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    • 9. 发明公开
    • 3차원 집적 컴퍼스 패키지
    • 3D集成指南针包装
    • KR1020090029174A
    • 2009-03-20
    • KR1020080091301
    • 2008-09-17
    • 허니웰 인터내셔널 인코포레이티드
    • 완홍리거라이언더블유보링거마이클제이
    • G01V3/00G01R33/00
    • G01R33/0206
    • A 3 dimensional integrated compass package having a sensor support chip is provided to offer the 3 dimensional integrated compass package controlling signal by using an assembling process of low cost. A 3D integrated compass package(10) includes a hardening substrate(12) having a top surface(14), an ASIC(A7application Specific Integrated Circuit), and the X axis sensor(20) and Z-axis sensor(30). The application specific integrated circuit is adhered to the top surface while including the input-output pad. The pad includes a LCC(Leadless Chip Carrier) design and BGA(Ball Grid Array) having I/O pad arranged in the grid. The X axis sensor is positioned on an upper surface of the hardening board for sensing physical variable along the X axis.
    • 提供具有传感器支撑芯片的三维集成罗盘包,通过使用低成本的组装过程来提供三维集成罗盘包控制信号。 3D集成罗盘包(10)包括具有顶表面(14),ASIC(A7应用专用集成电路)和X轴传感器(20)和Z轴传感器(30)的硬化基板(12)。 应用专用集成电路在包括输入 - 输出板的同时附着在顶面上。 该焊盘包括LCC(无引线芯片载体)设计和具有布置在网格中的I / O焊盘的BGA(球栅阵列)。 X轴传感器位于硬化板的上表面上,用于感测沿着X轴的物理变量。
    • 10. 发明公开
    • 자기방위 검출장치
    • 磁性AZIMUTH检测器
    • KR1020080080411A
    • 2008-09-03
    • KR1020087018420
    • 2006-12-26
    • 알프스 덴키 가부시키가이샤
    • 하야마츠요시
    • G01R33/02
    • G01R33/0206G01C17/30
    • [PROBLEMS] To provide a magnetic azimuth detector of which the size can be easily reduced. [MEANS FOR SOLVING THE PROBLEMS] Three or more magnetic sensors (3) and a control semiconductor (4) for controlling these magnetic sensors (3) are mounted on one surface of a circuit substrate (2). Each magnetic sensor (3) and the control semiconductor (4) are sealed by a sealing member (5) and integrated with each other. Furthermore, the magnetic sensors (3) are classified into at least two groups, and these groups of magnetic sensors are disposed so that the terminal-forming surfaces (6) of one group of magnetic sensors (3) cross orthogonally to the terminal-forming surfaces (6) of the other group of magnetic sensors (3).
    • [问题]提供可以容易地减小尺寸的磁方位检测器。 解决问题的手段安装在电路基板(2)的一个面上的三个以上的磁传感器(3)和用于控制这些磁传感器(3)的控制半导体(4)。 每个磁传感器(3)和控制半导体(4)由密封件(5)密封并彼此集成。 此外,磁传感器(3)被分成至少两组,并且这些磁传感器组被设置成使得一组磁传感器(3)的端子形成表面(6)与终端形成正交交叉 另一组磁传感器(3)的表面(6)。