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1. 发明公开

KR1020040097895A 개선된 주석 도금 방법 无效
标题翻译：改进的金属和钛合金镀层方法，通过铜镀金涂层的方法来抑制洗涤剂的形成
公开(公告)号：KR1020040097895A
公开(公告)日：2004-11-18
申请号：KR1020040032095
申请日：2004-05-07
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 휘트로우키스제이. , 토벤마이클피. , 에글리안드레 , 크로스비제프리엔. , 로빈슨크레이그에스.
IPC分类号： C25D5/10
CPC分类号： H05K3/244 , C25D5/022 , C25D5/10 , C25D5/34 , H01L2924/0002 , H05K3/383 , H05K2203/0392 , H01L2924/00
摘要： PURPOSE: To provide a method for plating tin or tin alloy on a substrate to prevent formation of whisker or reduce both number of the whisker and size of the whisker. CONSTITUTION: The method for forming an article comprises a step(a) of providing a metal alloy substrate; a step(b) of coating the metal alloy substrate with a photoresist; a step(c) of exposing the photoresist to actinic radiation to form a pattern on a photosensitive compound; a step(d) of exposing the pattern of the metal alloy substrate by developing the exposed photoresist; a step(e) of etching the exposed metal alloy substrate to a depth of at least 0.5 micron; a step(f) of forming a patterned metal alloy substrate by stripping a remaining photoresist from the metal alloy substrate; and a step(g) of forming an article by deositing a tin or tin alloy coating on the metal alloy substrate.
摘要翻译：目的：提供在基材上镀锡或锡合金以防止形成晶须或减少晶须数量和晶须尺寸的方法。构成：用于形成制品的方法包括提供金属合金基底的步骤（a）; 用光致抗蚀剂涂覆金属合金基材的步骤（b）; 将光致抗蚀剂曝光于光化辐射以在光敏化合物上形成图案的步骤（c）; 通过显影曝光的光致抗蚀剂曝光金属合金基板的图案的步骤（d）; 蚀刻暴露的金属合金基底至少0.5微米的深度的步骤（e）; 通过从所述金属合金基板剥离剩余的光致抗蚀剂来形成图案化金属合金基板的步骤（f）; 以及通过在金属合金基板上涂覆锡或锡合金涂层来形成制品的步骤（g）。

2. 发明公开

KR1020090063145A 접착력 증진 无效
标题翻译：粘合促进
公开(公告)号：KR1020090063145A
公开(公告)日：2009-06-17
申请号：KR1020080126224
申请日：2008-12-12
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 에글리안드레 , 완레오 , 웡테드
IPC分类号： C09K13/06 , H01L21/306
CPC分类号： C23F1/44 , C23F1/28 , C25D3/12 , C25D3/50 , C25D5/022 , C25D5/12 , C25D5/48 , C25F3/02 , H01L23/3142 , H01L23/49582 , H01L2924/0002 , H05K3/383 , H01L2924/00
摘要： An etching method of nickel and nickel alloy is provided to improve adhesion with dielectric materials for reducing stress at interface between nickel or nickel alloy and dielectric materials. An etching method of nickel and nickel alloy comprises (a) providing a composition containing one or more inorganic acids and one or more heterocyclic nitrogeneous compounds; (b) etching nickel or a nickel alloy layer by applying the composition to the nickel or a nickel alloy layer; and (c) further anodic etching nickel or nickel alloy. The heterocyclic nitrogen compound is selected from thiazoles and mercaptans. The mercaptans is selected from mercaptotriazoles and mercaptotetrazoles.
摘要翻译：提供镍和镍合金的蚀刻方法以改善与电介质材料的粘合性，以减少镍或镍合金和电介质材料之间界面处的应力。镍和镍合金的蚀刻方法包括（a）提供含有一种或多种无机酸和一种或多种杂环含氮化合物的组合物; （b）通过将组合物施加到镍或镍合金层来蚀刻镍或镍合金层; 和（c）进一步阳极蚀刻镍或镍合金。杂环氮化合物选自噻唑和硫醇。硫醇选自巯基三唑和巯基四唑。

3. 发明授权

KR101694691B1 치환-방지 경질 금 조성물 有权
标题翻译： - 抗变形硬金组合物
公开(公告)号：KR101694691B1
公开(公告)日：2017-01-10
申请号：KR1020100093234
申请日：2010-09-27
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 장반 , 귀바이요나스 , 에글리안드레
IPC分类号： C25D3/48 , C25D3/62 , C25D7/00
CPC分类号： C25D3/62 , C25D3/48
摘要： 경질금으로도금된기판으로부터금속치환을억제하기위한치환방지경질금 조성물이개시된다. 치환방지경질금 조성물은기판을경질금으로국부도금하는데이용될수 있다.
摘要翻译：公开了一种防置换硬金组合物，用于抑制金属从镀有硬金的衬底上的位移。反位移硬金组合物可用于用硬金定位板基材。

4. 发明授权

KR101532559B1 청동 전기도금 有权
标题翻译：电镀布朗
公开(公告)号：KR101532559B1
公开(公告)日：2015-06-30
申请号：KR1020080126233
申请日：2008-12-12
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 에글리안드레 , 첸큉
IPC分类号： C25D3/58
CPC分类号： C25D3/60 , C25D3/58 , H05K3/244
摘要： 백색청동용전해질및 백색청동의침착방법이개시된다. 상기백색청동을침착시키기위한전해질은시아나이드를함유하지않으며, 균일한백색을제공한다.

5. 发明公开

KR1020110033813A 치환-방지 경질 금 조성물 有权
标题翻译：防变硬金组合物
公开(公告)号：KR1020110033813A
公开(公告)日：2011-03-31
申请号：KR1020100093234
申请日：2010-09-27
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 장반 , 귀바이요나스 , 에글리안드레
IPC分类号： C25D3/48 , C25D3/62 , C25D7/00
CPC分类号： C25D3/62 , C25D3/48
摘要： PURPOSE: An anti-substitution hard gold composite is provided to prevent the substitution of hard gold on nickel and nickel alloy by adding mercapto - tetrazole in a hard gold plating composite. CONSTITUTION: An anti-substitution hard gold composite comprises a gold ion source, an alloy metal ion supply source and mercapto-tetrazole. The gold ion source supplies one or more gold sources. The alloy ion source supplies cobalt salt or nickel salt. The mercapto-tetrazole 1~5 mg/L is included in a hard gold plating composite.
摘要翻译：目的：提供一种抗置换硬金复合材料，以防止在硬金镀层复合材料中加入巯基四唑来将硬金替代镍和镍合金。构成：抗取代硬金复合材料包括金离子源，合金金属离子源和巯基四唑。金离子源提供一个或多个金源。合金离子源提供钴盐或镍盐。巯基四唑1〜5mg / L包含在硬金镀层复合材料中。

6. 发明公开

KR1020090063146A 청동 전기도금 有权
标题翻译：电镀布朗
公开(公告)号：KR1020090063146A
公开(公告)日：2009-06-17
申请号：KR1020080126233
申请日：2008-12-12
申请人： 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
发明人： 에글리안드레 , 첸큉
IPC分类号： C25D3/58
CPC分类号： C25D3/60 , C25D3/58 , H05K3/244
摘要： A bronze electroplating is provided to obtain the white bronze deposit in which color and luminance are uniform by electronically plating the bronze from the electrolyte without cyanide. A bronze electroplating comprises: one or more supply tin ion sources; one or more copper ion sources; and one and more mercaptans selected from one among the group consisting of the mercaptotriazole and mercaptotetrazol. A bronze electroplating method comprises: a step of contacting one or more copper ion sources, one or more tin ion sources, and one and more mercaptans selected from one among the group consisting of the mercaptotriazole and mercaptotetrazol; and a step of sinking the alloy including copper and tin on material by generating the current through the composition.
摘要翻译：提供青铜电镀以获得白色青铜沉积物，其中颜色和亮度均匀，通过电镀青铜从电解质中而没有氰化物。青铜电镀包括：一个或多个供应锡离子源; 一个或多个铜离子源; 以及选自巯基三唑和巯基四唑中的一种以上的硫醇。青铜电镀方法包括：使一种或多种铜离子源，一种或多种锡离子源和一种或多种选自巯基三唑和巯基四唑之一的硫醇接触的步骤; 以及通过产生通过组合物的电流将包含铜和锡的合金沉积在材料上的步骤。

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