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    • 8. 发明授权
    • 전자재료용 접착제 조성물
    • 전자재료용접착제조성물
    • KR100380309B1
    • 2003-04-18
    • KR1020010005898
    • 2001-02-07
    • 도레이케미칼 주식회사
    • 김순식장경호박민효김승진
    • C09J163/10
    • PURPOSE: Provided are an adhesive composition for electronic material, which improves heat resistance between cupper foil and polyimide, polyester film, and so on which are used as basic film in FPC(flexible print circuit), and which can show adhesion at relatively low temperature. CONSTITUTION: The adhesive composition contains an acryl rubber having weight average molecular weight of 10,000-1,000,000 and hydroxyl value(KOHmg/g) of 2-50; an epoxy resin having at least two epoxy groups and comprising 20-50 wt% of bromine; and a hardener having ester group. The hardener having ester group is obtained by reacting an acid anhydride and alcohols, and further reacting the reactant with dichloride compound. The epoxy resin is used in composition range of epoxy resin/acryl rubber(weight ratio) of 2/8-8/2.
    • 本发明提供一种电子材料用粘接剂组合物,其提高作为FPC(柔性印刷电路)中的基膜使用的铜箔与聚酰亚胺,聚酯膜等之间的耐热性,并且能够在比较低的温度 。 构成:粘合剂组合物含有重均分子量为10000-1000000,羟值(KOHmg / g)为2-50的丙烯酸橡胶; 具有至少两个环氧基并且包含20-50重量%的溴的环氧树脂; 和具有酯基的硬化剂。 具有酯基的硬化剂通过使酸酐与醇反应,并使反应物与二氯化合物进一步反应而获得。 环氧树脂用于环氧树脂/丙烯酸橡胶(重量比)为2 / 8-8 / 2的组成范围。
    • 9. 发明公开
    • 전자재료용 접착제 조성물
    • 电子材料用粘合剂组合物
    • KR1020020065727A
    • 2002-08-14
    • KR1020010005898
    • 2001-02-07
    • 도레이케미칼 주식회사
    • 김순식장경호박민효김승진
    • C09J163/10
    • PURPOSE: Provided are an adhesive composition for electronic material, which improves heat resistance between cupper foil and polyimide, polyester film, and so on which are used as basic film in FPC(flexible print circuit), and which can show adhesion at relatively low temperature. CONSTITUTION: The adhesive composition contains an acryl rubber having weight average molecular weight of 10,000-1,000,000 and hydroxyl value(KOHmg/g) of 2-50; an epoxy resin having at least two epoxy groups and comprising 20-50 wt% of bromine; and a hardener having ester group. The hardener having ester group is obtained by reacting an acid anhydride and alcohols, and further reacting the reactant with dichloride compound. The epoxy resin is used in composition range of epoxy resin/acryl rubber(weight ratio) of 2/8-8/2.
    • 目的:提供一种用于电子材料的粘合剂组合物,其改善了用作FPC(柔性印刷电路)中的基础膜的铜箔和聚酰亚胺,聚酯膜等之间的耐热性,并且可以在相对低的温度下显示粘附性 。 构成:粘合剂组合物含有重均分子量为10,000-1,000,000,羟基值(KOHmg / g)为2-50的丙烯酸橡胶; 具有至少两个环氧基并且包含20-50重量%的溴的环氧树脂; 和具有酯基的固化剂。 具有酯基的固化剂通过使酸酐与醇反应,并进一步使反应物与二氯化合物反应而获得。 环氧树脂用于环氧树脂/丙烯酸橡胶的组成范围(重量比)为2 / 8-8 / 2。