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1. 发明授权

US06966363B2 Heat collector with mounting plate 失效
标题翻译：集热器带安装板
公开(公告)号：US06966363B2
公开(公告)日：2005-11-22
申请号：US10492068
申请日：2002-10-10
申请人： David W Gailus , Donald L. Clemens
发明人： David W Gailus , Donald L. Clemens
IPC分类号： F25D1/00 , F25D9/00 , F28D15/02 , F28F13/00 , H01L23/367 , H01L23/40 , H01L23/427 , H05K7/20 , F28F7/00
CPC分类号： F28F13/00 , F28D15/0275 , H01L23/3677 , H01L23/4006 , H01L23/427 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat collector (50) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame (40) which may be stamped and formed or molded. The heat collector has flanges (53) which bear against retaining tabs (45) formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator (18), or may be formed as a heat sink (56) such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.
摘要翻译：集热器（50）通过至少一个用于减小加工步骤的挤压步骤形成，并被组装到单独形成的可被冲压和成型或模制的安装框架（40）上。集热器具有凸缘（53），该凸缘（53）抵靠形成在安装框架上的固定突片（45），并且可以由焊料，胶水或机械装置保持。集热器可以接收散热器（18），或者可以形成为散热片（56），例如针鳍型散热器。安装框架可以固定到具有诸如与收集器接触的中央处理单元的部件以便冷却单元的印刷电路板等。

2. 再颁专利

USRE35573E Heat sink clip assembly 失效
标题翻译：散热片组件
公开(公告)号：USRE35573E
公开(公告)日：1997-07-29
申请号：US502852
申请日：1990-04-02
申请人： Donald L. Clemens
发明人： Donald L. Clemens
IPC分类号： H01L23/40 , H01L23/34 , F28F7/00 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： Disclosed is a heat sink clip assembly comprising a frame and a clip for securing and aligning a heat sink with an electronic device package. The frame includes a cavity for receiving the electronic device package with the leads thereof exposed for mounting on a printed circuit board or the like. A resilient heat sink clip is removably engaged with a pair of latching members on the perimeter of the frame. The clip includes means for releasably gripping the heat sink. The heat sink is urged by the heat sink clip into intimate thermal contact with the electronic device package for dissipation of heat therefrom.
摘要翻译：公开了一种散热片夹组件，其包括用于固定和对准散热器与电子设备封装的框架和夹子。框架包括用于接收电子器件封装的空腔，其引线暴露以安装在印刷电路板等上。弹性散热器夹可拆卸地与框架周边上的一对闩锁构件接合。夹子包括用于可释放地夹紧散热器的装置。散热片被散热片推动，与电子装置封装紧密地热接触，从而散热。

3. 发明授权

US4745456A Heat sink clip assembly 失效
标题翻译：散热片组件
公开(公告)号：US4745456A
公开(公告)日：1988-05-17
申请号：US905657
申请日：1986-09-11
申请人： Donald L. Clemens
发明人： Donald L. Clemens
IPC分类号： H01L23/40 , H01L23/42
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： Disclosed is a heat sink clip assembly comprising a frame and a clip for securing and aligning a heat sink with an electronic device package. The frame includes a cavity for receiving the electronic device package with the leads thereof exposed for mounting on a printed circuit board or the like. A resilient heat sink clip is removably engaged with a pair of latching members on the perimeter of the frame. The clip includes means for releasably gripping the heat sink. The heat sink is urged by the heat sink clip into intimate thermal contact with the electronic device package for dissipation of heat therefrom.
摘要翻译：公开了一种散热片夹组件，其包括用于固定和对准散热器与电子设备封装的框架和夹子。框架包括用于接收电子器件封装的空腔，其引线暴露以安装在印刷电路板等上。弹性散热器夹可拆卸地与框架周边上的一对闩锁构件接合。夹子包括用于可释放地夹紧散热器的装置。散热片被散热片推动，与电子装置封装紧密地热接触，从而散热。

4. 发明授权

US4961125A Apparatus and method of attaching an electronic device package and a heat sink to a circuit board 失效
标题翻译：将电子器件封装和散热器附接到电路板的装置和方法
公开(公告)号：US4961125A
公开(公告)日：1990-10-02
申请号：US395661
申请日：1989-08-18
申请人： William D. Jordan , Donald L. Clemens
发明人： William D. Jordan , Donald L. Clemens
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： Disclosed are apparatus and methods for attaching an electronic device package and a heat sink to a circuit board or the like. The electronic device package has a body with a planar bottom and leads extending from the body. The distal ends of the leads are coplanar with the bottom of the electronic device package. The heat sink has a base, heat-dissipating fins or the like and a clip for securing the electronic device package to the heat sink. A pair of dimples project downward from the base of the heat sink to tilt the bottom of the electronic device package. Tilting the electronic device package causes the ends of the leads to contact the circuit board so that the leads can be easily soldered to the circuit board. The dimples and the front edge of the heat sink can also be soldered to the circuit board.
摘要翻译：公开了将电子装置封装和散热器附接到电路板等的装置和方法。电子器件封装具有平面底部的本体和从主体延伸的引线。引线的远端与电子器件封装的底部共面。散热器具有基座，散热翅片等，以及用于将电子设备封装固定到散热器的夹子。一对凹坑从散热器的底部向下突出，以倾斜电子设备包装的底部。倾斜电子器件封装导致引线的端部接触电路板，使得引线可以容易地焊接到电路板。散热器的凹坑和前边缘也可以焊接到电路板。

5. 发明授权

US4053140A Fiber reinforced plastic handrail system 失效
标题翻译：纤维增强塑料手柄系统
公开(公告)号：US4053140A
公开(公告)日：1977-10-11
申请号：US681696
申请日：1976-04-29
申请人： Donald L. Clemens , Steven A. Edmiston
发明人： Donald L. Clemens , Steven A. Edmiston
IPC分类号： E04F11/18 , F16B7/04 , E04H17/00
CPC分类号： F16B7/0486 , E04F11/181 , E04F2011/1897 , Y10T403/3926 , Y10T403/4608
摘要： A fiber reinforced, non-corrosive, non-conductive, plastic handrail system having a continuous handrail member secured to a plurality of upright posts by an improved bisectional collar. A midrail member can be secured to the posts by a second bisectional collar as a continuous segment or a linking segment. Such bisectional collars are also used in joints such as for attachment of railings adjacent stairways.

6. 发明授权

US6082440A Heat dissipation system having releasable attachment assembly 失效
标题翻译：散热系统具有可拆卸的连接组件
公开(公告)号：US6082440A
公开(公告)日：2000-07-04
申请号：US19546
申请日：1998-02-06
申请人： Donald L. Clemens , Michael M. Heatly , Matthew C. Smithers , Mark C. Mellinger
发明人： Donald L. Clemens , Michael M. Heatly , Matthew C. Smithers , Mark C. Mellinger
IPC分类号： H01L23/40 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： A heat dissipation system for a heat generating electronic device includes a releasable attachment assembly for removably securing a heat sink to a heat spreader plate thereof includes at least one spring clip for biasing the heat spreader plate into a secured engagement with the heat sink. The spring clips are adapted to allow easy engagement and/or disengagement of the heat sink from the heat spreader plate, thereby facilitating the use of variously configured heat sinks as part of the heat dissipation system.
摘要翻译：一种用于发热电子设备的散热系统包括用于将散热器可移除地固定到其散热板的可释放的附接组件，其包括用于将散热板偏置成与散热器的固定接合的至少一个弹簧夹。弹簧夹适于容易地将散热器与散热板接合和/或脱离，从而便于使用各种配置的散热器作为散热系统的一部分。

7. 发明授权

US5019942A Insulating apparatus for electronic device assemblies 失效
标题翻译：电子设备组件绝缘装置
公开(公告)号：US5019942A
公开(公告)日：1991-05-28
申请号：US162283
申请日：1988-02-29
申请人： Donald L. Clemens
发明人： Donald L. Clemens
IPC分类号： H01L23/40
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： Disclosed are insulating covers for electronic device packages secured to heat sinks by clips. The covers provide minimum predetermined creepage distance between the electronic device packages and the heat sinks upon which they are mounted.
摘要翻译：公开了通过夹子固定到散热器的电子设备封装的绝缘盖。盖子提供了电子设备封装与其安装在其上的散热器之间的最小预定爬电距离。

8. 发明授权

US06178628B2 Apparatus and method for direct attachment of heat sink to surface mount 失效
标题翻译：用于将散热片直接连接到表面安装件的装置和方法
公开(公告)号：US06178628B2
公开(公告)日：2001-01-30
申请号：US09151927
申请日：1998-09-11
申请人： Donald L. Clemens , Mark Mellinger , Gary Kuzmin
发明人： Donald L. Clemens , Mark Mellinger , Gary Kuzmin
IPC分类号： H05K334
CPC分类号： H01L23/3672 , H01L23/4093 , H01L2924/0002 , Y10T29/4913 , Y10T29/49144 , H01L2924/00
摘要： An apparatus and method for thermally coupling a heat sink directly to a surface mount heat generating device package in a manner which provides a more efficient thermal path between the heat sink and the device package, and which allows for a simplified assembly process. The heat sink is mounted in direct thermal communication with the heat generating device package which is surface mounted to a printed circuit board or other substrate. The inventive heat sink has a reservoir of thermal preform which allows the heat sink to be secured to a device package at the same time as the device package is being secured to the surface mount substrate, as opposed to doing so in a separate step in the assembly process after the electronic device packages have already been secured to the surface mount substrate. The inventive heat sink thereby simplifies the assembly process by eliminating steps in the manufacturing process and by allowing for the further automation of the assembly process.
摘要翻译：一种用于以散热器和器件封装之间提供更有效的热路径的方式将散热器直接热耦合到表面贴装发热器件封装的装置和方法，并且允许简化的组装过程。散热器与表面安装到印刷电路板或其它基板上的发热器件封装直接热连接。本发明的散热器具有热预成型件的储存器，其允许在器件封装被固定到表面安装基板的同时将散热器固定到器件封装，而不是在单独的步骤中电子设备封装已经固定到表面安装基板之后的组装过程。本发明的散热器因此通过消除制造过程中的步骤并允许组装过程的进一步自动化来简化组装过程。

9. 发明授权

US5991154A Attachment of electronic device packages to heat sinks 失效
标题翻译：将电子设备包装件连接到散热器
公开(公告)号：US5991154A
公开(公告)日：1999-11-23
申请号：US228775
申请日：1999-01-06
申请人： Donald L. Clemens , Steven F. Edwards
发明人： Donald L. Clemens , Steven F. Edwards
IPC分类号： H05K7/20 , H01L23/36 , H01L23/40 , H05K3/30
CPC分类号： H05K3/301 , H01L23/4093 , H01L2924/0002
摘要： A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit board. The base plate has opposed major faces adapted for mating with device packages. Tongues or clips secure individual device packages on the major faces of the base plate independently to that device packages may be removeably attached to either or both sides of the base plate.
摘要翻译：具有支撑基板的支撑基座的散热器用于将一个或多个装置封装安装在电路板等上。支撑座适于固定在电路板上。基板具有适于与装置包装配合的相对的主面。舌片或夹子独立地固定在底板的主面上的单个装置包装，该装置包装可以可移除地附接到基板的一侧或两侧。

10. 发明授权

US5371652A Spring clamp assembly with electrically insulating shoe 失效
标题翻译：带电绝缘鞋的弹簧夹组件
公开(公告)号：US5371652A
公开(公告)日：1994-12-06
申请号：US223011
申请日：1994-04-05
申请人： Donald L. Clemens , Keith Mandell
发明人： Donald L. Clemens , Keith Mandell
IPC分类号： H05K7/20 , H01L23/40
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： A spring clamp and insulating shoe assembly is used to secure a finned heat sink to an electronic device package. The spring clamp body fits between or around fins or pins extending from one face of a heat sink and carries an insulating shoe which fits around the edge of the device package and has a lip which engages the opposite face of the device package to urge the device package and heat sink into mutual contact.
摘要翻译：弹簧夹和绝缘靴组件用于将翅片散热器固定到电子设备封装。弹簧夹体装配在从散热器的一个面延伸的翅片或销之间或周围，并且承载绝缘鞋，该绝缘鞋围绕装置包装的边缘配合，并且具有接合装置包装的相对面的唇部，以推动装置包装和散热器相互接触。

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