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    • 6. 发明公开
    • 기판의 조립장치
    • 装配基板及其装置的方法
    • KR1020010020690A
    • 2001-03-15
    • KR1020000015984
    • 2000-03-29
    • 가부시키가이샤 히다치 인더스트리즈
    • 야와타사토시이마이즈미기요시사이토마사유키가와스미유키히로미시나하루오히라이아키라
    • G02F1/13
    • PURPOSE: An apparatus is provided to match marks to each other with high accuracy and to bond substrates to each other by moving one vacuum chamber unit with respect to the other to position the substrates to each other and narrowing the opposite spacing thereof, thereby bonding the substrates to each other. CONSTITUTION: A substrate bonding section(S2) is composed of the structure that an upper chamber unit(21) and a pressurizing plate(27) therein can respectively independently move vertically. Namely, the upper chamber unit(21) has a housing(30) containing a linear bushing and a vacuum seal and is moved in a vertical Z-axis direction by the shaft of a cylinder(22) fixed to a frame(3). When the upper chamber unit(21) descends, a flange of the upper chamber unit(21) comes into contact with an O-ring(44) arranged around a lower chamber(10) and mates therewith, thereby attaining the state that the units function as a vacuum chamber. As a result, the alignment marks disposed at the respective substrates may be aligned to each other with the high accuracy and the substrates are rapidly bonded to each other.
    • 目的:提供一种设备,以高精度相互匹配标记,并且通过相对于另一个真空室单元移动一个真空室单元并将基板彼此定位并使其相对的间隔变窄,从而将基板彼此接合,从而将 底物彼此。 构成:基板接合部(S2)由上部室单元(21)和加压板(27)分别独立地垂直移动的结构构成。 也就是说,上室单元(21)具有包含线性衬套和真空密封件的壳体(30),并且通过固定到框架(3)的气缸(22)的轴在垂直Z轴方向上移动。 当上室单元(21)下降时,上室单元(21)的凸缘与设置在下室(10)周围的O形环(44)接触并与其配合,从而达到单元 作为真空室。 结果,设置在各个基板上的对准标记可以高精度地彼此对准,并且基板彼此快速地接合。
    • 8. 发明公开
    • 기판접합방법 및 접합장치
    • 用于焊接基板的方法和装置
    • KR1020020091828A
    • 2002-12-06
    • KR1020020030736
    • 2002-05-31
    • 가부시키가이샤 히다치 인더스트리즈
    • 이마이즈미기요시야와타사토시나카야마유키노리사이토마사유키엔도마사토모히라이아키라
    • G02F1/1333
    • G02F1/133308B05D3/061B23K20/02G02F1/1339G02F2202/28
    • PURPOSE: A method and a device for soldering a substrate are provided to surely hold the substrate without damaging the substrate or an electrostatic chuck in vacuum. CONSTITUTION: Two substrates(33,34) are arranged to face with each other, and at least one of those substrates is applied with solder paste and is positioned in a chamber(15) in a decompressed state. Then, the substrate is pressurized so as to solder. The substrates are held by applying suction and absorption forces until the chamber is turned into a prescribed decompressed state. When the prescribed decompressed state is obtained, the substrates are held by applying a voltage to a desired pair of electrodes corresponding to the size of the substrate among the respective electrodes of a bi-polar electrostatic chuck having a plurality of pairs of electrodes arranged in the chamber. Thereby, the defects are prevented by preventing the displacement of the substrates and securing the certain distance between the substrates near a temporary fixing glue.
    • 目的:提供一种用于焊接基板的方法和装置,以确保保持基板,而不会在真空中损坏基板或静电卡盘。 构成:将两个基板(33,34)彼此相对地布置,并且至少一个基板被涂覆有焊膏并且被定位在处于减压状态的室(15)中。 然后,将基板加压以便焊接。 通过施加吸力和吸力来保持基板,直到室变成规定的减压状态。 当获得规定的减压状态时,通过向具有多个电极对配置的双极静电卡盘的各个电极中的与基板的尺寸相对应的期望的一对电极施加电压来保持基板, 室。 因此,通过防止基板的位移并且在临时固定胶附近确保基板之间的一定距离来防止缺陷。