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1. 发明授权

KR100382227B1 센서소자 제조기술 失效
标题翻译： 센서소자제조기술
公开(公告)号：KR100382227B1
公开(公告)日：2003-05-01
申请号：KR1020000048910
申请日：2000-08-23
申请人： 학교법인조선대학교
发明人： 박진성 , 배인수 , 노효섭 , 김준호 , 이우선 , 김재열 , 신흥수
IPC分类号： H01L23/58
摘要： PURPOSE: A method for fabricating a sensor device is provided to simplify a fabricating process, by making a hole having a diameter of 0.5 millimeter in a substrate and by making a joint in the center of a package pin inserted to the hole so that the substrate is directly connected to the package pin without a noble metal wire. CONSTITUTION: The hole is formed in the substrate to electrically and directly connect the substrate with the package pin while a welding process is not performed regarding a connection wire. When the substrate is inserted to the package pin, a knot is formed in the center of the pin to support the substrate so that the substrate floats in the air.
摘要翻译：目的：提供一种用于制造传感器装置的方法，以通过在基板中制造具有0.5毫米直径的孔并且通过在插入到孔中的封装插脚的中心处形成接合部来简化制造工艺，从而使得基板直接连接到封装引脚而没有贵金属线。构成：在基板上形成孔，以便在没有对连接线执行焊接工艺的同时将基板与封装引脚直接电连接。当衬底插入封装插脚时，在针的中心形成一个结以支撑衬底，使得衬底漂浮在空气中。

2. 发明公开

KR1020020015798A 센서소자 제조기술 失效
标题翻译：制造传感器装置的方法
公开(公告)号：KR1020020015798A
公开(公告)日：2002-03-02
申请号：KR1020000048910
申请日：2000-08-23
申请人： 학교법인조선대학교
发明人： 박진성 , 배인수 , 노효섭 , 김준호 , 이우선 , 김재열 , 신흥수
IPC分类号： H01L23/58
摘要： PURPOSE: A method for fabricating a sensor device is provided to simplify a fabricating process, by making a hole having a diameter of 0.5 millimeter in a substrate and by making a joint in the center of a package pin inserted to the hole so that the substrate is directly connected to the package pin without a noble metal wire. CONSTITUTION: The hole is formed in the substrate to electrically and directly connect the substrate with the package pin while a welding process is not performed regarding a connection wire. When the substrate is inserted to the package pin, a knot is formed in the center of the pin to support the substrate so that the substrate floats in the air.
摘要翻译：目的：提供一种用于制造传感器装置的方法，通过在衬底中制造直径为0.5毫米的孔，并通过在封装销的中心形成一个插入孔的接头，使衬底直接连接到没有贵金属线的封装引脚。构成：在不进行关于连接线的焊接过程的情况下，在基板中形成孔以将基板与封装销电连接并直接连接。当基板插入封装销时，在销的中心形成一个结以支撑基板，使得基板浮在空气中。

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