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1. 发明公开

KR1020140067437A ＣＭＯＳ 이미지 센서를 테스트하는 테스트 시스템 및 이의 구동 방법 审中-实审
标题翻译：测试系统测试CMOS图像传感器及其驱动方法
公开(公告)号：KR1020140067437A
公开(公告)日：2014-06-05
申请号：KR1020120134684
申请日：2012-11-26
申请人： 삼성전자주식회사
发明人： 류형선 , 김장환 , 용형중 , 윤지녕 , 이대희 , 이성관 , 장연봉 , 정신기
IPC分类号： G01R31/3183
CPC分类号： G01R31/2889
摘要： According to the embodiment of the present invention, a test system includes: a test device configured to transmit an input signal and a control signal to at least one complementary metal-oxide semiconductor (CMOS) image sensor via a probe card, and an interface board configured to map the probe card and the test device, wherein the interface board includes an output receiver configured to receive an image signal from the CMOS image sensor and to transform the image signal into an image data.
摘要翻译：根据本发明的实施例，一种测试系统包括：被配置为经由探针卡向至少一个互补金属氧化物半导体（CMOS）图像传感器传输输入信号和控制信号的测试装置，以及接口板被配置为映射所述探针卡和所述测试装置，其中所述接口板包括被配置为从所述CMOS图像传感器接收图像信号并将所述图像信号变换为图像数据的输出接收器。

2. 发明公开

KR1020030054887A 반도체 웨이퍼 마킹 시스템 및 그 제어방법 无效
标题翻译：半导体波形标记系统及其控制方法
公开(公告)号：KR1020030054887A
公开(公告)日：2003-07-02
申请号：KR1020010085319
申请日：2001-12-26
申请人： 삼성전자주식회사
发明人： 장연봉 , 김민기 , 현창훈
IPC分类号： H01L21/02
摘要： PURPOSE: A semiconductor wafer marking system and a controlling method thereof are provided to form uniformly sizes of marks within a wafer region by restraining an inking operation in the outside of the wafer region. CONSTITUTION: A semiconductor wafer marking system includes an inker(50), a sensing portion(10), a computer(30), an inking control circuit(20), and an inker driving circuit(40). The sensing portion senses a position of the inker and generates a sensing signal. The computer generates the first inking control signal. The inking control circuit receives the sensing signal from the sensing portion and the first inking control signal from the computer, and generates the second inking control signal. The inker driving circuit receives the second inking control signal from the inking control circuit in order to drive the inker.
摘要翻译：目的：提供半导体晶片标记系统及其控制方法，通过限制晶片外部的上墨操作来形成晶片区域内的标记的均匀尺寸。构成：半导体晶片标记系统包括墨水（50），感测部分（10），计算机（30），墨水控制电路（20）和墨水驱动电路（40）。感测部分感测着墨机的位置并产生感测信号。计算机生成第一个上墨控制信号。上墨控制电路从计算机接收来自感测部分的感测信号和第一上墨控制信号，并产生第二上墨控制信号。上墨机驱动电路从着墨控制电路接收第二上墨控制信号，以便驱动墨水器。

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