a translucent shell base. The light emitting unit is located on the translucent shell base and in the translucent case. The connecting unit is connected to the translucent shell base. The electromagnetic sway module is located in the case. The electromagnetic sway module includes a metal bar, a metal coil and a metal core. The metal coil is connected to the fixing stand and located under the metal bar. The metal core is located in the metal coil.

8. 外观设计

USD654881S1 Bridge rectifier package with heat sink 有权
标题翻译：桥式整流封装带散热片
公开(公告)号：USD654881S1
公开(公告)日：2012-02-28
申请号：US29359100
申请日：2010-04-06
申请人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
设计人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian

9. 外观设计

USD616387S1 Bridge rectifier package 有权
标题翻译：桥式整流器封装
公开(公告)号：USD616387S1
公开(公告)日：2010-05-25
申请号：US29321381
申请日：2008-07-15
申请人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
设计人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian

10. 发明授权

US08269338B2 Semiconductor device having improved heat dissipation capabilities 有权
标题翻译：具有改善的散热能力的半导体器件
公开(公告)号：US08269338B2
公开(公告)日：2012-09-18
申请号：US11836579
申请日：2007-08-09
申请人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
发明人： Ta-Te Chou , Xiong-Jie Zhang , Xian Li , Hai Fu , Yong-Qi Tian
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/36 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L2224/32245 , H01L2924/0002 , H01L2924/13091 , H01L2924/1815 , H01L2924/00
摘要： A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive lead frame having first and second end portions and a first attachment surface and a second attachment surface. The die electrically contacts the first end portion of the lead frame on the first attachment surface. An externally exposed housing encloses the semiconductor die and the first end portion of the lead frame, said housing including a metallic plate facing the second attachment surface of the lead frame.
摘要翻译：可安装到基板的半导体器件包括半导体管芯和具有第一和第二端部以及第一附接表面和第二附接表面的导电引线框架。模具与第一附接表面上的引线框架的第一端部电接触。外部暴露的外壳包围半导体管芯和引线框架的第一端部，所述壳体包括面向引线框架的第二附接表面的金属板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式