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1. 发明公开

KR1020160081073A 비할로겐계 접착제 조성물을 이용한 동박 부착 접착시트 및 그 제조방법 审中-实审
标题翻译：使用无卤素粘合剂组合物的树脂涂布铜及其制造方法
公开(公告)号：KR1020160081073A
公开(公告)日：2016-07-08
申请号：KR1020140194267
申请日：2014-12-30
申请人： 도레이첨단소재 주식회사
发明人： 신금식 , 차세영 , 류효곤 , 이병국 , 김영섭
IPC分类号： C09J7/02 , H01B5/14 , C09J163/00
CPC分类号： C09J7/28 , C09J163/00 , C09J2203/326 , H01B5/14
摘要： 본발명은비할로겐계접착제조성물을이용한동박부착접착시트및 그제조방법에관한것으로서, 보다상세하게는연소시에인체유해가스를발생시키지않으면서도우수한난연성과내열성을가지며또한연성회로기판의박막화및 고밀도화를이룰수 있는비할로겐계접착제조성물을이용한동박부착접착시트및 그제조방법에관한것이다.
摘要翻译：本发明涉及使用非卤素类粘合剂组合物附着了铜箔的粘合片及其制造方法。更具体地，附着有铜箔的粘合片具有优异的阻燃性和耐热性，而不会在燃烧时产生对人体有害的气体，并且可以将柔性印刷电路板制成具有高密度的薄膜。粘合片包括：非卤素型环氧树脂; 热塑性树脂; 固化剂; 和无机填料。

2. 发明公开

KR1020150042336A 반도체 패키지용 다이싱 필름 및 그 가공방법 审中-实审
标题翻译：半导体封装用切割薄膜及其制备方法
公开(公告)号：KR1020150042336A
公开(公告)日：2015-04-21
申请号：KR1020130120515
申请日：2013-10-10
申请人： 도레이첨단소재 주식회사
发明人： 서기봉 , 이병국 , 차세영 , 김영욱
IPC分类号： H01L21/78
CPC分类号： H01L21/6836 , H01L2221/68327
摘要： 본발명은반도체패키지용다이싱필름및 그가공방법에관한것으로서, 상기한본 발명의반도체용다이싱필름은기재필름, 점착층및 보호필름이순차적으로적층된구조의다이싱필름(4)에있어서, 상기접착층인다이본드필름(1)의외경은기재필름(2)의외경보다작고웨이퍼보다크며, 상기기재필름(2)의모양은필름의길이방향의양편에뾰쪽한꼭지점을갖는삼각형이구비된형상(A) 또는둥근꼭지점을갖는삼각형이구비된형상(C)이거나혹은타원형의형상(B)으로되어웨이퍼에합지시웨이퍼와합지불량문제가개선되도록된 것임을특징으로한다. 상기와같이구성되는본 발명의반도체패키지용다이싱필름및 그가공방법은반도체스택형패키지에사용되는다이싱필름으로웨이퍼와다이싱필름이합지되는공정에서다이싱필름의모양을특정한형상으로함에의해기재필름과보호필름간의박리강도를최소화하여웨이퍼와다이싱필름의합지를위한보호필름제거시기재필름과접착층간의분리현상이발생되지않도록하여, 반도체웨이퍼와다이싱필름의합지공정에서공정안정성및 공정수율을높여주어상기한종래의문제점을간단하게해결하였다.
摘要翻译：本发明涉及半导体封装用切割膜及其加工方法。根据本发明的用于半导体封装的切割膜（4）具有依次层叠基膜，接合层和保护膜的结构。作为接合层的管芯接合膜（1）的外径小于基膜（2）的外径，并且大于晶片的外径。基膜（2）的形状是具有在膜长度方向两侧具有尖锐顶点的三角形的形状（A），具有圆顶的三角形的形状（C）或椭圆形状（B）。因此，当将薄膜粘合到晶片时，可防止与晶片的接合故障。根据本发明的半导体封装的切割膜及其加工方法简单地解决了现有的问题，即通过防止半导体晶片和切割膜之间的分离现象，提高半导体晶片和切割薄膜的加工成品率和稳定性，当通过在将晶片结合到所使用的切割膜上形成具有特定形状的切割膜时，通过最小化基膜和保护膜之间的分离强度来去除保护膜以将晶片接合到切割膜时的接合层在半导体堆叠封装中。

3. 发明公开

KR1020140085715A 반도체용 유브이 경화형 다이싱 필름 审中-实审
标题翻译：用于半导体器件的UV定影膜
公开(公告)号：KR1020140085715A
公开(公告)日：2014-07-08
申请号：KR1020120154606
申请日：2012-12-27
申请人： 도레이첨단소재 주식회사
发明人： 서기봉 , 엄태수 , 차세영 , 김영욱
IPC分类号： H01L21/301
CPC分类号： H01L21/6836
摘要： The present invention relates to an ultraviolet (UV)-curing dicing film which prevents peeling failures when the film is attached to a wafer, and dicing errors during a laser dicing operation after the film is attached to the wafer, and is easily picked up after a UV illumination. The UV-curing dicing film for a semiconductor is a dicing film having a base film, an adhesive layer, and an adhesive protective film, which are sequentially stacked, which is characterized in that thicknesses of the base film and the adhesive layer satisfy the following equation: C = A/B, 0.09
摘要翻译：本发明涉及一种紫外线（UV）固化型切割膜，其防止膜附着在晶片上时的剥离故障，以及在膜附着到晶片之后的激光切割操作期间的切割误差，并且容易地在紫外线照明。用于半导体的UV固化切割膜是具有依次层叠的基膜，粘合层和粘合保护膜的切割膜，其特征在于，基膜和粘合层的厚度满足以下方程：C = A / B，0.09

4. 发明公开

KR1020160049091A 전자부품용 점착테이프 审中-实审
标题翻译：电子元件胶带
公开(公告)号：KR1020160049091A
公开(公告)日：2016-05-09
申请号：KR1020140144957
申请日：2014-10-24
申请人： 도레이첨단소재 주식회사
发明人： 이하수 , 차세영 , 류효곤 , 이병국 , 김영섭
IPC分类号： C09J7/02
CPC分类号： C09J7/50 , C09J7/38 , C09J2203/326
摘要： 본발명은내열기재층, 상기내열기재층상에에폭시실란커플링제를함유한코팅액의경화에의해형성된프라이머코팅층및 점착제층이라미네이션방식으로형성된전자부품용점착테이프에관한것이다. 본발명의전자부품용점착테이프는상기프라이머코팅층에의해내열기재층과점착제층간의우수한응집력을제공하여전자부품제조공정중 플라즈마공정으로인해디테이핑후, 점착제잔사가방지하며밀봉수지의누출과얼룩을개선할수 있으며, 상기점착제층에의해상온에서점착력을가지지않으나가열라미네이션공정중에만점착력이발현되어, 리드프레임에대한우수한밀착성및 접착성으로반도체장치의제조중 신뢰성향상에도움이되고봉지재료의누출을방지하며공정완료후 테이프가제거될시에외관불량을방지할수 있다.
摘要翻译：本发明涉及一种电子部件用胶带，其特征在于，制造耐热性基底层，将耐热性基底层上含有环氧硅烷偶联剂的涂布液硬化而形成的底漆涂布层和粘合剂层在层压型中。根据本发明的电子部件用胶带通过底涂层在耐热基层和粘接层之间具有良好的内聚力。因此，在电子部件制造过程中由于等离子体处理而进行脱色后，可以防止粘合剂残留，可以缓解密封树脂的泄漏和污染。通过粘合剂层，在室温下不能确保粘合强度，但仅在加热层压工艺中表现，从而确保相对于引线框架的优异的粘附性和粘合性，并有助于提高在制造过程中的可靠性半导体器件。此外，在加热层压处理结束之后，当剥离胶带时，可以防止外壳材料的泄漏，并且可以防止产品的外观错误。

5. 发明公开

KR1020140085717A 그라비아 가공설비의 언와인더 스플라이싱 제어 방법 审中-实审
标题翻译：雷达加工仪器的自动控制分析控制方法
公开(公告)号：KR1020140085717A
公开(公告)日：2014-07-08
申请号：KR1020120154608
申请日：2012-12-27
申请人： 도레이첨단소재 주식회사
发明人： 서기봉 , 엄태수 , 차세영 , 김성진
IPC分类号： B41F33/04 , B41F33/06
CPC分类号： B41F33/06 , B41F33/02 , B41F33/025 , B41F33/04
摘要： The present invention relates to a method of controlling unwinder splicing in a gravure processing facility. In an automatic splicing control method, a fabric of a working roll is cut and adheres to a fabric of a standby roll which rotates along with the rotation of the working roll in an unwinder supplying the fabric, without interrupting the operation of the facility. The method of the present invention includes the steps of releasing a back roll pressed against a gravure roll in the process of the automatic splicing due to the consumption of the fabric of the working roller in the unwinder; interrupting surface processing of the fabric in the step of releasing the back roll; operating the automatic splicing in the step of interrupting the surface processing of the fabric, and starting to operate a counter which is in synchronized with the operation of the back roll of the gravure processing facility; and controlling to press the back roll against the fabric and the gravure roll after the preset distance or time of the counter passes from the step of starting to operate the counter. Therefore, since the operation of the back roll is controlled during the automatic splicing of the unwinder, it is possible to prevent contamination of a product and the facility, and minimize volatilization of a coating solution.
摘要翻译：本发明涉及一种在凹版印刷加工设备中控制退绕机拼接的方法。在自动拼接控制方法中，切割工作辊的织物并粘附到备用辊的织物，该待机辊随着工作辊的旋转而在提供织物的退绕机中旋转，而不中断设备的操作。本发明的方法包括以下步骤：由于在退绕机中消耗了工作辊的织物，在自动拼接过程中释放压靠在凹版辊上的后辊; 在释放背卷的步骤中中断织物的表面处理; 在中断织物的表面处理的步骤中操作自动拼接，并开始操作与凹版印刷加工设备的后辊的操作同步的计数器; 并且在计数器的预设距离或时间从开始操作计数器的步骤之后，控制将后辊压靠在织物和凹版辊上。因此，由于在退绕机的自动拼接期间控制后辊的操作，可以防止产品和设备的污染，并且使涂布溶液的挥发最小化。

6. 发明公开

KR1020140084416A 터치 스크린 패널 공정용 내열보호 필름 및 그 제조방법 审中-实审
标题翻译：触摸屏面板保护膜及其制造方法
公开(公告)号：KR1020140084416A
公开(公告)日：2014-07-07
申请号：KR1020120153017
申请日：2012-12-26
申请人： 도레이첨단소재 주식회사
发明人： 서기봉 , 엄태수 , 차세영 , 조영호
IPC分类号： C09J7/02 , C09J133/04 , C08J5/18 , G06F3/041
CPC分类号： C09J7/38 , C08J5/18 , C09J7/22 , C09J7/385 , C09J133/04 , C09J2201/606 , C09J2203/318 , G06F3/0412 , G06F3/0416
摘要： The present invention relates to a heat resistant protective film for a touch screen panel process and a method for manufacturing the same. The heat resistant protective film for a touch screen panel process according to the present invention comprises a base material film, an adhesive layer, and a release film, wherein the adhesive layer is characterized by being manufactured from a copolymer comprising 1-48 parts by weight of a rigid acrylic monomer having a glass transition temperature of 0 °C or more and 1-10 parts by weight of a cross-linking monomer for 50-90 parts by weight of a soft acrylic monomer having a glass transition temperature of 0 °C of less. The heat resistant protective film for a touch screen panel process of the present invention composed by the same properly mixes soft and rigid monomers composing an adhesive and uses a cross-linking agent to improve the heat resistance of the adhesive used in an ITO heat resistant protective film for a TSP process, and to prevent inhibition of the increase of an adhesive force, adhesive transfer, bending of the ITO film, and an oxidation of an ITO layer after a heat treatment occurring in the TSP process to improve the productivity of the TSP process and reduce TSP defects.
摘要翻译：本发明涉及一种用于触摸屏面板工艺的耐热保护膜及其制造方法。根据本发明的用于触摸屏面板工艺的耐热保护膜包括基材膜，粘合剂层和剥离膜，其中所述粘合剂层的特征在于由共聚物制造，所述共聚物包含1-48重量份的玻璃化转变温度为0℃以上的刚性丙烯酸类单体和1-10重量份的交联单体，50-90重量份的玻璃化转变温度为0℃的软质丙烯酸类单体少了本发明的触摸屏面板工艺的耐热保护膜由相同的组合构成粘合剂的柔软和刚性单体，并且使用交联剂来改善ITO耐热保护剂中使用的粘合剂的耐热性用于TSP工艺的膜，并且防止在TSP工艺中发生热处理之后抑制粘合力增加，粘合剂转移，ITO膜的弯曲和ITO层的氧化，以提高TSP的生产率处理和减少TSP缺陷。

7. 发明公开

KR1020130076044A 반도체 기판용 점착성 보호 필름 및 그 제조방법 无效
标题翻译：半导体基板用粘合保护膜及其制造方法
公开(公告)号：KR1020130076044A
公开(公告)日：2013-07-08
申请号：KR1020110144447
申请日：2011-12-28
申请人： 도레이첨단소재 주식회사
发明人： 전해상 , 엄태수 , 차세영 , 김영욱
IPC分类号： C09J7/02 , C09J133/04 , H05K3/28 , C08J5/18
CPC分类号： C09J7/255 , C08J5/18 , C09J7/29 , C09J7/35 , C09J7/385 , C09J133/04 , C09J2201/60 , C09J2201/622 , C09J2203/326 , C09J2205/10 , H05K3/284
摘要： PURPOSE: An adhesive protection film is provided to have excellent thermal resistance, to facilitate a flip-chip manufacturing process, and to effectively protect the surface of a substrate after spreading insulating materials. CONSTITUTION: An adhesive protection film uses a polyethylene terephthalate resin as a base material, and an acrylic adhesive composition, which consists of acrylic polymers having a molecular weight of 100,000-1,500,000 and a dispersity of 4.5 or less and includes a hardener, is spread on the base material as an adhesive layer. The thickness of the base material is 10-50 microns. The hardener is an isocyanate-based hardener. The thickness of the adhesive layer is 1-20 microns. The adhesion of the adhesive protection film is 150 g/inch or less. The adhesion increase after a treatment at 100 °C for 30 minutes is 30% or less of the original adhesion.
摘要翻译：目的：提供粘合保护膜以具有优异的耐热性，便于倒装芯片制造工艺，并且在铺展绝缘材料之后有效地保护基板的表面。构成：粘合保护膜使用聚对苯二甲酸乙二醇酯树脂作为基材，丙烯酸类粘合剂组合物由丙烯酸类聚合物组成，分子量为100,000〜1,500,000，分散度为4.5以下，含有硬化剂，分散在该基材作为粘合剂层。基材的厚度为10-50微米。固化剂是异氰酸酯类固化剂。粘合剂层的厚度为1-20微米。粘合保护膜的粘合力为150g / inch以下。在100℃下处理30分钟后的粘附性增加为原始粘合力的30％以下。

8. 发明公开

KR1020130074956A 반도체 리드 고정용 수지 조성물 및 이를 이용한 리드 고정용 테이프 无效
标题翻译：用于固定半导体引线的树脂组合物和用于固定引线的胶带
公开(公告)号：KR1020130074956A
公开(公告)日：2013-07-05
申请号：KR1020110143101
申请日：2011-12-27
申请人： 도레이첨단소재 주식회사
发明人： 전해상 , 엄태수 , 차세영 , 신재한
IPC分类号： C09J163/00 , C09J11/06 , C09J7/02
CPC分类号： C09J163/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J11/06 , C09J2201/61 , C09J2203/30 , C09J2205/102
摘要： PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a semiconductor lead contains an epoxy resin, a curing agent, a thermoplastic resin, an additive, and a phosphorus compound denoted by chemical formula 1. In the chemical formula 1, R1-R15 are the same or different, and are independently H or a C1-6 alkyl group. A lead fixing tape using the resin composition for fixing the semiconductor lead is obtained by coating the resin composition on a supporting base film, and laminating a protective film on the coated composition.
摘要翻译：目的：提供用于固定半导体引线的树脂组合物以提供高温附着和高电压可靠性，并且通过增加粘合剂的交联密度来提高耐热性和物理刚度。构成：用于固定半导体铅的树脂组合物含有由化学式1表示的环氧树脂，固化剂，热塑性树脂，添加剂和磷化合物。在化学式1中，R 1 -R 15相同或不同，独立地为H或C 1-6烷基。使用树脂组合物固定半导体引线的引线固定带是通过将树脂组合物涂覆在支撑基底膜上并在保护膜上层压保护膜而得到的。

9. 发明公开

KR1020120059778A 반도체용 접착필름 无效
标题翻译：半导体器件用粘合膜
公开(公告)号：KR1020120059778A
公开(公告)日：2012-06-11
申请号：KR1020100121209
申请日：2010-12-01
申请人： 도레이첨단소재 주식회사
发明人： 차세영 , 전해상 , 엄태수
IPC分类号： H01L21/683 , H01L21/67 , H01L21/48 , H01L21/50
CPC分类号： H01L21/6836 , H01L21/48 , H01L21/50 , H01L21/67132
摘要： PURPOSE: An adhesive film for a semiconductor device is provided to minimize static electricity generated in the stripping of a dicing adhesive by performing an antistatic process on at least one side of a protection film of a die bonding adhesive. CONSTITUTION: A dicing adhesive(4) is formed on a base film(5). A supporter is formed on the dicing adhesive. A die bonding adhesive(2) is formed on the supporter. An adhesive protection film(1) is formed on the die bonding adhesive. An external diameter of the die bonding adhesive is smaller than that of the dicing adhesive.
摘要翻译：目的：提供一种用于半导体器件的粘合膜，以通过在芯片粘合剂的保护膜的至少一侧上执行抗静电工艺来最小化在剥离粘合剂中产生的静电。构成：在基膜（5）上形成切割粘合剂（4）。在切割粘合剂上形成支撑体。在支撑体上形成芯片接合粘合剂（2）。在芯片接合粘合剂上形成粘合保护膜（1）。芯片接合粘合剂的外径小于切割粘合剂的外径。

10. 发明公开

KR1020160095526A 반도체용 다이싱 다이본딩 필름 审中-实审
标题翻译： DICING DIE BONDING FIMM SEMICONDUCTOR
公开(公告)号：KR1020160095526A
公开(公告)日：2016-08-11
申请号：KR1020150016908
申请日：2015-02-03
申请人： 도레이첨단소재 주식회사
发明人： 김영욱 , 차세영 , 류효곤 , 이병국 , 김영섭
IPC分类号： H01L23/00 , H01L23/495 , H01L21/78 , H01L21/683
CPC分类号： H01L24/50 , H01L21/6836 , H01L21/78 , H01L23/49572 , H01L2221/68327
摘要： 본발명은반도체용다이싱다이본딩필름에관한것으로서, 보다상세하게는타발시 접착제층과접착제층보호용이형필름간의들뜸현상이발생하지않고, 우수한픽업성및 타발된필름과웨이퍼의합지공정에서접착제층과다이본딩보호용점착필름을쉽게박리할수 있는반도체용다이싱다이본딩필름에관한것이다.
摘要翻译：本发明涉及一种用于半导体的切割芯片接合膜，更具体地，涉及一种用于半导体的切割芯片接合膜，其在冲压期间不会在粘合剂层和用于保护粘合剂膜的剥离膜之间产生剥离现象并且可以容易地剥离粘合剂层和用于在具有优异的拾取性能的冲压膜的联合工艺中保护芯片粘合的粘合剂膜。根据本发明，可以提高工艺稳定性和工艺成品率。

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