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    • 63. 发明公开
    • 레이저 절단장치 및 방법
    • 激光切割设备和方法
    • KR1020070030112A
    • 2007-03-15
    • KR1020060038709
    • 2006-04-28
    • 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드
    • 푸,첸-츄후앙,춘-카이첸,시엔-탕쳉,카이-젠창,딩-헝
    • B23K26/38
    • Laser cutting apparatus and method capable of reducing cutting time and improving productivity are provided. A laser cutting apparatus for cutting an easily brittle substrate comprises: a first scriber(11) and a second scriber(12) for making a predicted cutting line on a substrate(13); a laser system(10) for heating the substrate; and a first coolant(111) and a second coolant(122) for cooling the substrate, wherein after the first scriber, the laser system and the first coolant cut the substrate along a first cutting direction, the second scriber, the laser system and the second coolant cut the substrate along a second cutting direction different from the first cutting direction. The first cutting direction and the second cutting direction are oppositely to each other. The second scriber, the first coolant, the laser system, the second coolant and the first scriber are sequentially disposed along the first cutting direction. The second scriber, the first coolant, the laser system, the second coolant and the first scriber are straightly arranged. The first coolant, the laser system and the first scriber are straightly arranged when cutting the substrate along the first cutting direction. The second coolant, the laser system and the second scriber are straightly arranged when cutting the substrate along the second cutting direction.
    • 提供了能够减少切割时间并提高生产率的激光切割装置和方法。 一种用于切割容易脆性基底的激光切割装置,包括:用于在衬底(13)上形成预测切割线的第一划线器(11)和第二划线器(12)。 用于加热衬底的激光系统(10); 以及用于冷却所述基板的第一冷却剂(111)和第二冷却剂(122),其中在所述第一划线器之后,所述激光系统和所述第一冷却剂沿着第一切割方向切割所述基板,所述第二划片机,所述激光系统和 第二冷却剂沿着与第一切割方向不同的第二切割方向切割基板。 第一切割方向和第二切割方向彼此相反。 第二划片机,第一冷却剂,激光系统,第二冷却剂和第一划片机沿着第一切割方向依次设置。 第二划线机,第一冷却剂,激光系统,第二冷却剂和第一划线机被直列。 当沿着第一切割方向切割基板时,第一冷却剂,激光系统和第一划线机被直线地布置。 当沿着第二切割方向切割基板时,第二冷却剂,激光系统和第二划线机被直线地布置。
    • 64. 发明公开
    • 레이저 절단방법
    • 激光切割方法
    • KR1020070030107A
    • 2007-03-15
    • KR1020060004902
    • 2006-01-17
    • 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드
    • 푸,첸-츄후앙,춘-카이첸,시엔-탕쳉,카이-젠창,딩-헝
    • B23K26/042B23K26/38
    • A laser cutting method capable of reducing the cutting time accordingly by increasing the cutting speed while reducing the size of a substrate to be cut is provided. A laser cutting method comprises: a first step of dividing a substrate at a first cutting speed; a second step of dividing the substrate at a second cutting speed faster than the first cutting speed after cutting the substrate in the first step; and a third step of dividing the substrate at a third cutting speed faster than the second cutting speed after cutting the substrate in the second step. When the substrate is cut continuously, and a post-cutting speed is faster than a pre-cutting speed. The first step is performed by dividing the substrate into two equal parts of the substrate. Each of the two parts of the substrate is divided into different two parts of the substrate at the second cutting speed in the second step. The substrate is divided into 1/(2^n) in the respective corresponding steps, where n is 1, 2, 3, ..., n.
    • 提供了一种激光切割方法,其能够通过在减小要切割的基板的尺寸的同时提高切割速度来相应地减小切割时间。 一种激光切割方法包括:以第一切割速度分割基板的第一步骤; 第二步骤,在第一步骤中切割基板之后,以比第一切割速度快的第二切割速度分割基板; 以及第三步骤,在第二步骤中切割基板之后,以比第二切割速度快的第三切割速度分割基板。 当基板被连续切割,并且后切割速度比预切割速度快。 通过将衬底分成两个相等的衬底部分来执行第一步骤。 在第二步骤中,基板的两个部分以第二切割速度被分成基板的不同的两个部分。 在相应的相应步骤中,衬底分为1 /(2 ^ n),其中n为1,2,3 ...,n。
    • 66. 发明公开
    • 조명장치
    • 照明设备
    • KR1020130069069A
    • 2013-06-26
    • KR1020110136599
    • 2011-12-16
    • 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드
    • 황,신-페이황,쩡-제첸,핑-유
    • F21V29/00F21Y101/02
    • F21V29/70F21K9/20F21V29/503F21Y2101/00
    • PURPOSE: A lighting device is provided to alternately arrange multiple heat radiating tubes having mutually different heights at certain distances, thereby equalizing the heat radiation efficiencies of the tubes inside and outside the device. CONSTITUTION: A lighting device(10) includes a housing(12), an LED(Light Emitting Diode) base, and a heat radiating device(16). The housing has a lighting emitting surface(122) and a heat radiating surface(124) which faces each other. The LED base has an electric circuit board and multiple LED chips. The electric circuit board is installed inside the housing so that the electric circuit board is adjacent to the heat radiating surface. The LED chip on the electric circuit board emits a light toward the light emitting surface. The heat radiating device has multiple heat radiating tubes, which have mutually different heights and are alternately arranged on the heat radiating surface.
    • 目的:提供一种照明装置,以一定距离交替布置具有相互不同高度的多个散热管,从而均衡装置内外的管的散热效率。 构成:照明装置(10)包括壳体(12),LED(发光二极管)基座和散热装置(16)。 壳体具有彼此面对的发光面(122)和散热面(124)。 LED基座具有电路板和多个LED芯片。 电路板安装在壳体内部,使得电路板与散热面相邻。 电路板上的LED芯片向发光表面发射光。 散热装置具有多个具有相互不同的高度的散热管,并且交替地布置在散热表面上。
    • 67. 发明公开
    • 램프
    • KR1020130051762A
    • 2013-05-21
    • KR1020110117095
    • 2011-11-10
    • 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드
    • 양,숭샹황,요쮠
    • F21V29/00F21V17/00F21Y101/02
    • F21V29/767F21K9/235F21K9/237F21Y2101/00
    • PURPOSE: A lamp is provided to increase the heat radiation area of each heat radiation pin by forming each of the heat radiation pin in a curved shape. CONSTITUTION: A heat radiation member(20) is combined to an electrical connection member(10). The heat radiation member comprises a first surface, a second surface, a substrate(21) which have a through-hole(213), a partition member(23), and a plurality of heat radiation pin(24). A plurality of heat radiation pin is protruded to an outside from an outer periphery of the partition member to have a curved shape. At least one LED element(30) is mounted on a first surface of the substrate. A driving circuit module(50) is electrically connected to the LED element and the electrical connection member.
    • 目的:提供灯,以通过将每个散热销形成为弯曲形状来增加每个散热销的散热面积。 构成:散热构件(20)组合到电连接构件(10)。 散热构件包括第一表面,第二表面,具有通孔(213)的基板(21),分隔构件(23)和多个散热销(24)。 多个散热针从分隔构件的外周向外侧突出形成弯曲形状。 至少一个LED元件(30)安装在基板的第一表面上。 驱动电路模块(50)电连接到LED元件和电连接构件。