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    • 88. 发明公开
    • 알콕시실릴기를 갖는 에폭시 화합물, 무기입자를 포함하는 조성물, 경화물, 이의 용도 및 알콕시실릴기를 갖는 에폭시 화합물의 제조방법
    • 包含具有烷氧基的环氧化合物和无机颗粒的组合物和固化产品的使用及其制备具有烷氧基的环氧化合物的方法
    • KR1020130135733A
    • 2013-12-11
    • KR1020130011711
    • 2013-02-01
    • 한국생산기술연구원
    • 전현애박수진박숙연김윤주탁상용박성환강경남
    • C07F7/08C07D303/12C07D407/12
    • C08K5/549C07C37/48C07C41/06C07D301/00C07D303/12C07D303/30C07D407/12C07F7/1836C07F7/1876C08K3/22C08K3/28C08K3/36C08K2003/2241C08K2003/2244
    • The present invention relates to a composition with epoxy compounds having alkoxysilyl-based epoxy compounds and inorganic particles which exhibits excellent heat-resistance properties in a composite and, specifically, low coefficient of thermal expansion (CTE) and a high glass transition temperature or a high Tg lease and does not require silane coupling agents, a cured product thereof and use thereof. The present invention provides: the alkoxysilyl-based epoxy compounds and inorganic particles: the epoxy composition comprising epoxy compounds, organic particles and hardening agents; the cured product thereof; and the use thereof. The composite of the composition with the alkoxysilyl-based epoxy compounds and inorganic particles according to the present invention exhibits the improved efficiency of chemical bond due to the chemical bond between a filler and a alkoxysilyl group among the alkoxysilyl-based epoxy compounds and epoxy composite formation by the chemical bond between the alkoxysilyl groups of the alkoxysilyl-based epoxy compounds, thereby showing excellent heat-resistance properties, in other words, the low CTE and high glass transition temperature or high Tg lease. [Reference numerals] (AA) Dimensional change (쨉m);(BB) Comparative example 1;(CC) Example 2;(DD) Temperature (°C)
    • 本发明涉及具有烷氧基甲硅烷基的环氧化合物的环氧化合物和在复合材料中表现出优异的耐热性的无机颗粒的组合物,具体地说,低热膨胀系数(CTE)和高玻璃化转变温度或高 Tg租赁,不需要硅烷偶联剂,其固化产物和其用途。 本发明提供:所述烷氧基甲硅烷基系环氧化合物和无机颗粒:包含环氧化合物,有机颗粒和硬化剂的环氧组合物; 其固化产物; 及其用途。 根据本发明的组合物与烷氧基甲硅烷基系环氧化合物和无机颗粒的复合物表现出由于烷氧基甲硅烷基系环氧化合物与环氧复合体形成中的填料与烷氧基甲硅烷基之间的化学键而引起的化学键的效率提高 通过烷氧基甲硅烷基系环氧化合物的烷氧基甲硅烷基之间的化学键,从而表现出优异的耐热性,换句话说,低CTE和高玻璃化转变温度或高Tg出租。 (AA)尺寸变化(쨉m);(BB)比较例1;(CC)实施例2;(DD)温度(℃)