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    • 7. 发明公开
    • DC―DC 컨버터
    • DC-DC转换器
    • KR1020080069611A
    • 2008-07-28
    • KR1020087012011
    • 2006-10-30
    • 히타치 긴조쿠 가부시키가이샤
    • 와타나베미쓰히로
    • H02M3/155H01L25/00
    • H01F27/292H01F17/0013H01F2017/002H01F2017/0066H01F2017/0086H01F2027/2809H01L23/645H01L2224/16225H01L2924/13091H01L2924/19103H01L2924/19105H02M3/00H02M3/155H05K1/0233H05K1/165H05K2201/086H05K2201/10015H01L2924/00
    • In a DC-DC converter, a semiconductor integrated circuit component including a switching element and a control circuit is mounted on a soft magnetic multilayer substrate having a laminated coil wherein a plurality of conductor wires are connected. The semiconductor integrated circuit component is provided with an input terminal, an output terminal a first control terminal for controlling on/off of the switching element, a second control terminal for variably controlling an output voltage, and a plurality of grounding terminals. The soft magnetic multilayer substrate is provided with a first external terminal formed on a first main plane, a first connecting wiring formed on the first main plane and/or on an inner layer in the vicinity of the first main plane, a second connecting wiring formed between a side plane of the multilayer substrate and an outer circumference of the laminated coil, and a second external terminal formed on a second main plane. A terminal of the semiconductor integrated circuit component is connected to a first external terminal of the multilayer substrate, and at least a part of the first external terminal is electrically connected with a second external terminal through the first connecting wiring and the second connecting wiring, and the input terminal or the output terminal is connected to the second external terminal through the lamianted coil.
    • 在DC-DC转换器中,包括开关元件和控制电路的半导体集成电路元件安装在具有多条导线连接的层叠线圈的软磁性多层基板上。 半导体集成电路部件设置有输入端子,输出端子,用于控制开关元件的导通/截止的第一控制端子,用于可变地控制输出电压的第二控制端子和多个接地端子。 软磁性多层基板设置有形成在第一主平面上的第一外部端子,形成在第一主平面上的第一连接布线和/或形成在第一主平面附近的内层上的第一连接布线,形成的第二连接布线 在多层基板的侧面和层叠线圈的外周之间,以及形成在第二主面上的第二外部端子。 半导体集成电路部件的端子连接到多层基板的第一外部端子,并且第一外部端子的至少一部分通过第一连接布线和第二连接布线与第二外部端子电连接,并且 输入端子或输出端子通过线束连接到第二外部端子。