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1. 发明授权

KR101909914B1 경화성 조성물, 반도체 장치, 및 에스테르결합함유 유기규소 화합물 有权
公开(公告)号：KR101909914B1
公开(公告)日：2018-10-19
申请号：KR1020167019055
申请日：2014-12-03
申请人： 신에쓰 가가꾸 고교 가부시끼가이샤
发明人： 오자이,토시유키 , 모테키,마사나리
IPC分类号： C08G77/50 , C07F7/08 , C07F7/21 , C08G77/12 , C08G77/52 , C08G77/60 , C08K5/54 , C08K5/5435 , C08K5/56 , C08L83/16 , H01L33/56
CPC分类号： C08G77/14 , C07F7/081 , C07F7/21 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/52 , C08G77/60 , C08G77/80 , C08K5/54 , C08K5/5435 , C08K5/56 , H01L33/56 , C08L83/16
摘要： 본발명은, (A)하기일반식(1)로표시되고, 부가반응성탄소-탄소이중결합을 1분자중에 2개이상갖는에스테르결합함유유기규소화합물, (B)규소원자에결합한수소원자를 1분자중에 2개이상갖는규소화합물, 및 (C)하이드로실릴화반응촉매를포함하는경화성조성물이다. 이에따라, 가스투과성이낮고, 내크랙성및 광투과성이우수한경화물을부여하는경화성조성물이제공된다. [화학식 1]

2. 发明授权

KR102149219B1 프라이머 조성물 및 그것을 이용한 광반도체 장치 有权
公开(公告)号：KR102149219B1
公开(公告)日：2020-08-31
申请号：KR1020140007577
申请日：2014-01-22
申请人： 신에쓰 가가꾸 고교 가부시끼가이샤
发明人： 오자이,도시유키 , 모테키,마사나리 , 이케노,마사유키
IPC分类号： C09J133/04 , H01L21/02

3. 发明公开

KR1020160119762A 경화성 조성물, 반도체 장치, 및 에스테르결합함유 유기규소 화합물 审中-实审
标题翻译：可固化组合物半导体器件和含酯键的有机硅化合物
公开(公告)号：KR1020160119762A
公开(公告)日：2016-10-14
申请号：KR1020167019055
申请日：2014-12-03
申请人： 신에쓰 가가꾸 고교 가부시끼가이샤
发明人： 오자이,토시유키 , 모테키,마사나리
IPC分类号： C08G77/50 , C07F7/08 , C07F7/21 , C08G77/12 , C08G77/52 , C08G77/60 , C08K5/54 , C08K5/5435 , C08K5/56 , C08L83/16 , H01L33/56
CPC分类号： C08G77/14 , C07F7/0818 , C07F7/21 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/52 , C08G77/60 , C08G77/80 , C08K5/54 , C08K5/5435 , C08K5/56 , H01L33/56 , C08L83/16
摘要： 본발명은, (A)하기일반식(1)로표시되고, 부가반응성탄소-탄소이중결합을 1분자중에 2개이상갖는에스테르결합함유유기규소화합물, (B)규소원자에결합한수소원자를 1분자중에 2개이상갖는규소화합물, 및 (C)하이드로실릴화반응촉매를포함하는경화성조성물이다. 이에따라, 가스투과성이낮고, 내크랙성및 광투과성이우수한경화물을부여하는경화성조성물이제공된다. [화학식 1]

4. 发明公开

KR1020140095983A 프라이머 조성물 및 그것을 이용한 광반도체 장치 审中-实审
标题翻译：使用该组合物的聚合物组合物和光学半导体器件
公开(公告)号：KR1020140095983A
公开(公告)日：2014-08-04
申请号：KR1020140007577
申请日：2014-01-22
申请人： 신에쓰 가가꾸 고교 가부시끼가이샤
发明人： 오자이,도시유키 , 모테키,마사나리 , 이케노,마사유키
IPC分类号： C09J133/04 , H01L21/02
CPC分类号： H01L33/56 , C08L2312/08 , C09J143/04 , H01L2224/48091 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a primer composition for preventing corrosion of a metal electrode formed on a substrate and improving heat resistance of a primer by improving adhesiveness of a substrate on which an optical semiconductor device is mounted with a cured product of an addition reaction curing type silicone composition for sealing the optical semiconductor device. In addition, the present invention provides a primer composition for attaching a substrate on which an optical semiconductor device is mounted with a cured product of an addition reaction curing type silicone composition for sealing the optical semiconductor device, including (A) an acryl resin including one or two of acrylic acid ester and methacrylic acid ester containing at least one of SiCH=CH_2 group in one molecule, and (B) a solvent.
摘要翻译：本发明提供了一种底漆组合物，其用于防止形成在基材上的金属电极的腐蚀，并且通过提高其上安装有光学半导体器件的基板与加成反应固化型硅氧烷的固化产物的粘附性来改善底漆的耐热性用于密封光学半导体器件的组合物。此外，本发明提供了一种用于将其上安装有光学半导体器件的基板与用于密封光学半导体器件的加成反应固化型硅氧烷组合物的固化产物相连的底漆组合物，其包括（A）包含一种或两个在一个分子中含有至少一个SiCH = CH 2基团的丙烯酸酯和甲基丙烯酸酯，和（B）溶剂。

5. 发明公开

KR1020140017447A 부가 경화형 실리콘 조성물, 및 상기 조성물의 경화물에 의해 반도체 소자가 피복된 반도체 장치 审中-实审
标题翻译：具有可固化硅酮组合物的半导体器件和具有固化组合物固化的半导体元件的半导体器件
公开(公告)号：KR1020140017447A
公开(公告)日：2014-02-11
申请号：KR1020130090724
申请日：2013-07-31
申请人： 신에쓰 가가꾸 고교 가부시끼가이샤
发明人： 오자이,도시유키 , 모테키,마사나리
IPC分类号： C08L83/04 , C08G77/04 , H01L23/29
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： The present invention relates to an addition-curable silicon composition, which has low viscosity, good filling performance, good curing performance, high refractive index due to curing, light transmissivity, high adhesion to a substrate, excellent crack resistance, low gas permeability, and a semiconductor device with an excellent reliability which has semiconductor elements coated with the cured product of the composition. The addition-curable silicon composition comprises: (A) 100 parts by weight of an organopolysiloxane represented by chemical formula (1); (B) 1-500 parts by weight of an organopolysiloxane represented by chemical formula (2); and (C) 1-200 parts by weight based on the sum of (A)+(B) 100 parts by weight of an organohydrogen polysiloxane with at least two Si-H couplings among one molecule represented by chemical formula (3); and a catalyst for hydrosilylation with an amount capable of accelerating the curing of the composition.
摘要翻译：本发明涉及粘度低，填充性好，固化性能好，固化性高的折射率，透光性，对基材的高附着性，优异的耐龟裂性，低透气性，和具有优异可靠性的半导体器件，其半导体元件涂覆有该组合物的固化产物。加成固化型硅组合物包含：（A）100重量份由化学式（1）表示的有机聚硅氧烷; （B）1-500重量份由化学式（2）表示的有机聚硅氧烷; 和（C）基于化学式（3）表示的一个分子中的（A）+（B）100重量份的有机氢聚硅氧烷与至少两个Si-H偶联的总和为1-200重量份; 以及能够加速组合物固化的量的氢化硅烷化催化剂。

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