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    • 1. 发明公开
    • METHOD AND SYSTEM FOR ENHANCED LITHOGRAPHIC ALIGNMENT
    • 用于增强光刻对准的方法和系统
    • KR20070092155A
    • 2007-09-12
    • KR20070022433
    • 2007-03-07
    • ASML NETHERLANDS BV
    • LALBAHADOERSING SANJAYSINGHMUSA SAMI
    • H01L21/027
    • H01L23/544G03F9/7076G03F9/708G03F9/7084H01L21/3105H01L2223/54453H01L2924/0002Y10S438/975H01L2223/54426H01L2924/00
    • A method and a system for enhancing lithographic alignment are provided to obtain an improved alignment system and an improved method of a lithography system. A substrate preparing process is performed to prepare a lower alignment mark structure for defining a lower trench region on a substrate(411). An applying process is performed to apply a hard mask coating having a top surface on the substrate. An exposing process is performed to expose parts of the hard mask coating to a dose of radiation in order to raise a top surface region of the hard mask coating located on the lower trench region in the lower alignment mark structure. As a result, the top surface region is higher than parts of the top surface adjacent to the top surface region of the hard mask coating. The hard mask coating is formed of amorphous carbon.
    • 提供了一种用于增强光刻对准的方法和系统,以获得改进的对准系统和光刻系统的改进方法。 进行衬底制备工艺以制备用于限定衬底(411)上的下沟槽区域的下部对准标记结构。 执行施加工艺以在基底上施加具有顶表面的硬掩模涂层。 进行曝光处理以将硬掩模涂层的一部分暴露于一定量的辐射,以便提高位于下对准标记结构中的下沟槽区上的硬掩模涂层的顶表面区域。 结果,顶表面区域高于与硬掩模涂层的顶表面区域相邻的顶表面的部分。 硬掩模涂层由无定形碳形成。