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1. 发明公开

KR1020020021065A 열차단 구조물용 조성물 无效
标题翻译：用于热切割结构的组合物
公开(公告)号：KR1020020021065A
公开(公告)日：2002-03-18
申请号：KR1020010056209
申请日：2001-09-12
申请人： 썸-오-디스크, 인코퍼레이티드
发明人： 허드슨,크리스틴엠.
IPC分类号： H01H37/36
CPC分类号： C07D207/404 , C07D209/08 , C07D213/82 , C07D231/12 , C07D233/64 , C07D235/18 , C07D239/47 , C07D239/48 , C07D239/62 , C07D241/44 , C07D251/18 , C07D311/20 , C07D409/12 , C07D473/04 , H01H37/765 , H01H2037/768
摘要： PURPOSE: A composition for thermal cutoff construction is provided to obtain an accurate thermal cutoff temperature, and while achieving improved chemical and thermal stability. CONSTITUTION: A thermal cutoff composition comprises a combination of two or more kinds of organic compounds. The organic compound has a melting point of approximately 300°C or lower, and the difference between the melting points of two or more kinds of organic compounds is approximately 100°C or lower. The thermal cutoff composition made by the combination of organic compounds, has a melting point lower than the melting point of the organic compound before being combined. A thermal cutoff construction(10) includes a conductive metallic casing(11) having a metallic conductor(12) connected to an end(13) of the casing. A ceramic end plug(14) is disposed at an open end(15) of the casing, and sealed by an epoxy sealing portion(28). A metallic conductor(17) has an extended head(18) disposed in an end(19) of the end plug and an end(20) protruded from an outer end(21) of the end plug.
摘要翻译：目的：提供一种用于热切断结构的组合物，以获得准确的热切断温度，同时实现改善的化学和热稳定性。构成：热切断组合物包含两种或更多种有机化合物的组合。有机化合物的熔点为约300℃以下，两种以上的有机化合物的熔点之差约为100℃以下。由有机化合物的组合制成的热切断组合物的熔点低于组合前的有机化合物的熔点。热切断构造（10）包括具有连接到壳体的端部（13）的金属导体（12）的导电金属壳体（11）。陶瓷端塞（14）设置在壳体的开口端（15）处，并被环氧树脂密封部分（28）密封。金属导体（17）具有设置在端塞的端部（19）中的延伸头（18）和从端塞的外端（21）突出的端部（20）。

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