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1. 发明公开

KR1020070065789A 회로판 및 그 제조방법 无效
标题翻译：电路板结构及其制作方法
公开(公告)号：KR1020070065789A
公开(公告)日：2007-06-25
申请号：KR1020060120239
申请日：2006-11-30
申请人： 피닉스 프리시젼 테크날로지 코포레이션
发明人： 왕싱-루 , 왕시엔쇼우 , 츄시-핑
IPC分类号： H05K3/40
CPC分类号： H05K3/4682 , H05K1/115 , H05K1/185 , H05K3/064 , H05K3/4038
摘要： A circuit board and a fabricating method thereof are provided to fabricate the circuit board without using a core, thereby effectively decreasing a thickness of the circuit board and thus easily diminish a size of a package product. A carrier board made of metal is prepared. An insulation protective layer is formed on one side of the carrier board, and plural openings are formed on the insulation protection to expose a portion of the carrier substrate. A circuit structure is formed on a surface of the insulation protective layer and in the opening. A dielectric layer is formed on the insulation protective layer and the circuit structure, and an opening is formed on the dielectric layer to expose the circuit structure.
摘要翻译：提供一种电路板及其制造方法来制造电路板而不使用芯，从而有效地减小电路板的厚度，从而容易减小包装产品的尺寸。准备了金属制的载板。绝缘保护层形成在承载板的一侧上，并且在绝缘保护件上形成多个开口以露出载体基板的一部分。电路结构形成在绝缘保护层的表面和开口中。在绝缘保护层和电路结构上形成电介质层，在电介质层上形成开口以露出电路结构。

2. 发明公开

KR1020110003453A 회로판 및 그 제조방법 无效
标题翻译：电路板结构及其制作方法
公开(公告)号：KR1020110003453A
公开(公告)日：2011-01-12
申请号：KR1020100132506
申请日：2010-12-22
申请人： 피닉스 프리시젼 테크날로지 코포레이션
发明人： 왕싱-루 , 왕시엔쇼우 , 츄시-핑
IPC分类号： H05K3/40
摘要： PURPOSE: A circuit board and a manufacturing method thereof are provided to increase an electrical function by reducing the thickness of a circuit board and a package size. CONSTITUTION: An insulating protective layer(31) is formed in one side of a support substrate. A plurality of openings are formed on the insulating protective layer in order to expose a part of the support substrate. A circuit structure is formed on the surface of the insulating protective layer and inside the opening. A first dielectric layer is formed in the insulating protective layer and the circuit structure. The opening is formed in the first dielectric layer in order to expose a pattern circuit layer(33). A build-up structure, which includes a plurality of second conductive penetration holes, is formed in the first dielectric layer. The connection pad of the build-up structure is electrically connected to a semiconductor device. The support substrate is removed in order to expose the lower side of the first conductive penetration hole.
摘要翻译：目的：提供电路板及其制造方法，以通过减小电路板的厚度和封装尺寸来增加电功能。构成：在支撑基板的一侧形成绝缘保护层（31）。在绝缘保护层上形成多个开口，以露出支撑基板的一部分。电路结构形成在绝缘保护层的表面和开口内部。在绝缘保护层和电路结构中形成第一电介质层。为了露出图形电路层（33），在第一电介质层中形成开口。在第一介电层中形成包括多个第二导电穿透孔的堆积结构。积层结构的连接焊盘电连接到半导体器件。为了暴露第一导电穿透孔的下侧，移除支撑基板。

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