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    • 1. 发明公开
    • 도전성 수지 분말의 제조방법
    • 导电树脂粉末的制备方法
    • KR1020030094867A
    • 2003-12-18
    • KR1020020032196
    • 2002-06-08
    • 주식회사 토리컴
    • 주완규곽순종이상진정종헌김광욱김규식
    • C08J7/06
    • PURPOSE: A method for preparing a conductive resin powder, a conductive resin powder prepared by the method and an anisotropic conductive film prepared by using the resin powder are provided, to improve the uniformity and thickness precision of metal coating on resin powder. CONSTITUTION: The method comprises the steps of inputting resin powder into a vacuum chamber; and sputtering the resin powder by generating a metal element from a metal target by a low temperature plasma with flowing the resin powder to form a metal coating on the resin powder and continuously flowing an inert gas such as argon or nitrogen in the vacuum chamber whose pressure is maintained to be 10¬-7 to 10¬-1 Torr. Preferably the deposition velocity of the metal coating is 1 nm/min or more, and the thickness of the metal coating is about 10-100 nm.
    • 目的:提供一种制备导电树脂粉末的方法,通过该方法制备的导电树脂粉末和使用该树脂粉末制备的各向异性导电膜,以提高树脂粉末上的金属涂层的均匀性和厚度精度。 构成:该方法包括将树脂粉末输入真空室的步骤; 并通过使树脂粉末流动而在金属靶上产生金属元素,在树脂粉末上形成金属涂层并在惰性气体例如氩气或氮气中连续流过真空室内的压力 维持在10 -7至10 -1托。 优选地,金属涂层的沉积速度为1nm / min或更高,并且金属涂层的厚度为约10-100nm。