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    • 3. 发明公开
    • 동 미립자 소결체형의 미세 형상 도전체의 형성 방법, 그방법을 응용한 동미세 배선 및 동박막의 형성 방법
    • 形成微细铜粒烧结产品类型的形成方法,具有精细形状的导电体,使用方法形成细铜线和薄膜的方法
    • KR1020060021310A
    • 2006-03-07
    • KR1020057021515
    • 2004-05-13
    • 하리마 카세이 가부시키가이샤
    • 이토다이스케이즈미타니아키히토하타노리아키마츠바요리시게
    • H05K3/10H01B1/22B82Y40/00
    • H05K3/1283H01B1/22H05K3/102H05K3/105H05K2201/0257H05K2203/0315H05K2203/1131H05K2203/1157H05K2203/122
    • A method for forming a fine copper particle sintered product type of electric conductor having a fine shape, wherein a fine pattern is drawn by the use of a dispersion of copper particles having an oxide film on the surface thereof, and then, at a relatively low temperature, fine copper particles having an oxide film layer on the surface thereof or fine copper oxide particles in the resultant pattern are subjected to a reduction treatment and the resultant fine copper particles are sintered, in an embodiment, a dispersion of fine copper particles having an oxide film layer on the surface thereof or fine copper oxide particles having an average particle diameter of 10 mum or less is applied on a substrate, fine particles in the resultant applied layer are heated to a temperature of 350°C or lower in an atmosphere containing a vapor or gas of a compound having reducing ability to thereby reduce the oxidized film through the reduction utilizing said compound having reducing ability as a reducing agent, and then, carrying out a series of heating steps comprising repeating a heating treatment combining a oxidation treatment for a short time and a re-reduction treatment and forming a sintered product from the resultant copper particles. A fine copper particle sintered product type of electric conductor having a fine shape formed by the above method exhibits excellent elctroconductivity.
    • 一种形成微细的铜微粒烧结体型导电体的方法,其特征在于,通过使用其表面上具有氧化膜的铜粒子的分散体,然后以较低的比例, 在其表面具有氧化膜层的微细铜颗粒或所得图案中的细小的氧化铜颗粒进行还原处理,并且所得的细铜颗粒在一个实施方案中被烧结,所述细铜颗粒具有 将表面上的氧化膜层或平均粒径为10μm以下的细小的氧化铜微粒施加到基板上,将得到的涂覆层中的微粒在含有 具有降低能力的化合物的蒸气或气体,从而通过还原能力降低氧化膜,从而还原能力 然后进行一系列加热步骤,包括重复加热处理,结合短时间的氧化处理和再还原处理,并从所得到的铜颗粒形成烧结产物。 通过上述方法形成的具有微细形状的细铜颗粒烧结产品类型的导电体具有优异的电导性。
    • 4. 发明公开
    • 도전성 금속 페이스트
    • 导电金属膏
    • KR1020070028568A
    • 2007-03-12
    • KR1020077001482
    • 2004-06-23
    • 하리마 카세이 가부시키가이샤
    • 우에다마사유키사이토히로시호소야카즈오하타노리아키마츠바요리시게
    • H01B1/22
    • A conductive metal paste that excels in adherence to a surface of foundation substrate, for example, glass substrate, having satisfactory conductivity and that can be used in the formation of a layer of metal microparticles sintered. There is provided a conductive metal paste comprising, per 100 parts by mass of metal microparticles of 1 to 100 nm average particle diameter, 10 to 60 parts by mass of the sum of at least one compound for use in a coating molecular layer disposed on the surface of metal microparticles and having a group capable of coordinate bonding by lone electron pair of nitrogen, oxygen or sulfur atom to metal elements contained in the metal microparticles; 0.3 to 7 parts by mass, in terms of the sum of metals contained in the metal compound, of at least one metal compound which when heated to 250‹C or higher, can be reduced to thereby precipitate metal atoms; and 100 to 500 parts by mass, per 10 parts by mass of the sum of metals contained in the metal compound, of an amine solvent capable of dissolving the metal compound; wherein all of these components are uniformly dissolved and dispersed in an organic solvent as a dispersion solvent for the metal microparticles. ® KIPO & WIPO 2007
    • 一种导电性金属糊剂,其具有良好的导电性,可以用于形成金属微粒烧结层的基础基材的表面,例如玻璃基板的表面。 提供了一种导电性金属糊剂,其特征在于,相对于100质量份的平均粒径为1〜100nm的金属微粒,含有10〜60质量份的至少1种化合物之和 具有能够通过氮,氧或硫原子的孤电子对与金属微粒中所含的金属元素配位的基团的金属微粒的表面; 0.3〜7质量份,以金属化合物中所含的金属的总和计,加热至250℃以上时的至少一种金属化合物可被还原,从而析出金属原子; 相对于金属化合物中含有的金属的总和,可以溶解金属化合物的胺溶剂相对于100质量份〜500质量份, 其中所有这些组分均匀溶解并分散在作为金属微粒分散溶剂的有机溶剂中。 ®KIPO&WIPO 2007