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1. 发明公开

KR1020140041351A 기판 처리 장치 审中-实审
标题翻译：基板加工设备
公开(公告)号：KR1020140041351A
公开(公告)日：2014-04-04
申请号：KR1020130113264
申请日：2013-09-24
申请人： 가부시키가이샤 에바라 세이사꾸쇼
发明人： 미야자키미츠루 , 고바야시겐이치 , 홈보데루아키 , 이마무라아키라 , 동보유 , 시노자키히로유키
IPC分类号： H01L21/302 , H01L21/677
CPC分类号： H01L21/6719 , H01L21/67046 , H01L21/67051 , H01L21/67178 , H01L21/67207 , H01L21/67745 , H01L21/68728
摘要： The present invention relates to flexibly responding to the variation of cleaning pattern corresponding to the difference of layers such as an oxide layer while improving the processing amount and saving space. The present invention comprises: a first cleaning chamber (190) in which at least one first cleaning module (200a), two second cleaning modules (201a, 201b) are arranged in a vertical direction; a second cleaning chamber (192) in which two third cleaning modules (202a, 202b) are arranged in a vertical direction; and a first retransmitting robot (240) accommodated in a first retransmitting chamber (191) between the first and second cleaning chambers and transmitting a substrate among the first cleaning module, second cleaning modules, and third cleaning modules.
摘要翻译：本发明涉及在改善处理量并节省空间的同时灵活地响应与诸如氧化物层的层的差异相对应的清洁图案的变化。本发明包括：第一清洗室（190），其中至少一个第一清洁模块（200a），两个第二清洁模块（201a，201b）沿垂直方向布置; 其中两个第三清洁模块（202a，202b）在垂直方向上布置的第二清洁室（192）以及容纳在第一和第二清洁室之间的第一重传室（191）中并在第一清洁模块，第二清洁模块和第三清洁模块之间传送基板的第一重传机器人（240）。

2. 发明授权

KR101907702B1 연마 장치 및 연마 방법 有权
公开(公告)号：KR101907702B1
公开(公告)日：2018-10-12
申请号：KR1020130124546
申请日：2013-10-18
申请人： 가부시키가이샤 에바라 세이사꾸쇼
发明人： 미야자키미츠루 , 고바야시겐이치 , 홈보데루아키 , 이마무라아키라 , 동보유 , 시노자키히로유키
IPC分类号： B24B55/00 , B24B37/34 , H01L21/304
CPC分类号： H01L21/30625 , B24B37/30 , B24B37/34 , B24B37/345 , H01L21/67051 , H01L21/67219
摘要： 톱링의하면에서보유지지한기판을상기톱 링의하면과함께효율적으로세정할수 있도록하여, 연마성능을안정화시키고, 또한세정모듈의세정성능을안정화시킬수 있도록한다. 연마면을갖는연마테이블과, 연마테이블상방의연마위치, 연마테이블측방의위치및 세정위치의사이를이동가능하고, 리테이너링(40)으로기판의외주부를둘러싸면서상기기판을하면에보유지지하여연마면을향해압박하는톱 링(31A)과, 세정위치에위치하여회전중인톱 링(31A)의하면을향해세정액을분사하여상기톱 링(31A)에서보유지지한기판(W)을톱 링(31A)의하면과함께세정하는세정부(100)를갖는다.

3. 发明公开

KR1020140053772A 연마 장치 및 연마 방법 审中-实审
标题翻译：抛光装置和抛光方法
公开(公告)号：KR1020140053772A
公开(公告)日：2014-05-08
申请号：KR1020130124546
申请日：2013-10-18
申请人： 가부시키가이샤 에바라 세이사꾸쇼
发明人： 미야자키미츠루 , 고바야시겐이치 , 홈보데루아키 , 이마무라아키라 , 동보유 , 시노자키히로유키
IPC分类号： B24B55/00 , B24B37/34 , H01L21/304
CPC分类号： H01L21/30625 , B24B37/30 , B24B37/34 , B24B37/345 , H01L21/67051 , H01L21/67219
摘要： A polishing apparatus and a polishing method can efficiently clean a substrate held on a lower surface of a top ring together with the lower surface of the top ring to stabilize polishing capability and to stabilize the cleaning capability of a cleaning module. The polishing apparatus comprises: a polishing table having a polishing surface; a top ring (31A) configured to be movable between a polishing position above the polishing table, a lateral position of the polishing table, and a cleaning position, and holding a substrate on a lower surface of the top ring with an outer circumferential edge of the substrate surrounded by a retainer ring (40) to press the substrate against the polishing surface; and a cleaning unit (100) disposed in the cleaning position and ejecting a cleaning liquid toward the lower surface of the top ring (31A) which is being rotated, thereby cleaning the substrate (W) held by the top ring (31A) together with the lower surface of the top ring.
摘要翻译：抛光装置和抛光方法可以与顶环的下表面一起有效地清洁保持在顶环的下表面上的基板，以稳定研磨能力并稳定清洁模块的清洁能力。抛光装置包括：具有抛光表面的抛光台; 配置成可在抛光台上方的研磨位置，抛光台的横向位置和清洁位置之间移动的顶环（31A），并且将基板保持在顶环的下表面上，外周边缘所述基板被保持环（40）包围以将所述基板压靠在所述抛光表面上; 以及清洁单元（100），设置在清洁位置，并且朝着正在旋转的顶环（31A）的下表面喷射清洁液体，从而将由顶环（31A）保持的基板（W）与顶环的下表面。

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