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    • 4. 发明公开
    • Ag-Bi계 합금 스퍼터링 타겟 및 그의 제조방법
    • 用于通过溅射形成Ag-Bi基合金薄膜的Ag-Bi基合金溅射靶,用于制造目标的方法,以及使用目标生产Ag-Bi基合金薄膜的方法
    • KR1020040099146A
    • 2004-11-26
    • KR1020040034124
    • 2004-05-14
    • 가부시키가이샤 고베 세이코쇼가부시키가이샤 코베루코 카겐
    • 다카기가츠토시나카이주니치다우치유우키사토도시키마츠자키히토시후지이히데오
    • C23C14/34
    • C22C5/06C23C14/3414
    • PURPOSE: To provide an Ag-Bi base alloy sputtering target capable of suppressing substantial deterioration of yield of a Bi amount in thin film(=Bi amount in the thin film/Bi amount in the sputtering target), a method for producing the target, and a method for producing an Ag-Bi base alloy thin film by using the target. CONSTITUTION: The Ag-Bi base alloy sputtering target is characterized in that an average intensity of precipitated Bi represented by the following mathematical expression 1 is 0.01 atom%¬-1 or less when measuring peak intensities of X ray diffraction of Ag(111) plane, peak intensities of X ray diffraction of Ag(200) plane, peak intensities of X ray diffraction of Ag(220) plane, peak intensities of X ray diffraction of Ag(311) plane and peak intensities of X ray diffraction of Bi(102) plane according to an X ray diffraction method by selecting a plural spots on a sputtering surface: £Mathematical Expression 1|intensity of precipitated Bi=£IBi(102)/(IAg(111)+IAg(200)+IAg(220)+IAg(311))|/£Bi|where IBi(102) indicates a peak intensity of X ray diffraction (unit is cps(counts per second)) of Bi(102) plane, IAg(111) indicates a peak intensity of X ray diffraction of Ag(111) plane, IAg(200) indicates a peak intensity of X ray diffraction of Ag(200) plane, IAg(220) indicates a peak intensity of X ray diffraction of Ag(220) plane, IAg(311) indicates a peak intensity of X ray diffraction of Ag(311) plane, and £Bi| indicates Bi content (unit is atom%) of the Ag-Bi base alloy sputtering target.
    • 目的:提供能够抑制薄膜中Bi量产生显着劣化的Ag-Bi基合金溅射靶(=薄膜中的Bi量/溅射靶中的Bi量),制造靶的方法, 以及通过使用该靶来制造Ag-Bi基合金薄膜的方法。 构成:Ag-Bi基合金溅射靶的特征在于,当测量Ag(111)面的X射线衍射的峰强度时,由以下数学式1表示的沉淀Bi的平均强度为0.01原子%-1以下 ,Ag(200)面的X射线衍射的峰强度,Ag(220)面的X射线衍射的峰强度,Ag(311)面的X射线衍射的峰强度和Bi(102)的X射线衍射的峰值强度 )平面,根据X射线衍射法,通过选择溅射表面上的多个点:£数学表达式1 |沉淀Bi的强度= IBi(102)/(IAg(111)+ IAg(200)+ IAg(220) + IAg(311))| /£Bi |其中IBi(102)表示Bi(102)面的X射线衍射峰值强度(单位为cps(计数/秒)),IAg(111) Ag(111)面的X射线衍射,IAg(200)表示Ag(200)面的X射线衍射峰强度,IAg(220)表示峰强度 Ag(220)面的X射线衍射的y,IAg(311)表示Ag(311)面的X射线衍射的峰强度,并且£Bi | 表示Ag-Bi基合金溅射靶的Bi含量(单位为原子%)。