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1. 发明公开

KR1020090011981A 실납링을 이용한 접속단자 납땜 기술 无效
标题翻译：连接端子焊接技术，使用WIRESOLDER环（圆形）
公开(公告)号：KR1020090011981A
公开(公告)日：2009-02-02
申请号：KR1020070076082
申请日：2007-07-28
申请人： 유지컴 주식회사
发明人： 윤태진
IPC分类号： B23K1/002
摘要： A connection terminal soldering technique using a thin lead ring is provided to allow a user to evenly brazing and adjust excess or deficiency with thick of the thin lead ring and to prevent lead abusing. A connection terminal soldering technique using a thin lead ring comprises a step of putting the thin lead ring(6) on a portion, where solder is processed, soldering with hot-air bower after processing the thin lead ring with a shape of round or a terminal for general soldering and a step of adjusting excess or deficiency according to the terminal for soldering with thick of the thin lead ring. The thick of the thin lead ring is the thicker, the amount of lead is the bigger and getting the thinner, the smaller. Flux obligatorily used when brazing is no need to be coated with the separate flux since using the flux giving in the thin lead ring.
摘要翻译：提供使用薄引线环的连接端子焊接技术，以允许用户均匀地钎焊和调整厚度较薄的引线环的过量或不足，并防止引线滥用。使用薄引线环的连接端子焊接技术包括以下步骤：将薄引线环（6）放置在焊料被处理的部分上，在加工薄导线环之后用热风焊接焊接，其形状为圆形或用于一般焊接的端子，以及根据端子进行过量或不足的调整的步骤，以用薄的铅环的厚度进行焊接。薄铅环的厚度越厚，铅的量越大越薄越小。钎焊时强制使用的助焊剂不需要涂覆单独的助焊剂，因为使用提供薄引线环的焊剂。

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