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    • 1. 发明公开
    • 복합재료 진동장치
    • 复合材料振动装置
    • KR1020060082882A
    • 2006-07-19
    • KR1020067009768
    • 2004-11-17
    • 가부시키가이샤 무라타 세이사쿠쇼
    • 야마다유야카와카미아키히코마츠시타코지우치다신스케
    • H03H9/17H01L41/08H01L41/16H03H3/02
    • H03H9/0561B06B1/0644H03H9/0211H03H9/1035H03H9/177
    • A composite material vibration device able to be supported hardly affecting the vibration characteristics of a vibration member with a comparative simple structure and be easily downsized. The device comprises a vibration member consisting of a material having a first acoustic impedance Z1 and working as a vibration generating source, a reflection layer consisting of the cured material of a resin composition material containing at least curing resin having a second acoustic impedance Z 2 smaller than a first acoustic impedance Z1 and being curable by heat, a curing agent and a silicone compound, and connected with the above vibration member, and a holding member consisting of a material having a third acoustic impedance Z3 larger than the above second acoustic impedance Z2 and connected with that side of the reflection layer opposite to the side connected with the vibration member, whereby vibration propagated to the reflection layer from the vibration member is reflected at the interface between the reflection layer and the holding member.
    • 能够被支撑的复合材料振动装置几乎不会影响具有比较简单结构的振动部件的振动特性并且容易地小型化。 该装置包括由具有第一声阻抗Z1并用作振动产生源的材料组成的振动部件,由至少含有第二声阻抗Z 2的固化树脂的树脂组合物材料的固化材料构成的反射层 并且与第一声阻抗Z 1并且可由固化剂和硅氧烷化合物固化并与上述振动构件连接,并且保持构件由具有大于上述第二声阻抗Z 2的第三声阻抗Z3的材料构成 并且与反射层的与振动部件的一侧相反的一侧连接,由此从振动部件传播到反射层的振动在反射层与保持部件之间的界面处被反射。
    • 3. 发明公开
    • 세라믹 전자부품의 제조 방법 및 세라믹 전자부품
    • 陶瓷电子元件与陶瓷电子元器件的制造方法
    • KR1020170017781A
    • 2017-02-15
    • KR1020160099259
    • 2016-08-04
    • 가부시키가이샤 무라타 세이사쿠쇼
    • 타나카준야우치다신스케
    • H01G4/232H01G4/012
    • H01G4/30H01G2/10H01G4/012H01G4/12H01G4/224H01G4/232H01G4/248H01G13/003
    • 세라믹전자부품의특성에악영향을끼치지않고세라믹전자부품의본체표면을조화하여, 밀봉수지와의밀착성이높은세라믹전자부품을제조할수 있는세라믹전자부품의제조방법, 및밀봉수지와의밀착성이높은세라믹전자부품을제공하는것. 직방체형상이며서로마주보는제1 주면과제2 주면을가지는본체와, 상기본체의표면의일부에마련된제1 외부전극및 제2 외부전극을포함하는세라믹전자부품의제조방법으로서, 세라믹과유기물을포함하는적층블록의제1 주면에돌기가마련된돌기면을맞대어, 상기적층블록의제1 주면을따른방향으로상기돌기면과상기적층블록을상대적으로움직임으로써상기적층블록의제1 주면에복수의오목부를마련하는공정과, 상기오목부가마련된적층블록을절단하여칩을얻는공정과, 상기칩을소성하여본체를얻는공정을포함하는것을특징으로하는세라믹전자부품의제조방법.
    • 一种陶瓷电子部件的制造方法,其特征在于,包括具有彼此相对的第一主面和第二主面的主体以及设置在所述主体的表面的一部分上的第一外部电极和第二外部电极, 在包括陶瓷材料和有机物质的叠层块的第一主表面中通过相对移动层叠块和包括突起的突起表面在沿着层压块的第一主表面的方向上提供多个凹槽,其中 突起表面与层压块的第一主表面接触,通过切割包括凹部的层叠块获得芯片,并且通过烧结芯片获得主体。