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    • 2. 发明公开
    • 반도체 발광소자 패키지
    • 半导体发光器件封装
    • KR1020100035754A
    • 2010-04-07
    • KR1020080095086
    • 2008-09-29
    • 주식회사 에피밸리
    • 김동설김창태
    • H01L33/52H01L33/62
    • PURPOSE: A semiconductor light emitting device package is provided to prevent moisture and gas form penetrating by forming a penetration path of gas or moisture by including an inner dam, an outer dam, and a groove in a molded frame. CONSTITUTION: A heat sink(10) discharges heat generated from a semiconductor light emitting device(20). A lead frame supplies electricity to the semiconductor light emitting device. A light-transmitting mold compound is located on the top of the semiconductor light emitting device. A molded frame(50) fixes the heat sink and the lead frame. The molded frame comprises an inner dam(51) so that a phosphor layer(60) is located only around the semiconductor light emitting device.
    • 目的:提供半导体发光器件封装,通过在模制框架中包括内坝,外坝和沟槽,通过形成气体或水分的穿透路径来防止水分和气体的形成。 构成:散热器(10)对从半导体发光器件(20)产生的热量进行放电。 引线框架为半导体发光器件供电。 透光模具化合物位于半导体发光器件的顶部。 模制框架(50)固定散热器和引线框架。 模制框架包括内部水坝(51),使得荧光体层(60)仅位于半导体发光器件的周围。
    • 4. 发明授权
    • 발광소자 패키지의 제조 방법
    • 形成发光装置封装的方法
    • KR100985720B1
    • 2010-10-06
    • KR1020090062980
    • 2009-07-10
    • 주식회사 에피밸리
    • 김창태안현수이태희김현석김동설
    • H01L33/62H01L21/78
    • PURPOSE: A method for manufacturing a light emitting device package is provided to reduce the number of wire bonding parts by connecting an electrode through a pad metal. CONSTITUTION: An n type group III nitride semiconductor layer(21) is formed on a substrate(11). An active layer(31) and a p type group III nitride semiconductor layer(41) are grown. A photoresist pattern is formed on the active layer and the p type group III nitride semiconductor layer to expose the n type group III nitride semiconductor layer. A photoresist pattern is formed on the exposed n type group III nitride semiconductor layer and a p type group III nitride semiconductor layer. The group III nitride semiconductor layers laminated on the substrate is electrically separated from the group III nitride semiconductor layers laminated on the same substrate. An ITO(51) is laminated on the n type group III nitride semiconductor layer and the p type group III nitride semiconductor layer. A passivation layer(61) is formed. A pad metal(71) is deposited by using an E-beam evaporator.
    • 目的:提供一种用于制造发光器件封装的方法,以通过焊垫金属连接电极来减少引线接合部件的数量。 构成:在基板(11)上形成n型III族氮化物半导体层(21)。 生长活性层(31)和p型III族氮化物半导体层(41)。 在有源层和p型III族氮化物半导体层上形成光致抗蚀剂图案,以露出n型III族氮化物半导体层。 在曝光的n型III族氮化物半导体层和p型III族氮化物半导体层上形成光致抗蚀剂图案。 层叠在基板上的III族氮化物半导体层与层叠在同一基板上的III族氮化物半导体层电分离。 在n型III族氮化物半导体层和p型III族氮化物半导体层上层叠ITO(51)。 形成钝化层(61)。 通过使用电子束蒸发器沉积垫金属(71)。