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1. 发明授权

KR101983132B1 전자부품 패키지 有权
公开(公告)号：KR101983132B1
公开(公告)日：2019-05-28
申请号：KR1020120137049
申请日：2012-11-29
申请人： 삼성전기주식회사
发明人： 이경호 , 우승완 , 김포철 , 황영남 , 함석진
IPC分类号： H01L23/31 , H01L23/28

2. 发明授权

KR101952847B1 워피지 측정 시스템 및 워피지 측정 방법 有权
公开(公告)号：KR101952847B1
公开(公告)日：2019-02-27
申请号：KR1020120113554
申请日：2012-10-12
申请人： 삼성전기주식회사
发明人： 우승완 , 황영남 , 김포철 , 이경호 , 함석진
IPC分类号： G01B11/16 , G01N21/88

3. 发明公开

KR1020170002259A 인쇄회로기판 및 그 제조방법 有权
标题翻译：印刷电路板及其制造方法相同
公开(公告)号：KR1020170002259A
公开(公告)日：2017-01-06
申请号：KR1020150127220
申请日：2015-09-08
申请人： 삼성전기주식회사
发明人： 김한 , 하상렬 , 김성한 , 이경호 , 안석환 , 강명삼
IPC分类号： H05K3/46 , H05K1/02
摘要： 본발명은일 실시형태를통하여미세패턴을구비하면서도고 강성을가짐으로써휨 특성이우수한인쇄회로기판의신규한구조를제안하고자하며, 구체적으로, 본발명의일 측면에따른인쇄회로기판은적어도하나의절연층및 배선부를포함하는내층및 상기내층의서로대향하는제1 및제2 주면에각각배치되며, 상기절연층보다강성이우수한보강층및 배선부를포함하는외층을포함하는구조이다.

4. 发明公开

KR1020150080877A 이중구조 시편을 이용한 물성 측정 방법 审中-实审
标题翻译：使用双重结构测量样本的性质的方法
公开(公告)号：KR1020150080877A
公开(公告)日：2015-07-10
申请号：KR1020140000464
申请日：2014-01-02
申请人： 삼성전기주식회사
发明人： 황영남 , 우승완 , 남주완 , 이경호 , 함석진
IPC分类号： G01N3/20 , G01N1/28 , G01B21/20
CPC分类号： G01N3/20 , G01B21/20 , G01N1/28 , G01N2203/0023 , G01N2203/0222 , G01N2203/0298
摘要： 이중구조시편을이용한물성측정방법이개시된다. 본발명의실시예에따른이중구조시편을이용한물성측정방법은, 물성을알고자하는물성측정대상재질을이미물성을알고있는베이스재질에결합하여시편을제작하는시편제작단계, 시편에변형을가하여시편의휨 변형값을측정하는휨 변형값측정단계, 측정된휨 변형값을하기수학식 1에대입하여시편의곡률반경(R)을산출하는곡률반경산출단계, 및산출된곡률반경(R)을하기수학식 2에대입하여물성측정대상재질의탄성계수(E₁)를산출하는탄성계수산출단계를포함한다. (수학식 1)(여기서, h는시편의휨 변형에의해형성된호의높이, S는시편의휨 변형에의해형성된현의길이, R은시편의곡률반경을나타냄) (수학식 2)(여기서, t₁은물성측정대상재질의두께, t₂는베이스재질의두께, α₁은물성측정대상재질의열팽창계수, α₂는베이스재질의열팽창계수, E₁은물성측정대상재질의탄성계수, E₂는베이스재질의탄성계수, ΔT는 |시편의휨 변형후 온도 - 시편의초기온도|를나타냄)
摘要翻译：公开了一种使用双重结构试样的物性测量方法。根据本发明的一个实施例，该方法包括：样品制造步骤，通过将具有未知性质的性能测量目标材料与具有已知特性的基材组合来制造样品; 弯曲变形测量步骤，通过使样本变形来测量试样的弯曲变形值; 弯曲半径计算步骤，通过将测量的弯曲变形值应用于下面的等式1来计算样本的弯曲半径（R）; 以及弹性模量计算步骤，通过将弯曲半径（R）应用于下面的等式2来计算性能测量目标材料的弹性模量。在等式1中，h是由试样的弯曲变形形成的弧的高度，S是由试样的弯曲变形形成的弦的长度，R是试样的弯曲半径。在等式2中，t_1是性能测量对象材料的厚度，t_2是基材的厚度，α_1是性能测量对象材料的热膨胀系数，α_2是基材的热膨胀系数，E_1 是性能测量目标材料的弹性系数，E_2是基材的弹性系数，ΔT表示弯曲变形后样品的温度 - 样品的初始温度。

5. 发明公开

KR1020140118137A 반도체 소자 내장형 인쇄 회로 기판 审中-实审
标题翻译：半导体器件嵌入式印刷电路板
公开(公告)号：KR1020140118137A
公开(公告)日：2014-10-08
申请号：KR1020130033531
申请日：2013-03-28
申请人： 삼성전기주식회사
发明人： 이경호 , 함석진 , 신이나
IPC分类号： H05K3/46 , H05K1/18
CPC分类号： H01L2223/54426 , H01L2223/5448 , H01L2224/04105 , H01L2224/19 , H01L2224/20 , H01L2924/00012
摘要： Provided is a semiconductor device embedded printed circuit board which comprises a base board having a cavity; a semiconductor device embedded in the cavity and including an electrode pad on one side; a build-up insulation layer laminated on the base board in which the semiconductor device is embedded; and a build-up circuit layer formed on the build-up insulation layer and having a via connected with the semiconductor device, wherein the semiconductor device has a reference mark on the other side.
摘要翻译：提供一种嵌入式印刷电路板的半导体器件，其包括具有空腔的基板; 嵌入在所述空腔中的半导体器件，其一侧包括电极焊盘; 叠层在其上嵌入半导体器件的基板上的堆积绝缘层; 以及积层电路层，其形成在所述积层绝缘层上并且具有与所述半导体器件连接的通孔，其中所述半导体器件在另一侧具有参考标记。

6. 发明公开

KR1020140086416A 반도체 패키지 및 그 제조방법 无效
标题翻译：半导体封装及其制造方法
公开(公告)号：KR1020140086416A
公开(公告)日：2014-07-08
申请号：KR1020120156865
申请日：2012-12-28
申请人： 삼성전기주식회사
发明人： 은소향 , 권현복 , 우승완 , 황영남 , 함석진 , 김포철 , 이경호 , 박세준
IPC分类号： H01L23/00 , H01L23/367 , H05K1/02
CPC分类号： H01L2224/10 , H01L24/97 , H01L23/3672 , H01L23/3677 , H01L2224/16 , H05K1/0207
摘要： The present invention relates to a semiconductor package and a manufacturing method thereof. The semiconductor package according to the present invention comprises an interposer which is located between a substrate and a semiconductor chip and connects the semiconductor chip such that the semiconductor chips has a lamination structure by being spaced from the substrate at a predetermined gap; and a heat sink which is installed on the bottom surface of the interposer and receives the heat generated on the semiconductor chip or the substrate to radiate the heat to the outside. A thermal via for emitting the heat concentrated on the semiconductor chip is formed in the interposer at an area corresponding to the semiconductor chip. An auxiliary via, for dispersing the concentration of stress due to the thermal via and transferring the heat from the interposer to the heat sink, is formed at other areas in the interposer except for the area where the thermal via is formed. According to the present invention, a via for radiating or delivering heat is formed in the interposer to be balanced such that the stress concentrated on one spot is dispersed and the heat generated at the semiconductor chip or the substrate is effectively radiated.
摘要翻译：半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。根据本发明的半导体封装包括位于衬底和半导体芯片之间的插入件，并且连接半导体芯片，使得半导体芯片具有层压结构，该衬底结构通过以预定间隙与衬底间隔开; 以及散热器，其安装在插入件的底表面上并且接收在半导体芯片或基板上产生的热量以将热量辐射到外部。用于发射集中在半导体芯片上的热的热通孔在对应于半导体芯片的区域中形成在插入器中。用于分散由于热通路引起的应力集中并将热量从插入件传递到散热器的辅助通孔形成在除了形成热通孔的区域之外的插入器中的其它区域。根据本发明，在插入器中形成用于散热或散热的通孔，以使得在一个点集中的应力被分散并且有效地辐射在半导体芯片或衬底处产生的热量。

7. 发明公开

KR1020140083512A 패키지 기판 및 그 제조방법 审中-实审
标题翻译：包装基板及其制造方法
公开(公告)号：KR1020140083512A
公开(公告)日：2014-07-04
申请号：KR1020120153373
申请日：2012-12-26
申请人： 삼성전기주식회사
发明人： 권현복 , 은소향 , 우승완 , 황영남 , 함석진 , 김포철 , 이경호 , 박세준
IPC分类号： H01L23/488 , H01L23/28
CPC分类号： H01L2224/10
摘要： The present invention relates to a package substrate and a manufacturing method thereof. According to an embodiment of the present invention, suggested is a package substrate which includes a circuit substrate where a solder resist layer has an open region; a chip device which is mounted on the circuit substrate and is connected to the pattern of the circuit substrate through the open region of the solder resist layer; a hydrophobic layer which is formed in the exposure region of the solder resist layer at least in the circuit substrate having the chip device; and a molding layer which covers the hydrophobic layer and protects the chip device. Also, a manufacturing method thereof is suggested.
摘要翻译：封装基板及其制造方法技术领域本发明涉及封装基板及其制造方法。根据本发明的实施例，提出了一种封装基板，其包括其中阻焊层具有开放区域的电路基板; 芯片装置，其安装在电路基板上，并通过阻焊层的开放区域与电路基板的图案连接; 至少在具有芯片装置的电路基板中形成在阻焊层的曝光区域中的疏水层; 以及覆盖疏水层并保护芯片器件的成型层。另外，提出了其制造方法。

8. 发明公开

KR1020140080114A 반도체 패키지 구조 审中-实审
标题翻译：半导体封装结构
公开(公告)号：KR1020140080114A
公开(公告)日：2014-06-30
申请号：KR1020120149566
申请日：2012-12-20
申请人： 삼성전기주식회사
发明人： 황영남 , 은소향 , 권현복 , 우승완 , 함석진 , 김포철 , 이경호 , 박세준
IPC分类号： H01L23/48 , H01L23/12
CPC分类号： H01L2224/10 , H01L2924/15311
摘要： Disclosed is a semiconductor package structure. The semiconductor package structure includes a package substrate; a cavity formed to depress a portion of the package substrate; an interposer installed to be inserted into the cavity; and a semiconductor chip mounted on the interposer. The semiconductor package structure prevents the whole thickness of the semiconductor package from being thicker due to the use of the interposer by forming the semiconductor package structure in a method of inserting the interposer into an FC-BGA.
摘要翻译：公开了半导体封装结构。半导体封装结构包括封装衬底; 形成为压缩所述封装基板的一部分的空腔; 插入器被安装以插入腔中; 以及安装在插入件上的半导体芯片。半导体封装结构通过在将插入器插入FC-BGA的方法中形成半导体封装结构，由于使用了插入件，因此半导体封装的整体厚度不会变厚。

9. 发明授权

KR101109284B1 리니어 진동모터의 스프링부재 失效
标题翻译：线性振动电机的弹簧部件
公开(公告)号：KR101109284B1
公开(公告)日：2012-02-09
申请号：KR1020090105058
申请日：2009-11-02
申请人： 삼성전기주식회사
发明人： 이지성 , 이광형 , 이경호
IPC分类号： H02K33/02
CPC分类号： H02K33/16
摘要： 본 발명은 리니어 진동모터의 스프링부재에 관한 것으로, 코일과 마그네트의 상호작용에 의해 발생하는 전자기력에 의해 리니어 진동하는 진동자를 고정자에 탄성지지하는 리니어 진동모터의 스프링부재에 있어서, 상기 스프링부재는, 상기 고정자에 고정되며 내부에 개구부가 형성된 폐루프 구조를 가지는 보디부 및 일단이 상기 보디부의 내측에 고정된 상태로 상기 보디부와 분리되도록 연장되는 탄성부를 포함한다.
리니어, 진동모터, 스프링부재, 보디부, 탄성부, 분리, 최대응력, 회전모드

10. 发明公开

KR1020110134683A 터치패널 失效
标题翻译：触控面板
公开(公告)号：KR1020110134683A
公开(公告)日：2011-12-15
申请号：KR1020100054403
申请日：2010-06-09
申请人： 삼성전기주식회사
发明人： 김현준 , 이경호 , 채경수 , 이종영
IPC分类号： G06F3/041 , H01L21/28
CPC分类号： G06F3/044 , G06F2203/04111
摘要： PURPOSE: A touch panel is provided to increase the visibility of a touch panel without enabling a user not to recognize a bridge and a connection part. CONSTITUTION: A first electrode pattern(20) includes a first sensing unit(23) and a connection unit(25) for connecting the first sensing unit. A second electrode pattern(30) is perpendicularly formed in one side of the transparent substrate. The second electrode pattern includes a second sensing unit and a bridge(35) for connecting the second sensing unit. The bridge is formed in a bridge pattern. The first and the second sensing units are formed into rhomboid, rectangular, and octahedral shape.
摘要翻译：目的：提供触摸面板以增加触摸面板的可视性，而不使用户不能识别桥接器和连接部件。构成：第一电极图案（20）包括用于连接第一感测单元的第一感测单元（23）和连接单元（25）。第二电极图案（30）垂直地形成在透明基板的一侧。第二电极图案包括用于连接第二感测单元的第二感测单元和桥接器（35）。桥梁形成桥梁图案。第一和第二感测单元形成为菱形，矩形和八面体形状。

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