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1. 发明授权

KR100459794B1 열계면체와 사용방법 失效
标题翻译：与朋友分享
公开(公告)号：KR100459794B1
公开(公告)日：2004-12-03
申请号：KR1020000064503
申请日：2000-11-01
申请人： 더맥스 인터내셔날, 엘.엘.씨
发明人： 유승문 , 김충언
IPC分类号： H01L35/34 , H01L23/373
CPC分类号： B23K35/26 , F28F2013/006 , H01L23/3736 , H01L23/3738 , H01L2924/0002 , H01L2924/3011 , Y10T428/1419 , Y10T428/1452 , H01L2924/00
摘要： A thermal joint for facilitating heat transfer between two components is described. The thermal joint is formed from an alloy of at least two constituents. The alloy has a liquid temperature and a solid temperature. When the operating temperature falls between the liquid temperature and the solid temperature, the alloy has at least one liquid phase which is in substantial equilibrium with at least one solid phase. The thermal joint is used between a heat-generating component, such as a semiconducting device, and a heat-dissipating component, such as a heat sink. Such thermal joint substantially reduces the thermal resistance between the two components.
摘要翻译：描述了用于促进两个部件之间传热的热接头。热接头由至少两种成分的合金形成。该合金具有液体温度和固体温度。当操作温度落入液体温度和固体温度之间时，合金具有至少一个与至少一个固相基本平衡的液相。热接头用在诸如半导体器件之类的发热部件和诸如散热器之类的散热部件之间。这种热接头实质上减少了两个部件之间的热阻。

2. 发明公开

KR1020010070181A 열계면체와 사용방법 失效
标题翻译：热接头及其使用方法
公开(公告)号：KR1020010070181A
公开(公告)日：2001-07-25
申请号：KR1020000064503
申请日：2000-11-01
申请人： 더맥스 인터내셔날, 엘.엘.씨
发明人： 유승문 , 김충언
IPC分类号： H01L35/34 , H01L23/373
CPC分类号： B23K35/26 , F28F2013/006 , H01L23/3736 , H01L23/3738 , H01L2924/0002 , H01L2924/3011 , Y10T428/1419 , Y10T428/1452 , H01L2924/00
摘要： PURPOSE: To provide a thermal joint for conducting heat from one object to the other object, and a method for conducting heat between a heat generating device like a semiconductor device and a heat eliminating device like a heat sink. CONSTITUTION: This thermal joint is constituted by including alloy composed of at least two constituent elements including at least one solid phase and at least one liquid phase which is in an equilibrium state with the solid phase. The alloy has a temperature of performance(TP), a temperature of liquid(TL) and a temperature of solid(TS). The temperature of performance(TP) exists between the temperature of liquid(TL) and the temperature of solid(TS). As a result, the thermal joint facilitating thermal conduction is provided.
摘要翻译：目的：提供一种用于将热量从一个物体传导到另一个物体的热接头，以及在诸如半导体器件的发热器件和散热器之类的散热装置之间传导热量的方法。构成：该热接头由包含至少两种构成元素的合金构成，包括至少一个固相和至少一个与固相处于平衡状态的液相。该合金具有性能（TP），液体温度（TL）和固体温度（TS））。性能温度（TP）存在于液体温度（TL）和固体温度（TS）之间。结果，提供了促进热传导的热接头。

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