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    • 36. 发明公开
    • 탭 공정
    • 胶带自动粘接工艺
    • KR1020080059797A
    • 2008-07-01
    • KR1020060133521
    • 2006-12-26
    • 엘지디스플레이 주식회사
    • 박용인이경묵강수혁김성환
    • G02F1/1345
    • G02F1/13452B23K20/021G02F1/13306H05K3/32
    • A tap process is provided to achieve reliable one-to-one contact without misalign between pads of an LC panel configured with a plastic substrate and contact pads of a TCP. A tap process comprises the following steps of: preparing an LC(Liquid Crystal) panel having plural first pad and preparing a PCB(Printed Circuit Board) having plural second pads; preparing a TCP(Tape Carrier Package) configured with plural first and second contact pads respectively contacted with the first and second pads of the LC panel and the PCB; thermally compressing one end of the TCP configured with the first contact pad contacted with the LC panel(st1); attaching an ACF(Anisotropic Conductive Film) onto the first and second pads of the LC panel and the PCB(st2); preliminarily compressing the TCP onto the first and second pads attached with the ACF(st3); and primarily compressing the TCP(st4).
    • 提供了一种分接过程以实现可靠的一对一接触,而不会在配置有塑料基板的LC面板的焊盘和TCP的接触焊盘之间发生不对准。 抽头方法包括以下步骤:制备具有多个第一焊盘并制备具有多个第二焊盘的PCB(印刷电路板)的LC(液晶)面板; 制备配置有分别与LC面板和PCB的第一和第二焊盘接触的多个第一和第二接触焊盘的TCP(磁带载体封装); 热压缩由与LC面板(st1)接触的第一接触垫构成的TCP的一端; 将ACF(各向异性导电膜)附接到LC面板和PCB(st2)的第一和第二垫上; 预先将TCP压缩到与ACF(st3)连接的第一和第二焊盘上; 并主要压缩TCP(st4)。
    • 37. 发明公开
    • 타겟 및 백킹 플레이트 조립체를 위한 시스템들 및 방법들
    • 目标和背板组件的系统和方法
    • KR1020050053654A
    • 2005-06-08
    • KR1020057004269
    • 2003-08-26
    • 토소우 에스엠디, 인크
    • 이바노브유진와이.
    • C23C14/34B23K28/00
    • C23C14/3407B23K20/021B23K20/023
    • A target (1) and backing plate (10) assembly and method of making the same. The target (1) and backing plate (10) assembly provides a mechanical interlock between the target (1) and backing plate (10) in addition to diffusion bonding between dissimilar materials comprising the target (1) and backing plate (10). An interlayer may also be used between the target (1) and backing plate (10). A plurality of ridges, or other salient surface features (3,4) on one of the target (1) and backing plate (10) are joined to corresponding members or channels (13, 14) on the other of the target and backing plate. The dissimilar materials of the target (1) and backing plate (10) fill negative angled cavities(13, 14) formed by the plurality of ridges (3, 4) and corresponding channels or members (13, 14) of the target (1) and backing plate (10) to accommodate the diffusion bonded dissimilar materials. A target (1) and backing plate (10) assembly with increased strength results.
    • 目标(1)和背板(10)组件及其制造方法。 除了包括目标(1)和背板(10)的不同材料之间的扩散接合之外,目标(1)和背板(10)组件还在目标(1)和背板(10)之间提供机械互锁。 也可以在靶(1)和背板(10)之间使用中间层。 目标(1)和背板(10)中的一个上的多个脊或其他突出表面特征(3,4)被连接到目标和背板的另一个上的对应的构件或通道(13,14) 。 目标(1)和背板(10)的不同材料填充由多个脊(3,4)和目标(1)的对应的通道或构件(13,14)形成的负斜面空腔(13,14) )和背板(10)以适应扩散接合的不同材料。 具有增加的强度结果的目标(1)和背板(10)组件。