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    • 6. 发明公开
    • 반도체 제조용 접착제
    • 胶粘剂制备半导体元件
    • KR1020010037327A
    • 2001-05-07
    • KR1019990044771
    • 1999-10-15
    • 삼성전자주식회사
    • 손민영
    • C09J123/28C09J9/02H01L23/29
    • PURPOSE: An adhesive used in preparation of semiconductor element is provided for remarkably reducing bending, stripping or cracking problems in semiconductor industry by adding foaming resin filler to polymerized adhesive compound. CONSTITUTION: An adhesive useful in die bonding process of semiconductor packaging installation comprises foaming resin particles filler as well as polymerized adhesive compound. The filler consists of spherical particles having three-dimensional network structure and is formed by means of foam-polymerization of prepolymer formed from foam resin monomers such as polytetrafluoroethylene. The filler may be silver or gold which are conductive and/or silica or polytetrafluoroethylene particles which are non-conductive. The adhesive has excellent fluidity to enable it to be uniformly distributed onto surface of the semiconductor material.
    • 目的:提供半导体元件制备中使用的粘合剂,通过向聚合的粘合剂中添加发泡树脂填料,可显着减少半导体工业中的弯曲,剥离或龟裂问题。 构成:用于半导体封装装置的芯片接合工艺中的粘合剂包括发泡树脂颗粒填料以及聚合粘合剂。 填料由具有三维网状结构的球形颗粒组成,并且通过由泡沫树脂单体如聚四氟乙烯形成的预聚物的泡沫聚合形成。 填料可以是导电的银或金,和/或不导电的二氧化硅或聚四氟乙烯颗粒。 粘合剂具有优异的流动性,使其能够均匀地分布在半导体材料的表面上。