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1. 发明公开

KR1020140041104A 인쇄회로기판의 외층 동박 제거방법 및 외층 동박 제거장치 无效
标题翻译：去除PCB铜箔和铜箔外层去除装置的外层
公开(公告)号：KR1020140041104A
公开(公告)日：2014-04-04
申请号：KR1020120108064
申请日：2012-09-27
申请人： (주)우리엔지니어링 , 삼성전기주식회사
发明人： 양용철 , 김경태 , 강민기
IPC分类号： B65H41/00 , H05K3/04
摘要： The present invention relates to a method for removing a copper outer layer of a printed circuit board (PCB) and an apparatus for removing the copper outer layer. More specifically, regarding a PCB comprising a flexible portion and a rigid portion (RF PCB), the flat side and the basal side of a bent formed on the flexible portion are respectively pressed with a press, and, when a copper scrap is generated by a crack on a copper outer layer, on the bent of the RF PCB, a high-pressure air is jet, using an air nozzle, onto the surface of the RF PCB where the copper scrap is generated, thereby removing the copper scrap from the RF PCB. [Reference numerals] (AA) Pressing; (BB) Supply; (CC,EE) Detachment; (DD) Reversal; (FF) Discharge; (GG) Inspection; (HH) faulty discharge
摘要翻译：本发明涉及一种去除印刷电路板（PCB）的铜外层的方法和一种去除铜外层的装置。更具体地说，关于包括柔性部分和刚性部分（RF PCB）的PCB，分别在压制机上按压形成在柔性部分上的弯曲部的平坦侧面和基底侧，并且当通过在铜外层上的裂纹，在RF PCB的弯曲处，使用空气喷嘴将高压空气喷射到RF PCB的产生铜屑的表面上，从而从铜射频PCB。（附图标记）（AA）按压; （BB）供应; （CC，EE）分离; （DD）冲销; （FF）放电; （GG）检验; （HH）故障放电

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