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1. 发明授权

KR100418241B1 멤즈소자의 가역적 밀봉 패키지 방법 失效
标题翻译： 멤즈소자의가역적밀봉패키지방법
公开(公告)号：KR100418241B1
公开(公告)日：2004-02-11
申请号：KR1020010015080
申请日：2001-03-23
申请人： 주영창
发明人： 주영창 , 민홍석
IPC分类号： H01L21/20
摘要： PURPOSE: A method for reversible sealing package of an MEMS(Micro Electro Mechanical System) device is provided to adhere easily a glass to a substrate by using a low temperature direct adhesion method. CONSTITUTION: A deep silicon etching process is performed on an upper portion of a 4 inch double side polished silicon substrate. A preparation process is performed to adhere a glass to the 4 inch double side polished silicon substrate. A cleaning process is performed during 10 minutes by using an SPM(Sulfuric-Perooxide-Mixture) rinse solution. The cleaning process is performed during 20 minutes by using RCA rinsing solution of 80 degrees centigrade. A rinsing process is performed by using deionized water. The adhering state between the glass and the silicon substrate is improved by performing a thermal process. The glass is separated from the silicon substrate.
摘要翻译：目的：提供一种用于MEMS（微机电系统）装置的可逆密封封装的方法，以通过使用低温直接粘合方法将玻璃容易地粘附到基板。构成：在4英寸双面抛光硅基片的上部进行深硅蚀刻工艺。执行准备过程以将玻璃粘附到4英寸双面抛光硅基板。通过使用SPM（硫酸 - 过氧化物混合物）冲洗溶液在10分钟内执行清洁过程。通过使用80摄氏度的RCA漂洗溶液在20分钟内执行清洁过程。漂洗过程通过使用去离子水来进行。通过执行热处理来改善玻璃和硅基板之间的粘附状态。玻璃与硅基板分离。

2. 发明公开

KR1020020074963A 멤즈소자의 가역적 밀봉 패키지 방법 失效
标题翻译：用于MEMS器件的可密封封装的方法
公开(公告)号：KR1020020074963A
公开(公告)日：2002-10-04
申请号：KR1020010015080
申请日：2001-03-23
申请人： 주영창
发明人： 주영창 , 민홍석
IPC分类号： H01L21/20
摘要： PURPOSE: A method for reversible sealing package of an MEMS(Micro Electro Mechanical System) device is provided to adhere easily a glass to a substrate by using a low temperature direct adhesion method. CONSTITUTION: A deep silicon etching process is performed on an upper portion of a 4 inch double side polished silicon substrate. A preparation process is performed to adhere a glass to the 4 inch double side polished silicon substrate. A cleaning process is performed during 10 minutes by using an SPM(Sulfuric-Perooxide-Mixture) rinse solution. The cleaning process is performed during 20 minutes by using RCA rinsing solution of 80 degrees centigrade. A rinsing process is performed by using deionized water. The adhering state between the glass and the silicon substrate is improved by performing a thermal process. The glass is separated from the silicon substrate.
摘要翻译：目的：提供一种用于MEMS（微机电系统）装置的可逆密封封装的方法，通过使用低温直接粘合方法将玻璃容易地粘附到基底上。构成：在4英寸双面抛光硅衬底的上部进行深硅蚀刻工艺。执行制备工艺以将玻璃粘附到4英寸双面抛光硅衬底上。使用SPM（硫酸 - 过氧化物 - 混合物）漂洗溶液在10分钟内进行清洁过程。通过使用80摄氏度的RCA冲洗溶液在20分钟内进行清洁处理。通过使用去离子水进行漂洗过程。通过进行热处理来提高玻璃与硅衬底之间的粘合状态。玻璃与硅衬底分离。

3. 发明授权

KR100386954B1 유리와 실리콘 기판의 저온 직접접합방법 失效
标题翻译： 유리와실리콘기판의저온직접접합방법
公开(公告)号：KR100386954B1
公开(公告)日：2003-06-09
申请号：KR1020000068485
申请日：2000-11-17
申请人： 주영창
发明人： 주영창 , 민홍석 , 송오성
IPC分类号： H01L21/02
摘要： PURPOSE: A method for directly bonding glass and a silicon substrate at a low temperature is provided to improve efficiency of an anodic bonding process and to stably maintain a characteristic of a substrate. CONSTITUTION: Glass having a mirror surface and a single crystalline silicon are cleaned by using the first cleaning solution. The glass and the silicon are rinsed by using deionized water and are dried. After the glass and the silicon are cleaned by using the second cleaning solution, the glass and the silicon are rinsed by using deionized water and are dried. The mirror surface of the glass is directly bonded to the silicon in a clean room of class 100 or more. A heat treatment process is performed regarding the bonded glass and silicon substrate.
摘要翻译：目的：提供一种在低温下直接接合玻璃和硅衬底的方法，以提高阳极接合工艺的效率并稳定地保持衬底的特性。组成：使用第一种清洁溶液清洁具有镜面和单晶硅的玻璃。使用去离子水冲洗玻璃和硅并干燥。在通过使用第二清洁溶液清洁玻璃和硅之后，使用去离子水冲洗玻璃和硅并将其干燥。玻璃的镜面在100级以上的洁净室内直接与硅结合。对粘合的玻璃和硅基板执行热处理工艺。

4. 发明公开

KR1020020038324A 유리와 실리콘 기판의 저온 직접접합방법 失效
标题翻译：在低温下直接粘结玻璃和硅基材的方法
公开(公告)号：KR1020020038324A
公开(公告)日：2002-05-23
申请号：KR1020000068485
申请日：2000-11-17
申请人： 주영창
发明人： 주영창 , 민홍석 , 송오성
IPC分类号： H01L21/02
摘要： PURPOSE: A method for directly bonding glass and a silicon substrate at a low temperature is provided to improve efficiency of an anodic bonding process and to stably maintain a characteristic of a substrate. CONSTITUTION: Glass having a mirror surface and a single crystalline silicon are cleaned by using the first cleaning solution. The glass and the silicon are rinsed by using deionized water and are dried. After the glass and the silicon are cleaned by using the second cleaning solution, the glass and the silicon are rinsed by using deionized water and are dried. The mirror surface of the glass is directly bonded to the silicon in a clean room of class 100 or more. A heat treatment process is performed regarding the bonded glass and silicon substrate.
摘要翻译：目的：提供一种在低温下直接接合玻璃和硅衬底的方法，以提高阳极结合工艺的效率并稳定地保持衬底的特性。构成：通过使用第一清洁溶液清洁具有镜面和单晶硅的玻璃。玻璃和硅通过使用去离子水冲洗并干燥。在通过使用第二清洁溶液清洁玻璃和硅之后，通过使用去离子水冲洗玻璃和硅并干燥。在100级以上的洁净室内，玻璃的镜面直接与硅结合。对粘结玻璃和硅基板进行热处理。

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