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    • 4. 发明公开
    • 원자층 증착 방법에서의 증착 온도 조절을 통한 루테늄 및전도성 루테늄 산화물 박막의 상 제어방법
    • 通过控制原子层沉积中的沉积温度,薄膜与导电氧化亚薄膜​​之间的相位控制方法
    • KR1020090093148A
    • 2009-09-02
    • KR1020080018506
    • 2008-02-28
    • 포항공과대학교 산학협력단
    • 김형준박상준
    • C23C16/18C23C16/06C23C16/40C23C16/455
    • A phase controlling method between ruthenium thin film and conductive ruthenium oxide thin film by controlling the deposition temperature in atomic layer deposition is provided to improve device character and convenience of device fabrication by selectively changing phase between ruthenium layers or ruthenium oxide thin films. A phase controlling method between ruthenium thin film and conductive ruthenium oxide thin film by controlling the deposition temperature in atomic layer deposition comprises following steps. The ruthenium precursor vaporized on a heated substrate is injected into a reaction chamber with the argon gas for 2 seconds. A bubbler filled with the precursor is x with is heated at 65°C. The temperature of a feeding line is maintained at 10 ~ 15°C temperature higher than the bubbler. The flow rate of the argon gas is maintained as 20 sccm. The argon purging gas of 50 sccm is injected into the chamber for 2 seconds. The oxygen gas of 10 sccm is injected into the chamber for 2 seconds. The argon purging gas of 50 sccm is injected into the camber for 2 seconds. The precursor of the ruthenium is the Ru2. The substrate temperature is maintained at 300±25°C when depositing the ruthenium metal thin film.
    • 提供了通过控制原子层沉积中的沉积温度的钌薄膜和导电氧化钌薄膜之间的相位控制方法,以通过选择性地改变钌层或氧化钌薄膜之间的相位来改善器件制造的器件特性和便利性。 通过控制原子层沉积中的沉积温度,钌薄膜和导电氧化钌薄膜之间的相位控制方法包括以下步骤。 在加热的基板上蒸发的钌前驱体用氩气注入反应室2秒钟。 填充有前体的起泡器是x在65℃下加热。 进料管的温度保持在比起泡器高10〜15℃的温度。 氩气的流量保持为20sccm。 将50sccm的氩气吹扫气体注入室2秒钟。 将10sccm的氧气注入室2秒钟。 将50sccm的氩气吹扫气体注入弧度2秒钟。 钌的前体是Ru2。 当沉积钌金属薄膜时,衬底温度保持在300±25℃。