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    • 5. 发明公开
    • 양자점 제조방법 및 양자점을 포함하는 반도체 구조물
    • 制造量子点和含有量子点的半导体结构的方法
    • KR1020120120834A
    • 2012-11-02
    • KR1020110038620
    • 2011-04-25
    • 광주과학기술원
    • 이홍석
    • H01L21/20
    • H01L29/127B82Y10/00B82Y30/00B82Y40/00
    • PURPOSE: A method for manufacturing a quantum dot and a semiconductor structure including the quantum dot are provided to selectively grow the quantum dot according to the function of a device by controlling the size, density, and growth location of a dielectric thin film pattern. CONSTITUTION: A compound semiconductor layer including a quantum well structure with a first barrier layer, a well layer, and a second barrier layer is prepared. The compound semiconductor layer is a III-V group compound semiconductor or II-V group compound semiconductor. A dielectric thin film pattern including a first dielectric thin film and a second dielectric thin film is formed on the second barrier layer. The first dielectric thin film includes a width of a nanometer. The compound semiconductor layer with the dielectric thin film pattern is thermally processed.
    • 目的:提供一种制造量子点的方法和包括量子点的半导体结构,以通过控制电介质薄膜图案的尺寸,密度和生长位置,根据器件的功能选择性地生长量子点。 构成:制备包括具有第一阻挡层,阱层和第二阻挡层的量子阱结构的化合物半导体层。 化合物半导体层是III-V族化合物半导体或II-V族化合物半导体。 在第二阻挡层上形成包括第一电介质薄膜和第二电介质薄膜的电介质薄膜图案。 第一介电薄膜包括纳米的宽度。 具有电介质薄膜图案的化合物半导体层被热处理。
    • 6. 发明公开
    • 단일 양자점 소자 및 이의 제조방법
    • 使用量子的装置及其制造方法
    • KR1020120113582A
    • 2012-10-15
    • KR1020110031358
    • 2011-04-05
    • 광주과학기술원
    • 이홍석
    • H01L33/50H01L51/42
    • H01L29/127B82Y10/00
    • PURPOSE: A single quantum device and a manufacturing method thereof are provided to control an energy band of a quantum dot structure by controlling the radiation time and power of laser. CONSTITUTION: A buffer layer is formed on a substrate(S100). A single quantum dot is formed on the buffer layer(S110). A cover layer filling the quantum dot is formed(S120). A dielectric thin film is formed on the upper side of the cover layer(S130). An energy band of the single quantum dot of the device with the dielectric thin film is controlled(S140). [Reference numerals] (S100) Forming a buffer layer; (S110) Forming a single quantum dot; (S120) Forming a cover layer; (S130) Forming a dielectric thin film; (S140) Controlling an energy band of a single quantum dot
    • 目的:提供单个量子器件及其制造方法,通过控制激光的辐射时间和功率来控制量子点结构的能带。 构成:在基板上形成缓冲层(S100)。 在缓冲层上形成单个量子点(S110)。 形成填充量子点的覆盖层(S120)。 在覆盖层的上侧形成电介质薄膜(S130)。 控制具有电介质薄膜的器件的单量子点的能带(S140)。 (附图标记)(S100)形成缓冲层; (S110)形成单个量子点; (S120)形成覆盖层; (S130)形成介电薄膜; (S140)控制单个量子点的能带
    • 7. 发明公开
    • 원자층 증착과 레이저 조사를 이용한 광결정 공동 모드의 공진 파장 제어방법 및 이를 이용한 광소자
    • 通过原子层沉积和激光照射的光子晶体模式的共振波长调谐方法和使用它的光学器件
    • KR1020120098288A
    • 2012-09-05
    • KR1020110018147
    • 2011-02-28
    • 광주과학기술원
    • 이홍석
    • H01S3/10
    • H01S5/106G02B6/1225H01S3/169
    • PURPOSE: A method of controlling a resonant wavelength in a photonic crystal cavity mode by atomic layer deposition and laser irradiation and an optical device using the same are provided to precisely control the resonant wavelength in the photonic crystal cavity mode by using atomic layer deposition and laser irradiation. CONSTITUTION: A slab having a photonic crystal cavity, in which a plurality of air holes is included at a two-dimensional lattice pattern, is prepared(S10). A dielectric thin film is deposited on the slab using an atomic layer deposition method(S12). A surface of the slab is oxidized in an interface of the dielectric thin film and the slab by irradiating the slab having the dielectric thin film with a laser(S14). An oxide formed on the surface of the slab has a lower refractive index than that of the slab with laser irradiation. [Reference numerals] (S10) Preparing a slab in which a photonic crystal cavity is formed including a plurality of air holes of a two-dimensional lattice pattern; (S12) Deposition of a dielectric thin film on the inner circumferential of the holes which are formed on the upper side and the lower side of the slab using an atomic layer deposition method; (S14) Oxidization of the surface of the slab in an interface of the dielectric thin film and the slab by irradiating the slab having the dielectric thin film with a laser
    • 目的:提供一种通过原子层沉积和激光照射控制光子晶体腔模式的谐振波长的方法和使用其的光学器件,通过使用原子层沉积和激光来精确控制光子晶体腔模式中的谐振波长 照射。 构成:准备具有光子晶体腔的平板,其中以二维格子图案包含多个气孔,其中(S10)。 使用原子层沉积方法在板上沉积电介质薄膜(S12)。 通过用激光照射具有电介质薄膜的板坯,在电介质薄膜和板坯的界面中使板坯的表面氧化(S14)。 在板坯表面形成的氧化物的折射率比具有激光照射的板坯的折射率低。 (附图标记)(S10)准备形成有包含二维格子图案的多个气孔的光子晶体空腔的平板, (S12)使用原子层沉积法在形成在板坯的上侧和下侧的孔的内周上沉积电介质薄膜; (S14)通过用激光照射具有电介质薄膜的板坯,在电介质薄膜和板坯的界面中对板坯的表面进行氧化
    • 9. 发明公开
    • 열처리를 이용하는 발광 다이오드의 제조방법 및 이를 이용하여 형성된 발광 다이오드
    • 使用热处理和发光二极管制造发光二极管的方法
    • KR1020130008942A
    • 2013-01-23
    • KR1020110069644
    • 2011-07-13
    • 광주과학기술원
    • 이홍석
    • H01L33/12
    • H01L33/007H01L21/0242H01L21/02458H01L21/02551H01L21/02667H01L33/02H01L33/14
    • PURPOSE: A method for manufacturing a light emitting diode using heat treatment and a light emitting diode formed by using the same are provided to cure crystal defects by applying compression stress in the most upper layer of a light emitting structure. CONSTITUTION: A light emitting structure is formed on a substrate(S100). The light emitting structure includes a first conductivity type semiconductor layer, a light emitting layer and a second conductive semiconductor layer. The heat treatment film is formed on the second conductivity type semiconductor layer(S200). The heat treatment film and light emitting structure are heat-treated. Compression stress is applied on the second conductivity type semiconductor layer of the light emitting structure. The heat treatment film is removed(S300). [Reference numerals] (AA) Start; (BB) End; (S100) Forming a light emitting diode; (S200) Forming a heat treatment layer; (S300) Eliminating heat treatment and a heat treatment layer
    • 目的:提供一种使用热处理制造发光二极管的方法和通过使用该方法形成的发光二极管,以通过在发光结构的最上层施加压缩应力来固化晶体缺陷。 构成:在基板上形成发光结构(S100)。 发光结构包括第一导电型半导体层,发光层和第二导电半导体层。 在第二导电型半导体层上形成热处理膜(S200)。 对热处理膜和发光结构进行热处理。 对发光结构的第二导电型半导体层施加压应力。 除去热处理膜(S300)。 (附图标记)(AA)开始; (BB)结束; (S100)形成发光二极管; (S200)形成热处理层; (S300)消除热处理和热处理层