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1. 发明授权

US4488882A Method of embedding hard cutting particles in a surface of a cutting edge of cutting tools, particularly saw blades, drills and the like 失效
标题翻译：在切削刀具的切削刃的表面，特别是锯片，钻头等中嵌入硬切粒子的方法
公开(公告)号：US4488882A
公开(公告)日：1984-12-18
申请号：US487809
申请日：1983-04-22
申请人： Friedrich Dausinger , Werner Muller , Eckart von Roda , Wilbert Reibetanz , Otto Baumann
发明人： Friedrich Dausinger , Werner Muller , Eckart von Roda , Wilbert Reibetanz , Otto Baumann
IPC分类号： B23D65/00 , B23K15/00 , B23K26/00 , B23K26/32 , B23K31/02 , B23K35/32 , B23P15/28 , B24B1/00
CPC分类号： B23K31/025 , B23K35/327 , B23P15/28
摘要： To apply hard cutting particles, for example of tungsten carbide, on the surface of the cutting edge of a cutting tool, such as a saw blade, a drill, or the like, the cutting edge is partially melted by an energy beam, for example a laser beam, or an electron beam. A laser beam is preferred since, then, the process can be carried out in air, or in a protective gas atmosphere, rather than in a vacuum. The beam partially melts the cutting edge and the granules of the hard metal particles, preferably in a random grain size of between 0.3 to 1.5 mm is permitted to run down, over the partially melted surface, excess being collected for reuse; alternatively, the partially melted surface can be dipped into the granules, and permitted to solidify.
摘要翻译：为了将诸如碳化钨的硬切割颗粒施加在诸如锯片，钻头等的切割工具的切割边缘的表面上，切割边缘被能量束部分地熔化，例如激光束或电子束。激光束是优选的，因为该方法可以在空气中或在保护气体气氛中进行，而不是在真空中进行。梁部分地熔化切割边缘，并且允许在0.3至1.5mm之间的随机晶粒尺寸的硬质金属颗粒的颗粒在部分熔融的表面上向下运行，多余的被收集用于再利用; 或者，部分熔融的表面可以浸入颗粒中并允许固化。

2. 发明授权

US4414038A Laser beam surface treatment process for materials of large reflectivity 失效
标题翻译：激光束表面处理工艺的材料具有较大的反射率
公开(公告)号：US4414038A
公开(公告)日：1983-11-08
申请号：US396138
申请日：1982-07-07
申请人： Friedrich Dausinger , Werner Muller , Peter Arnold
发明人： Friedrich Dausinger , Werner Muller , Peter Arnold
IPC分类号： B23K26/00 , B23K26/18 , C21D1/09
CPC分类号： C21D1/09 , B23K26/18 , B23K2203/04
摘要： Directing a laser beam at a surface to be treated, such as a metallic surface which is likely to reflect much of the energy, results in a high proportion of absorbed energy if the laser beam has an oblique incidence, particularly if the laser beam is polarized in a direction parallel to the plane of incidence (defined as the plane which contains the axis of the laser beam and the perpendicular to the surface at the center of the spot of incidence). In the case of iron and steel surfaces the absorbtion is markedly increased at angles of incidence greater than 45.degree. and just short of glancing incidence, with a maximum near 80.degree..
摘要翻译：将激光束定向在待处理的表面，例如可能反射很多能量的金属表面，如果激光束具有倾斜入射，则导致高比例的吸收能量，特别是如果激光束是偏振的在平行于入射平面的方向（被定义为包含激光束轴线的平面和与入射点中心处的表面垂直）的方向上。在钢铁表面的情况下，吸收率大于45°的入射角显着增加，并且短时间内出现短暂的发光，最大接近80°。

3. 发明授权

US06215094B1 Process for determining the instantaneous penetration depth and a machining laser beam into a workpiece, and device for implementing this process 失效
标题翻译：用于确定瞬时穿透深度和将加工激光束加工成工件的过程以及用于实现该过程的装置
公开(公告)号：US06215094B1
公开(公告)日：2001-04-10
申请号：US08619599
申请日：1996-05-28
申请人： Friedrich Dausinger , Juergen Griebsch , Ruediger Hack
发明人： Friedrich Dausinger , Juergen Griebsch , Ruediger Hack
IPC分类号： B23K2600
CPC分类号： B23K26/382 , B23K26/032 , B23K26/0648 , B23K26/0665 , B23K26/244 , B23K26/389 , B23K26/40 , B23K2103/16
摘要： The penetration depth of a machining laser beam into workpiece is continuously monitored in that a measuring laser beam is directed onto the vapor capillary that is generated in the workpiece by the machining laser beam. The portion of the measuring laser beam that re-emerges from the vapor capillary is monitored by a sensor whose output signal is then used to bring about (producing holes) or to adjust (welding or superficial re-melting of a workpiece) the desired penetration depth defined by a pre-selected reference signal
摘要翻译：连续地监视加工激光束到工件中的穿透深度，因为测量激光束通过加工激光束被引导到在工件中产生的蒸气毛细管。从蒸汽毛细管重新出现的测量激光束的部分由传感器监测，传感器的输出信号然后用于产生（产生孔）或调整（焊接或表面再熔化工件）所需的渗透深度由预选参考信号定义

4. 发明授权

US5729568A Power-controlled, fractal laser system 失效
$Power-controlled, fractal laser system$
标题翻译：功率控制，分形激光系统
公开(公告)号：US5729568A
公开(公告)日：1998-03-17
申请号：US655555
申请日：1996-05-30
申请人： Hans Opower , Helmut Huegel , Adolf Giesen , Friedrich Dausinger
发明人： Hans Opower , Helmut Huegel , Adolf Giesen , Friedrich Dausinger
IPC分类号： B23K26/06 , G02B6/04 , G02B6/42 , H01S5/40 , H01S5/42 , H01S3/08
CPC分类号： B23K26/0613 , B23K26/032 , B23K26/06 , B23K26/0604 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0665 , G02B6/4214 , G02B6/4249 , H01S5/4025 , G02B6/04 , H01S5/4012 , H01S5/42 , H01S5/423
摘要： In order to improve a semiconductor laser system with a plurality of semiconductor laser units comprising a laser oscillator, laser radiation exiting from each of these units, a light-conducting fiber associated with each semiconductor laser unit, a coupling element for coupling the laser radiation exiting from the respective semiconductor laser unit into the respective light-conducting fiber, and a fiber bundle comprising the fibers as light conductor system, a total laser radiation formed by the sum of the coherent laser radiation generated by the respective semiconductor laser units exiting from one end of the fiber bundle, this total laser radiation illuminating a target surface on an object to be irradiated during laser activity of all the semiconductor laser units, such that complex irradiation tasks can be performed with this system in a simple and as effective a manner as possible it is suggested that a control be provided for controlling the power of each individual semiconductor laser unit in a defined manner, and that an irradiation of different surface elements of the target surface with an intensity individually definable for each surface element be specifiable to the control.
摘要翻译：为了改进具有包括激光振荡器的多个半导体激光器单元的半导体激光器系统，从这些单元中的每一个排出的激光辐射，与每个半导体激光器单元相关联的导光纤维，用于耦合离开的激光辐射的耦合元件从相应的半导体激光单元到相应的导光纤维，以及包含作为光导体系统的光纤的光纤束，由从一端离开的各个半导体激光器单元产生的相干激光辐射之和形成的总激光辐射的全部激光辐射照射在所有半导体激光器单元的激光活动期间要照射的物体上的目标表面，使得可以以该系统以简单且有效的方式执行复杂的照射任务建议提供用于控制每个单独半导体的功率的控制以定义的方式对激光单元进行激光照射，并且可以将具有对于每个表面元件分别定义的强度的目标表面的不同表面元件的照射指定为该控制。

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