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1. 发明授权

KR102028743B1 전자부품 실장장치 및 전자부품 실장방법 有权
公开(公告)号：KR102028743B1
公开(公告)日：2019-10-04
申请号：KR1020120111346
申请日：2012-10-08
申请人： 쥬키 가부시키가이샤
发明人： 후지모토,카즈야 , 사토,요시타카 , 이케베,히토시 , 타카하시,마사토 , 사이토,아카리 , 코다마,유스케 , 타카하시,히로시 , 사토,유스케 , 코바야시,히토시
IPC分类号： H05K13/08 , H05K13/04 , G01B11/02

2. 发明授权

KR101893213B1 전자부품 실장장치 및 전자부품 실장방법 有权
公开(公告)号：KR101893213B1
公开(公告)日：2018-08-29
申请号：KR1020120019184
申请日：2012-02-24
申请人： 쥬키 가부시키가이샤
发明人： 사이토,아카리 , 타카하시,카즈요시
IPC分类号： H05K13/04
摘要： 본발명은효율적이면서높은정밀도로부품인식·부품탑재를수행할수 있는전자부품실장장치및 전자부품실장방법을제공한다. 전자부품을회로기판(5)에대한탑재각도가큰 순서대로소트하여전자부품의흡착순서를결정하는동시에, 각전자부품을흡착한후에회전시키는양을각각결정한다. 이회전량은, 모든전자부품을순차적으로흡착·회전한결과, 모든전자부품의흡착자세가각각의탑재자세가되도록결정한다. 그리고, 모든전자부품을흡착한후, 흡착노즐에흡착된탑재자세의전자부품을순차적으로비전인식하고, 그인식결과에근거하여, 회로기판(5)위의소정의탑재위치에전자부품을순차적으로탑재한다.

3. 发明公开

KR1020130038176A 전자부품 실장장치 및 전자부품 실장방법 审中-实审
标题翻译：电子元件安装设备和电子元件安装方法
公开(公告)号：KR1020130038176A
公开(公告)日：2013-04-17
申请号：KR1020120111346
申请日：2012-10-08
申请人： 쥬키 가부시키가이샤
发明人： 후지모토,카즈야 , 사토,요시타카 , 이케베,히토시 , 타카하시,마사토 , 사이토,아카리 , 코다마,유스케 , 타카하시,히로시 , 사토,유스케 , 코바야시,히토시
IPC分类号： H05K13/04 , G01B11/00
摘要： PURPOSE: An electronic component mounting apparatus and an electronic component mounting method are provided to accurately arrange electronic components on a substrate having a through hole. CONSTITUTION: An electronic component mounting apparatus supplies an electronic component(80) having a lead line. A head main body(30) includes a head supporter(31), a nozzle(32), and a nozzle driving part(34). The nozzle adsorbs the electrical component supplied from the electronic component mounting apparatus. A photographing device(36) is fixed to the head supporter and photographs a substrate. A laser recognition apparatus(38) includes a light source(38a) and a light receiving element(38b). A control unit(60) controls the head main body, the photographing device, and the component support unit. [Reference numerals] (60) Control unit; (62) Head control unit; (64) Component supply control unit; (AA) Z axis direction; (BB) Y axis direction;
摘要翻译：目的：提供电子部件安装装置和电子部件安装方法，以将电子部件精确地配置在具有通孔的基板上。构成：电子部件安装装置供给具有引线的电子部件（80）。头主体（30）包括头部支撑件（31），喷嘴（32）和喷嘴驱动部分（34）。喷嘴吸附从电子部件安装装置供给的电气部件。拍摄装置（36）固定到头部支撑件上并拍摄基板。激光识别装置（38）包括光源（38a）和光接收元件（38b）。控制单元（60）控制头主体，拍摄装置和部件支撑单元。（附图标记）（60）控制单元; （62）头控制单元; （64）组件供应控制单元; （AA）Z轴方向; （BB）Y轴方向;

4. 发明公开

KR1020120098497A 전자부품 실장장치 및 전자부품 실장방법 审中-实审
标题翻译：电子元件安装设备和电子元件安装方法
公开(公告)号：KR1020120098497A
公开(公告)日：2012-09-05
申请号：KR1020120019184
申请日：2012-02-24
申请人： 쥬키 가부시키가이샤
发明人： 사이토,아카리 , 타카하시,카즈요시
IPC分类号： H05K13/04 , H05K13/02
摘要： PURPOSE: An electronic component mounting apparatus and an electronic component mounting method are provided to reduce the load of a motor or an electronic component by reducing a rotation operation. CONSTITUTION: A rotation angle is determined in an absorption order of an electronic component(S1). A component absorbing unit absorbs the electronic component according to an absorption order(S3). A component rotating unit rotates a nozzle shaft whenever absorbing an electronic component(S2,S4). A component recognizing unit absorbs the electronic component through the component absorbing unit. The component recognizing unit recognizes an electronic component(S7). A component mounting unit mounts an electronic component(S8). [Reference numerals] (S1) An absorbing sequence is determined; (S2) The amount of rotation is determined; (S3) A component is absorbed; (S4) An absorbing nozzle is rotated at θ; (S5) The next absorbing component is designated; (S6) Does it absorb all components?; (S7) Component recognition; (S8) Component installation
摘要翻译：目的：提供电子部件安装装置和电子部件安装方法，通过减少旋转操作来减小电动机或电子部件的负载。构成：以电子部件的吸收顺序决定旋转角度（S1）。元件吸收单元根据吸收顺序吸收电子元件（S3）。每当吸收电子部件时，部件旋转单元旋转喷嘴轴（S2，S4）。元件识别单元通过元件吸收单元吸收电子元件。元件识别单元识别电子元件（S7）。部件安装单元安装电子部件（S8）。 [参考数字]（S1）确定吸收顺序; （S2）确定旋转量; （S3）吸收成分; （S4）吸收喷嘴旋转（S5）指定下一个吸收部件; （S6）吸收所有组分？（S7）组件识别; （S8）组件安装

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