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    • 4. 发明公开
    • 전도성 조성물 및 플라즈마 디스플레이의 배면 기판의 제조방법
    • 制造导电组合物的方法和等离子显示器的后基板
    • KR1020070001824A
    • 2007-01-04
    • KR1020060058680
    • 2006-06-28
    • 이 아이 듀폰 디 네모아 앤드 캄파니
    • 조,용우이,지연츠치야,모토히코
    • H01B1/14H01J11/34H01J9/02
    • H01J9/242H01B1/16H01J11/12H01J11/26H01J11/36H01J2211/225
    • Provided are a conductive composition which is excellent in etchant resistance and is used to form a partition wall by chemical etching, an electrode formed by using the composition, a method for preparing a rear substrate of a plasma display by using the composition, and a plasma display panel containing the rear substrate. The conductive composition comprises a silver powder having an average diameter of 1.0-2.5 micrometers; and a lead-containing glass frit in a ratio of 99.25 : 0.75 to 94.0 : 6.0. Preferably the lead-containing glass frit has a softening point of 430-510 deg.C. The method comprises the steps of forming an address electrode on a rear substrate by using the composition; forming a layer comprising a partition wall material on the rear substrate; and chemically etching the layer comprising a partition wall material to form a partition wall.
    • 提供一种导电性组合物,其耐腐蚀性优异,用于通过化学蚀刻形成隔壁,使用该组合物形成的电极,使用该组合物制备等离子体显示器的后基板的方法,以及等离子体 显示面板包含后基板。 导电组合物包含平均直径为1.0-2.5微米的银粉; 和含铅玻璃料,比例为99.25:0.75至94.0:6.0。 优选含铅玻璃料的软化点为430-510℃。 该方法包括以下步骤:通过使用该组合物在后衬底上形成寻址电极; 在所述后基板上形成包括隔壁材料的层; 以及化学蚀刻包含隔壁材料的层以形成分隔壁。