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    • 7. 发明公开
    • 전자부품용 점착제 조성물
    • 电子元件的压敏粘合剂组合物
    • KR1020120019105A
    • 2012-03-06
    • KR1020100082256
    • 2010-08-25
    • (주)엘지하우시스
    • 임윤미임동훈박세희
    • C09J133/04C09J7/02C09J11/02H01L21/58
    • C09J133/04C09J7/22C09J7/30C09J7/385C09J11/02C09J2201/606C09J2203/326C09J2205/102H01L21/6836H01L2221/68327
    • PURPOSE: An adhesive composition for electronic components is provided to satisfy the penetrability of fine dusts between components and an adhesive sheet, and to have anti excitation/delamination/kink abilities under the severe condition of high temperatures and high humidity, and to restrain the generation of bubbles. CONSTITUTION: An adhesive composition for electronic components comprises an adhesive polymer of a monomer mixture, and the monomer mixture comprises 55-70 parts by weight of a (meth)acrylic acid ester based monomer having a C5-12 alkyl group, 25-35 parts by weight of a methyl(meth)acrylate monomer, and 5-10 parts by weight of a crosslinkable monomer. The (meth)acrylic acid ester based monomer having a C5-12 alkyl group is ethylhexl (meth)acrylate. The crosslinkable monomer is a monomer including a carboxylic group. The weight average molecular weight of the polymer is 1,000,000 - 1,700,000.
    • 目的:提供一种用于电子部件的粘合剂组合物,以满足组分和粘合片之间的细粉尘的渗透性,并且在高温高湿的严酷条件下具有抗激发/分层/扭结能力,并且抑制发生 的气泡。 构成:用于电子部件的粘合剂组合物包含单体混合物的粘合剂聚合物,单体混合物包含55-70重量份具有C5-12烷基的(甲基)丙烯酸酯基单体,25-35份 的(甲基)丙烯酸甲酯单体和5-10重量份的可交联单体。 具有C5-12烷基的(甲基)丙烯酸酯系单体是乙基己基(甲基)丙烯酸酯。 可交联单体是包含羧基的单体。 聚合物的重均分子量为1,000,000至1,700,000。