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    • 3. 发明公开
    • 다층 박막, 이의 제조방법 및 이를 포함하는 봉지구조체
    • 多层薄膜,其制造方法和包括其的包封结构
    • KR1020100048035A
    • 2010-05-11
    • KR1020080107022
    • 2008-10-30
    • 삼성전자주식회사
    • 불리아드자비에이광희박종진최윤혁인인식
    • H05B33/04H01L51/50
    • C09J7/0221C09J7/387H01L51/5237H01L51/5256Y10T428/1059Y10T428/239H01L51/0533H01L51/5246
    • PURPOSE: A multilayered thin film, a manufacturing method thereof, and a sealing structure with the same are provided to increase vulnerability to oxygen or steam by improving gas-and-water-blocking properties and flexibility. CONSTITUTION: A multi-layered thin film(10) comprises a bonding layer(12) and a barrier layer(14) which is located on the same bonding layer. The multi-layered thin film is used as a film for soldering a substrate including a device. The bonding layer comprises a block copolymer which forms two or more different domains situated on the lower part of the barrier layer. The block copolymer comprises a first block recurring unit with a glass transition temperature lower than 50 degrees Celsius. The block copolymer comprises a second block recurring unit with a glass transition temperature that is higher than 50 degrees Celsius and equal to or lower than 150 degrees Celsius and surface energy between 30 and 50mN/m. The block copolymer comprises an elastic block recurring unit which is selected from a group consisting of a combination of the first block recurring unit and the second block recurring unit. The block copolymer comprises a third block recurring unit with a hydrophilic property.
    • 目的:提供一种多层薄膜及其制造方法及其密封结构,以通过提高阻气性和柔软性来增加对氧气或蒸汽的脆性。 构成:多层薄膜(10)包括位于同一结合层上的结合层(12)和阻挡层(14)。 多层薄膜用作用于焊接包括器件的衬底的膜。 粘合层包含嵌段共聚物,其形成位于阻挡层下部的两个或多个不同的区域。 嵌段共聚物包含玻璃化转变温度低于50摄氏度的第一嵌段重复单元。 嵌段共聚物包括玻璃化转变温度高于50摄氏度并且等于或低于150℃的第二嵌段重复单元,表面能在30和50mN / m之间。 嵌段共聚物包括弹性块循环单元,其选自由第一块重复单元和第二块重复单元的组合组成的组。 嵌段共聚物包含具有亲水性的第三嵌段重复单元。