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    • 1. 发明公开
    • 휴대용 전자장치의 커버 제조방법
    • 便携式电子设备封装的制造方法
    • KR1020090074448A
    • 2009-07-07
    • KR1020080000235
    • 2008-01-02
    • 주식회사 케이스랩상원아이티 주식회사부림케미칼 주식회사
    • 김지웅박찬우백윤현
    • B29C45/14B29C45/00B21D53/00
    • B29C45/1418B29C45/14631B29C66/02245B29C71/02B29C2045/14868B29C2059/027H05K5/03
    • A manufacturing method of a cover for portable electronic device is provided to improve dimension precision of injection-molded material to pressed materials by holding the pressed materials firmly in the injection mold. A manufacturing method of a cover for portable electronic device comprises a step of molding a pressed material(120) through a press die, a step of coating an adhesive onto one side of the pressed material, a step of providing a protection member(F) inside an injection mold(200), a step of forming a cover by inserting the pressed material inside the injection mold and molding the injection molded material on one side of the pressed material, a step of polishing the surface of the pressed material in the cover, and a step of treating the polished surface of the pressed material through one of plating, coating, and anodizing processes.
    • 提供一种用于便携式电子设备的盖的制造方法,以通过将压制材料牢固地保持在注射模具中来提高注射成型材料对压制材料的尺寸精度。 一种用于便携式电子设备的盖的制造方法包括通过压模成型压制材料(120)的步骤,将粘合剂涂覆在压制材料的一侧上的步骤,提供保护构件(F)的步骤, 在注射模具(200)内部,通过将压制材料插入注射模具内并将注射成型材料成型在压制材料的一侧上来形成盖子的步骤,在盖子的表面上抛光被压制材料的步骤 以及通过电镀,涂覆和阳极氧化处理之一来处理被压制材料的抛光表面的步骤。