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2. 发明公开

KR1020020046192A 솔더, 프린트배선기판의 표면처리방법, 및 전자부품의 장착방법 有权
标题翻译：焊接工艺，印刷电路板表面处理方法及安装电子零件的方法
公开(公告)号：KR1020020046192A
公开(公告)日：2002-06-20
申请号：KR1020010077316
申请日：2001-12-07
申请人： 가부시키가이샤 도판 엔이씨 서키트 솔루션즈 , 솔더코트 가부시키가이샤
发明人： 이토도시히테 , 하라시로
IPC分类号： H05K3/28 , B23K35/12
CPC分类号： B23K35/262 , B23K2201/36
摘要： PURPOSE: A solder is provided to prevent copper consuming and to control the melting point to the extent where no damage to electronic parts occurs. CONSTITUTION: In a case where a minute amount of Co, Ni or Fe is added, the melting rate of copper is significantly reduced in comparison with cases where other elements are added. In particular, the reduction of the melting rate of copper is significant at the time when Co, from among these three types of elements, is added. In general, as the amount of other elements added to an alloy that has a eutectic composition increases, the liquidus temperature increases and in the case where the amount of the addition is minute, the increase in the liquidus temperature can be limited to the minimum. Accordingly, it is considered that by adding a minute amount of Co, Ni and/or Fe, copper consuming can be prevented while controlling the increase in the liquidus temperature.
摘要翻译：目的：提供焊料以防止铜消耗，并将熔点控制在不会损坏电子部件的程度。构成：在添加少量Co，Ni或Fe的情况下，与添加其他元素的情况相比，铜的熔融率显着降低。特别地，在添加这三种元素中的Co时，铜的熔化速率的降低是显着的。通常，随着添加到具有共晶组成的合金中的其他元素的量增加，液相线温度升高，并且在添加量微小的情况下，液相线温度的增加可以被限制为最小。因此，考虑到通过添加少量的Co，Ni和/或Fe，可以防止铜消耗，同时控制液相线温度的升高。

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