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1. 发明授权

KR100452469B1 고체 전해 콘덴서 및 그 제조 방법 失效
标题翻译： 고체전해콘덴서및그제조방법
公开(公告)号：KR100452469B1
公开(公告)日：2004-10-08
申请号：KR1020010065680
申请日：2001-10-24
申请人： 파나소닉 주식회사
发明人： 우에니시요시츠구 , 나카무라츠네시 , 오모리미노루 , 가도야마사시 , 히구치요시히로 , 요시노츠요시
IPC分类号： H01G9/012
CPC分类号： H01G9/012
摘要： A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.
摘要翻译：通过简单的电镀构造可获得具有优异的焊料润湿性和耐热粘合性的固体电解电容器及其制造方法。电容器包括电容器元件，正电极端子和负电极端子。正电极端子和负电极端子包括含有（i）从由镍，镍合金，铜和铜合金组成的组中选择的至少一种，（ii）锡或锡合金的第一镀层的金属构件，（iii）在所述金属构件和所述第一镀层之间形成的金属间化合物层。金属间化合物层包含通过对设置在第一镀层上的金属构件进行热回流处理而形成的锡 - 镍或锡 - 铜。

2. 发明公开

KR1020020032368A 고체 전해 콘덴서 및 그 제조 방법 失效
标题翻译：固体电解电容器及其制造方法
公开(公告)号：KR1020020032368A
公开(公告)日：2002-05-03
申请号：KR1020010065680
申请日：2001-10-24
申请人： 파나소닉 주식회사
发明人： 우에니시요시츠구 , 나카무라츠네시 , 오모리미노루 , 가도야마사시 , 히구치요시히로 , 요시노츠요시
IPC分类号： H01G9/012
CPC分类号： H01G9/012
摘要： PURPOSE: To provide a solid electrolytic capacitor which is superior in performance using a simple plating constitution, by solving the problem of plating treatment for a terminal being complicated and not being proper in soldering wettability and heat-resistant adhesion, in a surface packaging type solid electrolytic capacitor, and to provide its manufacturing method. CONSTITUTION: Anode/cathode terminals 3, 4 connected to a capacitor element 1 are constituted to be provided with an intermetallic compound layer of tin- nickel located between a plate-like metallic member and a tin plating layer, by forming a tin plating layer directly in a plate-like member, consisting of nickel or iron-nickel alloy without foundation and performing reflow treatment on it. Thereby, a solid electrolytic capacitor which is superior in soldering wettability and heat-resistant adhesion using a simple constitution, and its manufacturing method can be provided.
摘要翻译：目的：为了提供一种使用简单的电镀结构而具有优异性能的固体电解电容器，通过解决表面封装型固体中难以复杂且不适合焊接润湿性和耐热粘附性的端子的电镀处理问题电解电容器，并提供其制造方法。构成：连接到电容器元件1的阳极/阴极端子3,4构成为通过直接形成锡镀层而形成位于板状金属构件和镀锡层之间的锡镍金属间化合物层在板状构件中，由没有基底的镍或铁镍合金组成，并对其进行回流处理。因此，可以提供一种使用简单结构具有优异的焊接润湿性和耐热粘附性的固体电解电容器及其制造方法。

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