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1. 发明公开

KR1020000029685A 적층필름및프린트배선판의제조법 无效
标题翻译：层压薄膜和印刷线路板的制造
公开(公告)号：KR1020000029685A
公开(公告)日：2000-05-25
申请号：KR1019997000764
申请日：1997-07-30
申请人： 히따찌 케미칼 컴퍼니, 리미티드
发明人： 기무라노리요 , 다나까요지 , 마사오까까즈따까 , 구도다까후미 , 미나미히라유끼히꼬 , 요시다데쯔오
IPC分类号： B32B7/02
CPC分类号： H05K3/0079 , G03F7/092 , G03F7/161 , H05K3/064 , H05K2203/066
摘要： PURPOSE: A manufacture of laminated film and printed wiring board is provided which a transfer layer is favorably conformed to the surface unevenness of a target on which the transfer layer is to be laminated, resolution can be improved and the production yield of a printed wiring board can be greatly improved without increasing production costs and processes for preparing a printed wiring board. CONSTITUTION: The manufacturing method of a laminated film which is composed of a photosensitive layer and a first film whose 5 % elongation load for a unit width in the film lengthwise direction is 4-90 g/mm at 80°C and whose breaking elongation in the same direction is 50-1000 % at 80°C and the manufacturing method of a printed wiring board wherein the laminated film is applied to the board so as to bring the photosensitive layer into contact with the printed wiring board and the exposure and the development are performed are provided.
摘要翻译：目的：提供层压膜和印刷电路板的制造，其中转印层有利地符合要层叠转印层的靶的表面不均匀性，可以提高分辨率和印刷线路板的生产率可以大大提高，而不增加制造成本和制备印刷线路板的工艺。构成：由感光层和膜长度方向的单位宽度的5％伸长负荷在80℃下为4-90g / mm的第一膜构成的层叠膜的制造方法，其断裂伸长率在80℃下相同的方向为50-1000％，并且印刷线路板的制造方法，其中将层压膜施加到板上以使感光层与印刷线路板接触并进行曝光和显影被提供。

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