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1. 发明申请

US20220415916A1 MEMORY DEVICE WITH IMPROVED DATA RETENTION 有权
公开(公告)号：US20220415916A1
公开(公告)日：2022-12-29
申请号：US17875462
申请日：2022-07-28
申请人： Gulbagh Singh , Chen-Hao Li , Chih-Ming Lee , Chi-Yen Lin , Cheng-Tsu Liu
发明人： Gulbagh Singh , Chen-Hao Li , Chih-Ming Lee , Chi-Yen Lin , Cheng-Tsu Liu
IPC分类号： H01L27/11568 , H01L29/423 , H01L21/28 , H01L29/792
摘要： The present disclosure relates to a memory device that includes a substrate and source and drain regions formed in the substrate. The memory device includes a gate dielectric formed on the substrate and between the source and drain regions. The memory device also includes a gate structure formed on the gate dielectric and the gate structure has a planar top surface. The memory device further includes a multi-spacer structure that includes first, second, and third spacers. The first spacer is formed on a sidewall of the gate structure and a top surface of one of the source and drain regions. The second spacer is formed on a sidewall of the first spacer and the second spacer has a dielectric constant greater than a dielectric constant of the first spacer. The third spacer is formed on a sidewall of the second spacer and a horizontal surface of the first spacer.

2. 发明授权

US09104281B2 Touch panel 有权
标题翻译：触控面板
公开(公告)号：US09104281B2
公开(公告)日：2015-08-11
申请号：US13938247
申请日：2013-07-10
申请人： Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su , Chin-Chang Liu
发明人： Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su , Chin-Chang Liu
IPC分类号： G06F3/045 , G06F3/044
CPC分类号： G06F3/044 , G06F3/045
摘要： A touch panel including sensing electrode sets, first pads, second pads, first conductive lines, second conductive lines and resistors is provided. Each sensing electrode set includes a first sensing electrode pattern and second sensing electrode patterns disposed beside the first sensing electrode pattern. The first conductive lines electrically connect the first sensing electrode pattern with the first pads respectively. The second conductive lines connect the second electrode patterns into multiple series. The second sensing electrode patterns of the same sensing electrode set belong to different series and two terminals of each series are connected to different second pads. Two terminals of each resistor are connected to the different second pads connected with the two terminals of the each series.
摘要翻译：提供了包括感测电极组，第一焊盘，第二焊盘，第一导电线，第二导电线和电阻器的触摸面板。每个感测电极组包括第一感测电极图案和布置在第一感测电极图案旁边的第二感测电极图案。第一导线分别将第一感测电极图案与第一垫片电连接。第二导线将第二电极图案连接成多个系列。相同感测电极组的第二感测电极图案属于不同的系列，并且每个系列的两个端子连接到不同的第二焊盘。每个电阻器的两个端子连接到与每个串联的两个端子连接的不同的第二焊盘。

3. 发明申请

US20150085205A1 TOUCH PANEL 审中-公开
标题翻译：触控面板
公开(公告)号：US20150085205A1
公开(公告)日：2015-03-26
申请号：US14493366
申请日：2014-09-23
申请人： Kuo-Hsing Chen , Chung-Hsien Li , Cheng-Yen Yeh , Yu-Ting Chen , Chen-Hao Su , Siang-Lin Huang
发明人： Kuo-Hsing Chen , Chung-Hsien Li , Cheng-Yen Yeh , Yu-Ting Chen , Chen-Hao Su , Siang-Lin Huang
IPC分类号： G06F3/041 , H03K17/96 , G06F1/16
CPC分类号： H03K17/962 , G06F1/1643 , G06F3/044 , G06F2203/04111
摘要： A touch panel includes a substrate, a plurality of first conductive elements, and a plurality of second conductive elements. Each of the first conductive elements includes a plurality of first conductive patterns and a plurality of first connection portions alternately connected with each other. The first conductive elements and the second conductive elements are intersected with each other and electrically insulated. Each of the second conductive elements includes a plurality of intersection portions respectively intersected with the first connection portions of each of the first conductive elements. A linewidth of the intersection portions is W1, and 100 μm
摘要翻译：触摸面板包括基板，多个第一导电元件和多个第二导电元件。每个第一导电元件包括彼此交替连接的多个第一导电图案和多个第一连接部分。第一导电元件和第二导电元件彼此相交并电绝缘。每个第二导电元件包括分别与每个第一导电元件的第一连接部分交叉的多个交叉部分。交点的线宽为W1，100μm

4. 发明申请

US20140362041A1 TOUCH APPARATUS AND DRIVING METHOD THEREOF 审中-公开
标题翻译：触摸装置及其驱动方法
公开(公告)号：US20140362041A1
公开(公告)日：2014-12-11
申请号：US14297631
申请日：2014-06-06
申请人： Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su
发明人： Kuo-Hsing Chen , Yu-Ting Chen , Chen-Hao Su
IPC分类号： G06F3/044
CPC分类号： G06F3/044 , G06F3/0416
摘要： A touch apparatus and a driving method thereof are provided. The touch apparatus includes a plurality of firs electrodes, a plurality of second electrodes, a first driving sensing unit, a second sensing driving unit and a control unit. The first electrodes are disposed sequentially along a first direction, and each second electrode is adjacent to the corresponding first electrode sequentially along a second direction. In a first touch mode, the control unit controls the first sensing driving unit to provide a first driving signal to the first electrodes, and controls the second sensing driving unit to receive a plurality of first touch signal from the second electrodes. In a second touch mode, the control unit controls the second driving sensing unit to provide a second driving signal to the second electrodes, and controls the first sensing driving unit to receive a plurality of second touch signal from the first electrodes.
摘要翻译：提供了一种触摸装置及其驱动方法。触摸装置包括多个第一电极，多个第二电极，第一驱动感测单元，第二感测驱动单元和控制单元。第一电极沿着第一方向依次设置，并且每个第二电极沿着第二方向依次与相应的第一电极相邻。在第一触摸模式中，控制单元控制第一感测驱动单元向第一电极提供第一驱动信号，并且控制第二感测驱动单元从第二电极接收多个第一触摸信号。在第二触摸模式中，控制单元控制第二驱动感测单元向第二电极提供第二驱动信号，并且控制第一感测驱动单元从第一电极接收多个第二触摸信号。

5. 发明申请

US20140268734A1 LIGHT-EMITTING DIODE MODULE LAMP WITH ADJUSTABLE CHROMATICITY 审中-公开
标题翻译：具有可调节色度的发光二极管模块灯
公开(公告)号：US20140268734A1
公开(公告)日：2014-09-18
申请号：US14028636
申请日：2013-09-17
申请人： CHEN-HAO CHANG , CHIH-JU HUNG
发明人： CHEN-HAO CHANG , CHIH-JU HUNG
IPC分类号： F21K99/00
CPC分类号： H05B33/0857 , H05B33/0821
摘要： A light-emitting diode (LED) module lamp with adjustable chromaticity is provided. The LED module lamp is formed by at least one set of second module including a plurality of LED modules, namely a first LED module to an nth LED module. Each of the LED modules includes a plurality of LEDs having visible spectrum chromaticities. That is, a first chromaticity LED C1 to an nth chromaticity LED Cn form a structure in a cyclic arrangement. The second module array is: [ C 1 C 2 C 3 … C n - 1 C n C 2 C 3 C 4 … … C n C 1 C 3 C 4 … … C n C 1 C 2 … … … … … … … C n C 1 … … … C n - 2 C n - 1 ] , where the first to nth columns are independently connected in series.
摘要翻译：提供了具有可调色度的发光二极管（LED）模块灯。 LED模块灯由包括多个LED模块的至少一组第二模块形成，即第一LED模块到第n个LED模块。每个LED模块包括具有可见光谱色度的多个LED。也就是说，第一色度LED C1至第n色度LED Cn形成循环布置的结构。第二个模块阵列是：[C 1 C 2 C 3 ... C n - 1 C n C 2 C 3 C 4 ...... C n C 1 C 3 C 4 ...... C n C 1 C 2 ...... ...... ...... ... C n C 1 ...... ... C n -2 C n-1]，其中第一至第n列独立地串联连接。

6. 发明申请

US20140209919A1 METHOD OF IMPLANTING DOPANTS INTO A GROUP III-NITRIDE STRUCTURE AND DEVICE FORMED 审中-公开
标题翻译：将DOPANTS嵌入III-III型结构和形成装置的方法
公开(公告)号：US20140209919A1
公开(公告)日：2014-07-31
申请号：US13753867
申请日：2013-01-30
申请人： Han-Chin CHIU , Chen-Hao CHIANG , Chi-Ming CHEN , Chung-Yi YU
发明人： Han-Chin CHIU , Chen-Hao CHIANG , Chi-Ming CHEN , Chung-Yi YU
IPC分类号： H01L29/66 , H01L29/20
CPC分类号： H01L29/42364 , H01L29/2003 , H01L29/66462 , H01L29/7787
摘要： A method including forming a III-V compound layer on a substrate and implanting a main dopant in the III-V compound layer to form source and drain regions. The method further includes implanting a group V species into the source and drain regions. A semiconductor device including a substrate and a III-V compound layer over the substrate. The semiconductor device further includes source and drain regions in the III-V layer, wherein the source and drain regions comprises a first dopant and a second dopant, and the second dopant comprises a group V material.
摘要翻译：一种方法，包括在衬底上形成III-V化合物层并在III-V化合物层中注入主掺杂剂以形成源区和漏区。该方法还包括将V族物质注入源区和漏区。一种半导体器件，包括在衬底上的衬底和III-V化合物层。半导体器件还包括III-V层中的源区和漏区，其中源区和漏区包括第一掺杂剂和第二掺杂剂，第二掺杂剂包括第V族材料。

7. 发明申请

US20140152915A1 TOUCH PANEL 审中-公开
标题翻译：触控面板
公开(公告)号：US20140152915A1
公开(公告)日：2014-06-05
申请号：US14093032
申请日：2013-11-28
申请人： Chia-Ching Lu , Kuo-Chang Su , Chen-Hao Su , Cheng-Yen Yeh , Yu-Ting Chen
发明人： Chia-Ching Lu , Kuo-Chang Su , Chen-Hao Su , Cheng-Yen Yeh , Yu-Ting Chen
IPC分类号： G06F1/16
CPC分类号： G06F1/1643 , G06F3/044
摘要： A touch panel includes a substrate, a plurality of first and second conductive series, and a plurality of first and second auxiliary electrodes. The first and the second conductive series are disposed alternately on the substrate and located on a light-transmission area of the substrate. A portion of each of the first and second conductive series extends to a peripheral area of the substrate. The first and the second auxiliary electrodes are disposed on the peripheral area. The first auxiliary electrodes connect to the portion of the first conductive series extending to the peripheral area and generate capacitive sensing with the portion of the second conductive series located on the peripheral area. The second auxiliary electrodes connect to the portion of the second conductive series extending to the peripheral area and generate capacitive sensing with the portion of the first conductive series located on the peripheral area.
摘要翻译：触摸面板包括基板，多个第一和第二导电系列以及多个第一和第二辅助电极。第一和第二导电系列交替地设置在基板上并且位于基板的光透射区域上。第一和第二导电系列中的每一个的一部分延伸到衬底的周边区域。第一辅助电极和第二辅助电极设置在周边区域上。第一辅助电极连接到延伸到周边区域的第一导电串联的部分，并且产生电容感测，其中第二导电系列的部分位于周边区域上。第二辅助电极连接到延伸到周边区域的第二导电串联的部分，并且产生电容感测，第一导电系列的位于周边区域的部分。

8. 发明授权

US08742583B2 Seal ring in an integrated circuit die 有权
标题翻译：集成电路模具中的密封圈
公开(公告)号：US08742583B2
公开(公告)日：2014-06-03
申请号：US13351144
申请日：2012-01-16
申请人： Chuan-Yi Lin , Ching-Chen Hao , Chen Cheng Chou , Sheng-Yuan Lin
发明人： Chuan-Yi Lin , Ching-Chen Hao , Chen Cheng Chou , Sheng-Yuan Lin
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76898 , H01L23/585 , H01L25/0657 , H01L2224/05109 , H01L2224/05116 , H01L2224/05144 , H01L2224/05147 , H01L2224/05573 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05684 , H01L2224/16 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/00014 , H01L2924/0105 , H01L2924/01079
摘要： The formation of a seal ring in a semiconductor integrated circuit (IC) die is described. Through-silicon vias (TSVs) are typically formed in a semiconductor IC die to facilitate the formation of a three dimensional (3D) stacking die structure. The TSVs may be utilized to provide electrical connections between components in different dies of the 3D stacking die structure. A seal ring is formed in the inter-metal dielectric (IMD) layers of an IC die, enclosing an active circuit region. The real ring is formed prior to the formation of the TSVs, preventing moistures or other undesired chemical agents from diffusing into the active circuit region during the subsequent processes of forming TSVs.
摘要翻译：描述在半导体集成电路（IC）裸片中形成密封环。通常在半导体IC芯片中形成通硅通孔（TSV），以便于形成三维（3D）堆叠管芯结构。 TSV可用于在3D堆叠模具结构的不同模具中的组件之间提供电连接。密封环形成在IC管芯的金属间电介质（IMD）层中，其包围有源电路区域。真正的环在形成TSV之前形成，防止在随后的TSV形成过程中，水分或其它不期望的化学试剂扩散到有源电路区域。

9. 发明授权

US08653878B2 Voltage switch circuit produced by logic circuit manufacturing process capable of withstanding high voltage stress 有权
标题翻译：电压开关电路由逻辑电路制造工艺生产，能承受高压应力
公开(公告)号：US08653878B2
公开(公告)日：2014-02-18
申请号：US13423411
申请日：2012-03-19
申请人： Chen-Hao Po , Chiun-Chi Shen
发明人： Chen-Hao Po , Chiun-Chi Shen
IPC分类号： H03L5/00
CPC分类号： H03K3/356104 , H03K3/356182 , H03K19/0175
摘要： A voltage switch circuit uses PMOS transistors to withstand high voltage stress. Consequently, the NMOS transistors are not subject to high voltage stress. The lightly-doped PMOS transistors are compatible with a logic circuit manufacturing process. Consequently, the voltage switch circuit may be produced by a logic circuit manufacturing process.
摘要翻译：电压开关电路使用PMOS晶体管来承受高压应力。因此，NMOS晶体管不承受高电压应力。轻掺杂PMOS晶体管与逻辑电路制造工艺兼容。因此，可以通过逻辑电路制造工艺来产生电压开关电路。

10. 发明授权

US08586469B2 Metal layer end-cut flow 有权
公开(公告)号：US08586469B2
公开(公告)日：2013-11-19
申请号：US12845448
申请日：2010-07-28
申请人： Chen-Hao Yeh
发明人： Chen-Hao Yeh
IPC分类号： H01L21/4763
CPC分类号： H01L21/76892 , H01L21/31144 , H01L21/76816 , H01L21/76829 , H01L21/76877 , H01L21/76897
摘要： A method of patterning a metal layer is disclosed. The method includes providing a substrate and forming a material layer over the substrate. The method includes forming a second material layer over the first material layer. The method includes performing a first patterning process to the second material layer to form a trench in the second material layer. The first patterning process defines a width size of the trench, the width size being measured in a first direction. The method includes performing a second patterning process to the trench to transform the trench. The second patterning process defines a length size of the transformed trench. The length size is measured in a second direction different from the first direction. The method also includes filling the transformed trench with a conductive material.

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