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    • 2. 发明公开
    • 가요성 회로 오버 코팅용 경화성 수지 조성물
    • 用于柔性电路过载的树脂组合物
    • KR1020000029078A
    • 2000-05-25
    • KR1019990044547
    • 1999-10-14
    • 아지노모토 가부시키가이샤
    • 오리카베히로시
    • C09D129/02
    • H05K3/285C08G18/6208C08G18/69C08G18/8077C08G18/8125Y10T428/31551
    • PURPOSE: Resin compositions for overcoat of flexible circuits are provided which are excellent in low shrinkage during curing and flexibility, and particularly in that the resulting overcoats are difficult to deteriorate in qualities, e.g., to over harden, to increase in curling, and the like, even after being allowed to stand for a long time at elevated temperatures. CONSTITUTION: A resin composition for overcoat of flexible circuits comprises (A) a hydrogenated polybutadiene polyol with a number-average molecular weight of 1,000 - 8,000 and having 2 - 10 hydroxyl groups per molecule, and (Xa) a hydrogenated polybutadiene polyblock isocyanate with a number-average molecular weight of 1,000 - 8,000 and having 2 - 10 blockisocyanate groups per molecule, wherein the polyblock isocyanate is in an amount of 0.8 - 3.5 gram equivalents based on one gram equivalent of the total hydroxyl groups of polyol.
    • 目的:提供柔软电路外涂层用树脂组合物,其在固化和柔软性方面的低收缩率优异,特别是由于所得到的外衣难以质量劣化,例如过度硬化,卷曲增加等 ,即使在高温下被允许长时间放置。 构成:用于柔性电路外涂层的树脂组合物包括(A)数均分子量为1,000-8,000并且每分子具有2-10个羟基的氢化聚丁二烯多元醇,和(Xa)氢化聚丁二烯多嵌段异氰酸酯与 数均分子量为1,000-8,000并且每分子具有2-10个嵌段异氰酸酯基团,其中所述多嵌段异氰酸酯的量为基于1克当量的多元醇的总羟基的0.8-3.5克当量。