会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明公开
    • Mo 합금 스퍼터링 타깃재의 제조 방법 및 Mo 합금 스퍼터링 타깃재
    • 制造MO合金溅射靶材和MO合金溅射靶材的方法
    • KR1020140103061A
    • 2014-08-25
    • KR1020140015941
    • 2014-02-12
    • 히타치 긴조쿠 가부시키가이샤
    • 무라타히데오가미나다마사시이노우에게이스케
    • B22F3/12C23C14/34C23C14/14
    • B22F3/12C23C14/14C23C14/34
    • An objective of the present invention is to provide a method of fabricating a molybdenum (Mo) alloy sputtering target material to stably and economically provide the Mo alloy sputtering target material with excellent low-resistance, heat resistance, moisture resistance, and adhesion to a substrate, as well as high density and high purity, which are appropriate for an electrode or a wired thin film. The material also has a nonmagnetic property and a novel Mo alloy sputtering target material. Mo powders, and at least one or two types of nickel (Ni) alloy powders, are mixed with each other to satisfy a composition including 10-49 atom% of Ni, 1-30 atom% of titanium (Ti), the sum of Ni and Ti contents are less than or equal to 50 atom%, and the remainder consists of Mo and other inevitable impurities. Then, the mixture is pressed and sintered. Provided is the Mo alloy sputtering target material including 10-49 atom% of Ni, 1-30 atom% of Ti, the sum of Ni and Ti contents are less than or equal to 50 atom%, and a remainder consisting of Mo and other inevitable impurities. The Mo alloy sputtering target material has a structure in which a Ni alloy phase is distributed in a Mo matrix.
    • 本发明的目的是提供一种制造钼(Mo)合金溅射靶材的方法,以稳定且经济地提供具有优异的低电阻,耐热性,耐湿性和对基片的粘附性的Mo合金溅射靶材 ,以及高密度和高纯度,其适用于电极或有线薄膜。 该材料还具有非磁性和新型的Mo合金溅射靶材料。 Mo粉末和至少一种或两种镍(Ni)合金粉末彼此混合以满足包含10-49原子%的Ni,1-30原子%的钛(Ti)的组成,其总和 Ni和Ti含量小于或等于50原子%,其余由Mo和其他不可避免的杂质组成。 然后,将混合物压制并烧结。 提供了包括Ni的10-49原子%,Ti的1-30原子%,Ni和Ti含量的总和小于或等于50原子%的Mo合金溅射靶材料,其余由Mo等构成 不可避免的杂质。 Mo合金溅射靶材料具有其中Ni合金相分布在Mo基体中的结构。
    • 6. 发明公开
    • Mo 합금 스퍼터링 타깃재의 제조 방법 및 Mo 합금 스퍼터링 타깃재
    • 制造喷射靶材料MO合金和钼合金溅射靶材的方法
    • KR1020130079176A
    • 2013-07-10
    • KR1020120149375
    • 2012-12-20
    • 히타치 긴조쿠 가부시키가이샤
    • 무라타히데오가미나다마사시이노우에게이스케
    • C23C14/34C22C27/04C22C1/04
    • PURPOSE: A method for manufacturing a molybdenum (Mo) alloy sputtering target material and the Mo alloy sputtering target material are provided to lower an electric resistance, to improve a thermal resistance, a moisture resistance, and an adhesive property to a substrate, and to obtain high density and high purity suitable for an electrode-wiring film. CONSTITUTION: A molybdenum (Mo) alloy sputtering target includes 10 to 49 atom% of Ni, 1 to 20 atom% of Nb, and remnants Mo and inevitable impurities. The total amount of Nb and Ni is below 50 atom%. A method for manufacturing the material includes: a step of forming a mixture of Mo powder and at least one or two kinds of Ni alloy powder; and a step of continuously pressurizing and sintering the mixture. The Ni alloy powder is formed with a Ni-Nb alloy.
    • 目的:提供一种用于制造钼(Mo)合金溅射靶材料和Mo合金溅射靶材料的方法,以降低电阻,提高耐热性,耐湿性和对基材的粘合性,以及 获得适用于电极布线膜的高密度和高纯度。 构成:钼(Mo)合金溅射靶包括10〜49原子%的Ni,1〜20原子%的Nb,残留Mo和不可避免的杂质。 Nb和Ni的总量低于50原子%。 一种制造该材料的方法包括:形成Mo粉末和至少一种或两种Ni合金粉末的混合物的步骤; 以及连续加压和烧结混合物的步骤。 Ni合金粉末由Ni-Nb合金形成。