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    • 2. 发明公开
    • 비금속 기판의 절단장치 및 방법
    • 用于切割非金属基底的装置和方法
    • KR1020130000729A
    • 2013-01-03
    • KR1020110061434
    • 2011-06-24
    • 로체 시스템즈(주)
    • 문성욱박혁조용흠
    • B23K26/53B23K26/40C03B33/09B23K26/06
    • Y02P40/57
    • PURPOSE: A nonmetallic substrate cutting apparatus and method are provided to simply cut a nonmetallic substrate using a suction unit and to cut to form cells in a glass substrate or to cut a dummy. CONSTITUTION: A nonmetallic substrate cutting apparatus comprises a table(100), a laser beam control unit(110), a quenching nozzle(120), and a first suction unit(130). The laser beam control unit controls the shape and intensity distribution of a laser beam provided to a nonmetallic substrate(20) placed on the table. The quenching nozzle interlocks with the laser beam control unit to move along the nonmetallic substrate and sprays water onto the nonmetallic substrate to quench the nonmetallic substrate. The first suction unit sucks water while moving along the nonmetallic substrate and sucks a scribed part of the nonmetallic substrate to provide physical stress in the scribed part, thereby cutting the nonmetallic substrate along the scribed part. [Reference numerals] (AA) Scribing direction; (BB) Laser beam
    • 目的:提供一种非金属基材切割装置和方法,以简单地使用抽吸单元切割非金属基板并切割以在玻璃基板中形成单元或切割虚拟物。 构成:非金属基板切割装置包括台(100),激光束控制单元(110),淬火喷嘴(120)和第一抽吸单元(130)。 激光束控制单元控制设置在放置在桌子上的非金属基底(20)上的激光束的形状和强度分布。 淬火喷嘴与激光束控制单元互锁以沿着非金属基底移动并将水喷射到非金属基底上以淬火非金属基底。 第一抽吸单元在沿着非金属基底移动的同时吸水,并且吸收非金属基底的划线部分以在划线部分中提供物理应力,从而沿着划线部分切割非金属基底。 (附图标记)(AA)划线方向; (BB)激光束
    • 3. 发明公开
    • 롤러를 이용한 비금속 재료의 절단 장치 및 절단 방법
    • 使用滚子破坏非金属材料的装置和方法
    • KR1020170017443A
    • 2017-02-15
    • KR1020150111342
    • 2015-08-07
    • 로체 시스템즈(주)
    • 조광현설명수박혁황준철오현돈
    • C03B33/02C03B33/03C03B33/10
    • C03B33/02C03B33/03C03B33/10
    • 트림(Trim)의폭이작고, 두께가얇은유리와같은비금속기판에대해서도절단성공률을향상시킬수 있는비금속재료의절단장치가개시된다. 이러한비금속재료절단장치는지지롤러(Support Roller), 푸셔롤러(Pusher Roller), 프레임및 이동모듈을포함한다. 상기지지롤러는비금속기판의트림(trim) 영역의상부면또는하부면을, 상기비금속기판의표면과일정각도를형성하도록지지한다. 상기푸셔롤러는상기지지롤러와반대측표면에서, 절단선에대응하는비금속기판의영역을가압한다. 상기프레임은상기지지롤러및 상기푸셔롤러를지지한다. 상기이동모듈은상기비금속기판또는상기프레임을상대적으로이동시킨다.
    • 公开了一种非金属材料断开装置,其还可以提高非金属基板(例如具有小的修整宽度和厚度的玻璃)的成功率。 非金属材料断开装置包括支撑辊,推进辊,框架和移动模块。 支撑辊支撑非金属基底的修剪区域的上表面或下表面,使得修剪区域的上表面或下表面相对于非金属基底的表面倾斜预定角度。 推动辊位于与支承辊相对的位置,以压紧对应于断裂线的非金属基底的区域。 框架支撑支撑辊和推进辊。 移动模块相对移动非金属基底或框架。
    • 4. 发明授权
    • 비금속 재료의 곡선 절단방법
    • 非金属材料的曲线切割方法
    • KR101355807B1
    • 2014-02-03
    • KR1020120100391
    • 2012-09-11
    • 로체 시스템즈(주)
    • 박혁김찬귀문성욱
    • C03B33/04C03B33/09B23K26/38
    • C03B33/091B23K26/0069B23K26/0087B23K26/38B23K26/40B23K2203/50C03B33/04Y02P40/57Y10T225/12
    • Disclosed is a curve cutting method for non-metallic materials which can rapidly and accurately cut the edges of reinforced non-metallic materials such as tempered glasses to be curved. The curve cutting method for non-metallic materials comprises the steps of: forming an initial crack with a predetermined depth on the surface of a non-metallic material in order to be located on a curvature line of the non-metallic material edge to be cut; and cutting the non-metallic material by irradiating the surface of the non-metallic material with a laser beam along the curvature line to be cut and generating thermal shock and spreading cracks towards both edges along the curvature line of the edges to be cut around the initial crack which is already generated. [Reference numerals] (AA) Start; (BB) End; (S110) Initial crack formation step; (S120) Laser beam irradiation step; (S130) Non-metal material cutting step
    • 公开了一种用于非金属材料的曲线切割方法,其可以快速且精确地切割诸如钢化玻璃的加强非金属材料的边缘以弯曲。 非金属材料的曲线切割方法包括以下步骤:在非金属材料的表面上形成预定深度的初始裂纹,以便位于待切割的非金属材料边缘的曲率线上 ; 并且通过沿着要切割的曲率线用激光束照射非金属材料的表面来切割非金属材料,并且沿着要切割的边缘的曲率线沿着两边缘产生热冲击和扩展裂纹 已经产生的初始裂纹。 (附图标记)(AA)开始; (BB)结束; (S110)初始裂纹形成步骤; (S120)激光束照射步骤; (S130)非金属材料切割步骤
    • 5. 发明授权
    • 강화유리 기판 절단방법
    • 切割温度玻璃基板的方法
    • KR101258403B1
    • 2013-04-30
    • KR1020110131959
    • 2011-12-09
    • 로체 시스템즈(주)
    • 조용흠박혁문성욱류기룡
    • B23K26/38C03B33/02C03B33/033C03B33/09
    • C03B33/091B23K26/38B23K26/40B23K2203/50Y10T225/12
    • PURPOSE: A method for cutting a tempered glass substrate is provided to quickly cut a reinforced glass substrate by not using a cooling process using a mechanical braking process and quenching nozzle. CONSTITUTION: A method for cutting a tempered glass substrate comprises a step of forming an initial crack(200) in a part where cutting of the glass substrate starts; a step of radiating laser beam(11) by a heating optical apparatus in an initial crack direction in order; a step of forming a heated line(13) on the glass substrate in advance; a step of irradiating an initial crack location with the laser beam; and a step of cutting the glass substrate along the pre-molded heating line. [Reference numerals] (AA) Transfer direction;
    • 目的:提供一种切割钢化玻璃基板的方法,通过不使用机械制动过程和淬火喷嘴的冷却过程快速切割强化玻璃基板。 构成:一种用于切割钢化玻璃基板的方法包括在玻璃基板的切割开始的部分中形成初始裂纹(200)的步骤; 按照初始裂纹方向由加热光学装置照射激光束(11)的步骤; 预先在玻璃基板上形成加热线(13)的工序; 用激光束照射初始裂纹位置的步骤; 以及沿着预成型加热线切割玻璃基板的步骤。 (标号)(AA)传送方向;