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    • 8. 发明授权
    • 금속 배선 형성방법
    • 制备金属线的方法
    • KR100847985B1
    • 2008-07-22
    • KR1020070062182
    • 2007-06-25
    • 삼성전자주식회사
    • 송기용조성헌문준혁정창오닝홍롱
    • G02F1/136
    • H01L27/1288G02F1/136286G02F2001/136295G02F2202/42H01L27/1214H01L27/1218H01L27/124H05K3/002H05K3/0041H05K3/048H05K3/107H05K3/184H05K3/388H05K2201/0166H05K2203/0565
    • A metal line forming method is provided to simplify the processes by means of a wet plating technique instead of a vacuum layer forming apparatus and to reduce the manufacturing cost. A dielectric layer(31) is deposited on the upper portion of a substrate(30). A potential mask pattern made of a metal line is formed on the upper portion of the dielectric layer. The dielectric layer exposed by the potential mask pattern is etched. Thereafter, the substrate is activated so that a sheet layer(32) is formed on the surface thereof. The potential mask pattern and the upper portion thereof are removed by a lift off manner. A metal layer(33) is formed on the upper portion of a seed layer formed as a pattern. The substrate is made of materials selected from a group consisting of silicon wafer, glass, indium stone oxide, mica, black lead, molybdenum sulfide, copper, zinc, aluminum, stainless, magnesium, iron, nickel, gold, silver, polyimide, polyester, polycarbonate, acryl resin of plastic substrate.
    • 提供金属线形成方法,以通过湿式电镀技术代替真空层形成装置简化工艺,并降低制造成本。 介电层(31)沉积在衬底(30)的上部。 在电介质层的上部形成由金属线构成的电位掩模图形。 蚀刻由电位掩模图案曝光的电介质层。 此后,基板被激活,使得在其表面上形成片层(32)。 通过剥离方式去除电位掩模图案及其上部。 金属层(33)形成在形成为图案的种子层的上部。 基板由选自硅晶片,玻璃,氧化铟锡,云母,黑铅,硫化钼,铜,锌,铝,不锈钢,镁,铁,镍,金,银,聚酰亚胺,聚酯等的材料制成 ,聚碳酸酯,丙烯酸树脂的塑料基材。