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    • 1. 发明公开
    • 수지도포 시스템
    • 涂料树脂系统
    • KR1020070116704A
    • 2007-12-11
    • KR1020060074254
    • 2006-08-07
    • 아스리트 에프에이 가부시키가이샤
    • 도바시요시히로
    • B05D1/26B05C5/02
    • A resin application system is provided to reduce an installation area by separately installing first and second handling lanes about a boundary and to execute small quantity batch production by forming a boundary barrier dividing first and second carrying lanes. A resin application system(1) for applying resin on first and second substrates(2A,2B) delivered in a predetermined access direction and then hardening the applied resin is composed of: a first handling lane(8A) having a first carrying lane(90A) for hardening the resin applied on the first substrate by heating; a second handling lane(8B) having a second carrying lane(90B) for hardening the resin applied on the second substrate by heating; and a boundary barrier(92) for dividing the first and second carrying lanes.
    • 提供树脂施加系统以通过在边界附近分开安装第一和第二处理车道来减少安装面积,并通过形成边界屏障分割第一和第二承载车道来执行小批量生产。 一种树脂施加系统(1),其特征在于,在预定的进入方向上输送的第一和第二基板(2A,2B)上施加树脂,然后硬化所施加的树脂的树脂施加系统(1)包括:第一搬运车道(8A) ),用于通过加热硬化施加在第一基板上的树脂; 具有用于通过加热硬化施加在第二基板上的树脂的第二运送通道(90B)的第二处理通道(8B) 以及用于分割第一和第二承载通道的边界屏障(92)。
    • 2. 发明公开
    • 수지도포 시스템
    • 涂料树脂系统
    • KR1020070116705A
    • 2007-12-11
    • KR1020060074262
    • 2006-08-07
    • 아스리트 에프에이 가부시키가이샤
    • 도바시요시히로
    • B05D1/26B05C5/02
    • A resin application system is provided to make the structure small in a longitudinal direction orthogonal to the carrying direction of a substrate even if two handling lanes are installed, by disposing at least a portion of a first moving instrument at the lower side of a first carrying path and at least a portion of a second moving instrument at the lower side of a second carrying path. A resin application system is composed of a resin applying apparatus for applying resin on a substrate carried in a predetermined direction and a resin hardening apparatus for hardening the resin applied on the substrate. The resin applying apparatus comprises a substrate carrying path(48A); a resin applying instrument(52A) for spreading the resin on the substrate; and a moving instrument(67A) for moving the resin applying instrument. At least a portion of the moving instrument is disposed at the lower side of the carrying path.
    • 提供一种树脂施加系统,即使在安装有两个处理通道的情况下,也可以通过将第一移动工具的至少一部分设置在第一承载的下侧,使得结构在与基板的传送方向正交的纵向方向上较小 路径和第二运送工具的至少一部分位于第二运送路径的下侧。 树脂施加系统由用于在预定方向承载的基板上施加树脂的树脂施加装置和用于硬化施加在基板上的树脂的树脂硬化装置构成。 树脂施加装置包括基板承载路径(48A); 用于将树脂铺展在基材上的树脂施加器具(52A) 和用于移动树脂施加装置的移动工具(67A)。 移动工具的至少一部分设置在承载路径的下侧。